MTFDCAE002SAF-1D1 - Micron Technology, Inc.

Products and specifications discussed herein are subject to change by Micron without notice.

Embedded USB Mass Storage Drive (e130)

Features

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RealSSD™ Embedded USB

Mass Storage Drive (e130)

MTFDCAE001SAF, MTFDCAE002SAF,

MTFDCAE004SAF, MTFDCAE008SAF

Features

•Micron

® NAND Flash

• Interface: Universal Serial Bus (USB) Specification,

Revision 2.0

•USB support

–USB Specification, Revisions 2.0, 1.1

–USB Mass Storage Class Specification, Revision 1.0

•Performance

–Sequential READ: 33 MB/s1

–Sequential WRITE: 22 MB/s1

• Reliability: 4 million operating hours mean time

between failures (MTBF)

• Endurance: useful operating life of at least 5 years

under the following conditions:

–8760 power-on hours per year

–Active 100% of power-on hours

–Typical operating conditio ns2

•1GB module—8 GB/day

• 2GB module—16 GB/day

• 4GB module—32 GB/day

• 8GB module—64 GB/day

• S tatic and dynamic wear-leveling

• 8-symbol error correction code (ECC)

• Password protection

•Reliability reporting

Options

• Capacity (unformatted): 1GB, 2GB, 4GB, or 8GB3

• Form factor

–Standard (36.9mm x 26.6mm x 9.6mm)

• Voltage: 5V ±5%

• Operating temper ature

–Commercial (0°C to +70°C)

–Industrial (–40°C to +8 5°C)

Notes: 1. Typical transfer rate measured with

H2BENCH 3.6.

2. Assumes that 70% of total usable drive

capacity contains static files.

3. 1GB = 1 billion bytes; formatted capaci ty is

less.

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Embedded USB Mass Storage Drive (e130)

Part Numbering Information

Micron RealSSD embedded USB drives are available in sever al confi gur ations and densi-

ties. Visit micron.com for a list of valid part numbers.

Figure 1: Part Number Chart

MT FD C AE 002 S AF -1 B 1 IT ES

Micron Technology

Product Family

FD = Flash drive

Drive Interface

C = USB 2.0

Drive Form Factor

AE = Embedded USB: 36.9mm x 26.6mm x 9.6mm

Drive Density

001 = 1GB

002 = 2GB

004 = 4GB

008 = 8GB

NAND Flash Type

S = SLC

Product Family

AA = Option A

AB = Option B

AC = Option C

AD = Option D

AE = Option E

AF = Option F

Production Status

Blank = Production

ES = Engineering sample

MS = Mechanical sample

Operating Temperature Range

Blank = Commercial (0°C to +70°C)

IT = Industrial (–40°C to +85°C)

Revision

1 = 1st generation

2 = 2nd generation

3 = 3rd generation

NAND Component

B = 8Gb; x8; 3.3V

C = 16Gb; x8; 3.3V

D = 4Gb; x8; 3.3V

Firmware Revision

1 = 1st generation

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Embedded USB Mass Storage Drive (e130)

General Description

Micron’s RealSSD™ embedded universal serial bus (USB) mass storage drives provide

1GB, 2GB, 4GB, or 8GB of USB 2.0-compatible memory storage in a small form factor.

The embedded USB drive is an ideal solution for applications that require low cost and

high rel iab ility. Typical applications include PC caching and boot drives for embedded

computing, server, and networking systems.

High performance, reliability, and easy implementation make Mi cron’s RealSSD

embedded USBs an ideal storage solution. To consistently deliver the best possible

performance, the embedded USB uses only SLC NAND Flash, and all densities use two

x8 NAND channels to the controller. In addition to being fast, SLC NAND Flash offers

solid r eliabili ty, coupled with ECC and w ear -leveli ng. The USB system interface is widely

available in many system desi gns and is easy to implement, enabl ing rapid time to

market.

The embedded USB consists of two T SOP-packaged Micron NAND Flash components , a

USB controller, and a 10-pin USB connector on a PCB. Different densities are available

depending on the number of die in each package and the density of each NAND Flash

die (see Figure2). The drive operates at 5V ±5%. It uses industry-standard 10-pin

connectors and supports USB S pecification, R evi sion 2.0. It is also backwar d compatible

with Revision 1.1 and can be used with operati n g systems that support USB Mass

Storage Class Specification, Revision 1.0.

Figure 2: Functional Block Diagram

USB

controller

Channel 1

Channel 2

NAND data bus

NAND command

USB

connector

Micron

NAND Flash

Micron

NAND Flash

USB protocol

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Embedded USB Mass Storage Drive (e130)

General Description

Figure 3: Pin Assignments: 2 x 5 Connector

Notes: 1. Diagram not to scale.

Table 1: Nominal Package Dimensions, Density, and Weight

Dimension Value Unit

Height 9.6 mm

Width 26.6 mm

Length 36.9 mm

Density 1, 2, 4, 8 GB

Maximum uni t weight 4.5 g

Table 2: Signal/Pin Descriptions

Symbol Type Function

USB data (+),

USB data (–) I/O Data inputs/outputs: The bidirectional I/Os transfer address, data, and instruction

information. Data is output only during READ operations; at other times the I/Os are inputs.

Vcc Supply Vcc power supply pin.

Vss Supply Vss ground connection.

NC – No connect: NC pins are not internal ly connected. These pins can be driven or left floating .

NC GND USB USB Vcc

data data (+5V)

(+) (–)

NC NC NC NC NC

10 8 6 4 2

9 7 5 3 1

Top view (through PCB) Bottom view

Vcc USB USB GND NC

(+5V) data data

(–) (+)

NC NC NC NC NC

2 4 6 8 10

1 3 5 7 9

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Embedded USB Mass Storage Drive (e130)

Error Management

The RealSSD embedded USB incorporates advanced technology for defect and error

management. It uses various combinations of hardware-based error correction algo-

rithms and firmware-based wear-leveling algorithms.

Over the life of the drive, uncorr ectable errors may occur. An uncorrectable error is

defined as data that is reported as successfully programmed to the drive , but when it is

read out of the drive , the data differs from what was programmed. See Table 4 for the

uncorrectable bit error rate.

The mean time between failures (MTBF) can be predicted based on component reli-

ability data obtained by following the methods referenced in the Telecordia SR-332 reli-

ability prediction procedures for electronic equipment.

Notes: 1. BER is measured with a WRITE-to-READ ratio of 1:1.

Electrical Characteristics

S tresses greater than those listed may cause permanent damage to the drive. This is a

stress rating only, and functional operation of the drive at these or any other conditions

above those indicate d in the operational sections of this spe c ification is not implie d.

Exposure to absolute maximum rating conditions for extended periods may affect reli-

ability.

Table 3: System Reliabilit y

Density MTBF (Operating Hours)

1GB 4.8 million

2GB 4.7 million

4GB 4.4 million

8GB 4.0 million

Table 4: Uncorrectable Bit Error Rate

Uncorrectable Bit Error Rate (BER)1Operation

<1 bit error in 1015 bits READ

Table 5: Absolute Maximum Ratings

Parameter/Condition Symbol Min Max Unit

Vcc supply voltage Vcc –0.6 5.25 V

Table 6: DC and Operating Characteristics

Parameter Symbol Min Typ Max Unit Condition

Standby current Isb – 50 60 mA Vcc = 5V

Active current Icc1 – 100 120 mA Vcc = 5V

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Embedded USB Mass Storage Drive (e130)

Compliance

Compliance Micron RealSSD embedded USB drives comply with the following requirements:

• CE (Europe): EN55022, 2006 Class B and EN55024, 1998 + A1: 2001 + A2:2003

• FCC: CFR Title 47, Part 15, ICES-003, all Class B

• CSA (Canada): CSA 22.2 60950-1-07, 2nd Edition, 2007-03

• UL (US): approval to UL-60950-1, 2nd Edition, 2007-03-27, IEC 60 950- 1:2005, 2nd

Edition

• RoHS, “green” package

Mechanical Information

The 10-pin (2 x 5) female electrical connector has a height of 7.4mm, a pitch of 2.54 mm,

and supports the standard USB 2.0 interface. A mounting hole is also provided on the

PCB for a stable, r eliable connection to the mounting board.

The motherboard pin headers listed in Table 9 are compatible with Micron’s RealSSD

embedded USB drive s. Pin headers that are not listed may also be compatible.

Reference Documents

Reference documentation for the USB 2.0 standard (USB 2.0 specification, technical

documents, compliance tes t proce d ures, and other related documents) can be found at

www.usb.org/developers/docs.

Table 7: Recommended Operating Conditions

Parameter/Condition Symbol Min Typ Max Unit

Operating temperature Commercial TA0–70°C

Industrial –40 – 85 °C

Vcc supply voltage Vcc 4.75 5.00 5.25 V

Ground supply voltage Vss000V

Table 8: Shock and Vibration

Parameter/Condition Specification

Shock 500 G/1ms

Vibration 5–50Hz at 3.1G

Table 9: Compatible Pin Headers

Manufacturer Part Number Type

Pinrex 212-92-05GB01 SMT

210-92-05GB01 Straight

Amtek PHIFS25-205GB Press fit

PHIS25-205GB Straight

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

www.micron.com/productsupport Customer Comment Line: 800-932-4992

Micron, the Micron logo, and RealSSD are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although

considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.

Embedded USB Mass Storage Drive (e130)

Package Dimensions

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Package Dimensions

Figure 4: Embedded USB Package

Note: All dimensions are in millimeters.

3X Ø2.03 Ø3.2

2.87 4.9

2.95

2.45

1.2

7.4

1.2

9.6 ±0.1

2.54

20.7 ±0.25

36.9 ±0.25

31.16 ±0.25

25 ±0.25

27.5 ±0.25

26.6 ±0.25

20.7 ±0.25

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Embedded USB Mass Storage Drive (e130)

Revision History

Rev. F, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/09

• Updated “Compliance” section on page 6.

• Added Max values to Table 5.

Rev. E, Production. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10/08

• Re moved “Advance” from the document.

• “Features” on page 1: added “Password Protecti on” and “Reliability Reporting”.

• “Note” on page 1: removed Note 2 and adjusted references to the other notes.

Rev. D, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8/08

• Updated Table 8 on page 6. Removed “Operating” from both shock and vibration

under the Parameter/Condition column. Changed shock specification from 500

G/2ms to 500 G/1ms.

Rev. C, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/08

•Figure1: Part Number Chart on page2: Updated NAND component section.

Rev. B, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/08

• Updated part numbers.

• “Features” on page 1: Updated typical operating conditions, performance,

endurance.

• Figure1: Part Number Chart on page 2: Updated for part number change.

• “Mechanical Information” on page 6: Added second paragraph and Table 9.

Rev. A, Advance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12/07

•Initial release