CY74FCT16500T
CY74FCT162500T
2
Maximum Ratings[5, 6]
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Storage Temperature ....................... Com’l −55°C to +125°C
Ambient Temperature with
Power Applied....................................Com’l −55°C to +125°C
DC Input Voltage.................................................−0.5V to +7.0V
DC Output Voltage..............................................−0.5V to +7.0V
DC Output Current
(Maximum Sink Current /Pin)...........................−60 to +120 mA
Power Dissipation.......................................................... 1.0W
Static Discharge Voltage ...........................................>2001V
(per MIL- STD-883, Method 3015)
Pin Summary
Name Description
OEAB A- to-B Output En a ble Input
OEBA B-to-A Output Enable Input (Acti ve LOW)
LEAB A-to-B Latch Enable Input
LEBA B-to-A Latch Enable Input
CLKAB A-to-B Clock Input (Active LOW)
CLKBA B-to-A Clock Input (Active LOW)
AA-to -B Data Inputs or B-to-A Three-State Output s
BB-to -A Data Inputs or A-to-B Three-State Output s
Function Table[1, 2]
Inputs Outputs
OEAB LEAB CLKAB A B
L X X X Z
H H X L L
H H X H H
H L L L
H L H H
H L H X B[3]
H L L X B[4]
Operating Range
Range Ambient
Temperature VCC
Industrial −40°C to +85°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.[7] Max. Unit
VIH Input HIGH Voltage 2.0 V
VIL Input LO W Voltage 0.8 V
VHInput Hysteresis[8] 100 mV
VIK Input Clamp Diode Voltage VCC=Min., IIN=−18 m A −0.7 −1.2 V
IIH Input HIGH Current VCC=Max., VI=VCC ±1µA
IIL Input LO W Cur rent VCC=Max., VI=GND. ±1µA
IOZH High Impedance Output Current
(Three-State Output pi ns) VCC=Max., V OUT=2.7V ±1µA
IOZL High Impedance Output Current
(Three-State Output pi ns) VCC=Max., V OUT=0.5V ±1µA
IOS Short Circuit Current[9] VCC=Max., VOUT=GND −80 −140 −200 mA
IOOutput Drive Current[9] VCC=Max., V OUT=2.5V −50 −180 mA
IOFF Power-Off Disable VCC=0V, VOUT≤4.5V[10] ±1µA
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance. = HIGH-to-LOW Transition.
2. A-to-B data flow is shown, B-to-A data flow is similar but uses OE BA , LEBA, and CLKBA.
3. Output level before the indicated steady-state input conditions were established.
4. Output level before the indicated steady-state input conditions were established, provided that CLKAB was LO W bef ore LEAB went LOW.
5. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
6. Unused inputs must always be connected to an appropriate logic voltage level, pref erably either VCC or g round.
7. Typical values are at VCC= 5.0 V, TA= + 25°C ambient .
8. This parameter is guaranteed but not tested.
9. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests shou ld be per formed last .
10. Tested at +25°C.