SCLS066D - MARCH 1982 - REVISED SEPTEMBER 2003 D D D D D D D D D Operating Voltage Range of 4.5 V to 5.5 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd = 10 ns 4-mA Output Drive at 5 V Low Input Current of 1 A Max Inputs Are TTL-Voltage Compatible Designed Specifically for High-Speed Memory Decoders and Data-Transmission Systems Incorporate Two Enable Inputs to Simplify Cascading and/or Data Reception SN54HCT139 . . . J OR W PACKAGE SN74HCT139 . . . D, DB, N, OR PW PACKAGE (TOP VIEW) 1G 1A 1B 1Y0 1Y1 1Y2 1Y3 GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 2G 2A 2B 2Y0 2Y1 2Y2 2Y3 SN54HCT139 . . . FK PACKAGE (TOP VIEW) 1A 1G NC VCC 2G description/ordering information The 'HCT139 devices are designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay time of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2A 2B NC 2Y0 2Y1 1Y3 GND NC 2Y3 2Y2 1B 1Y0 NC 1Y1 1Y2 NC - No internal connection ORDERING INFORMATION PACKAGE TA PDIP - N TOP-SIDE MARKING Tube of 25 SN74HCT139N Tube of 40 SN74HCT139D Reel of 2500 SN74HCT139DR Reel of 250 SN74HCT139DT Reel of 2000 SN74HCT139DBR Reel of 2000 SN74HCT139PWR Reel of 250 SN74HCT139PWT CDIP - J Tube of 25 SNJ54HCT139J SNJ54HCT139J CFP - W Tube of 150 SNJ54HCT139W SNJ54HCT139W LCCC - FK Tube of 55 SNJ54HCT139FK SOIC - D -40C -40 C to 85 85C C SSOP - DB TSSOP - PW -55C -55 C to 125 125C C ORDERABLE PART NUMBER SN74HCT139N HCT139 HT139 HT139 SNJ54HCT139FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"#$%&' #"'(' ')"*%("' #$**&' ( ") +$,-#("' !(&. *"!$# #"')"*% " +&#)#("' +&* & &*% ") &/( '*$%&' ('!(*! 0(**('1. *"!$#"' +*"#&'2 !"& '" '&#&(*-1 '#-$!& &'2 ") (-+(*(%&&*. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS066D - MARCH 1982 - REVISED SEPTEMBER 2003 description/ordering information (continued) The 'HCT139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its driving circuit. FUNCTION TABLE INPUTS OUTPUTS SELECT G B A Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L logic diagram (positive logic) 4 1G 1 1Y0 5 1Y1 6 1Y2 2 1A 7 1B 1Y3 3 12 2Y0 15 11 2G 2Y1 10 2Y2 2A 14 9 13 2B Pin numbers shown are for the D, DB, J, N, PW, and W packages. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 2Y3 SCLS066D - MARCH 1982 - REVISED SEPTEMBER 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HCT139 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO tt Output voltage 0 High-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V SN74HCT139 2 2 Input transition (rise and fall) time V V 0.8 VCC VCC UNIT 0 0 500 0.8 V VCC VCC V 500 ns V TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = -20 A IOH = -4 mA 4.5 V VOL VI = VIH or VIL IOL = 20 A IOL = 4 mA 4.5 V II ICC VI = VCC or 0 VI = VCC or 0, ICC IO = 0 One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC Ci 5.5 V TA = 25C MIN TYP MAX 4.5 V to 5.5 V MIN MAX SN74HCT139 MIN 4.4 4.499 4.4 4.4 3.98 4.3 3.7 3.84 MAX UNIT V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 0.1 100 1000 1000 nA 8 160 80 A 1.4 2.4 3 2.9 mA 3 10 10 10 pF 5.5 V 5.5 V SN54HCT139 V This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. 3 ')"*%("' #"'#&*' +*"!$# ' & )"*%(4& "* !&2' +(& ") !&4&-"+%&'. (*(#&*# !(( ('! "&* +&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*4& & *2 " #('2& "* !#"''$& && +*"!$# 0"$ '"#&. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCLS066D - MARCH 1982 - REVISED SEPTEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) A or B Y tpd Y G tt Y VCC MIN TA = 25C TYP MAX SN54HCT139 MIN SN74HCT139 MAX MIN MAX 4.5 V 14 34 51 43 5.5 V 12 30 50 40 4.5 V 11 34 51 43 5.5 V 10 30 50 40 4.5 V 8 15 22 19 5.5 V 6 14 21 17 UNIT ns ns operating characteristics, TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per decoder No load TYP UNIT 25 pF PARAMETER MEASUREMENT INFORMATION From Output Under Test 3V Test Point Input 1.3 V 1.3 V 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 1.3 V 10% tPHL 90% 90% tr Input 1.3 V 0.3 V 2.7 V tPHL 3V 2.7 V 1.3 V 0.3 V 0 V tr Out-of-Phase Output 90% tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 1.3 V 10% V OL tf tPLH 1.3 V 10% tf 1.3 V 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 3 ')"*%("' #"'#&*' +*"!$# ' & )"*%(4& "* !&2' +(& ") !&4&-"+%&'. (*(#&*# !(( ('! "&* +&#)#("' (*& !&2' 2"(-. &/( '*$%&' *&&*4& & *2 " #('2& "* !#"''$& && +*"!$# 0"$ '"#&. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCT139D ACTIVE SOIC D 16 SN74HCT139DBLE OBSOLETE SSOP DB 16 SN74HCT139DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT139NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT139PWLE OBSOLETE TSSOP PW 16 SN74HCT139PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT139PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 40 Green (RoHS & no Sb/Br) TBD TBD (1) Lead/Ball Finish CU NIPDAU Call TI Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74HCT139DBR Package Package Pins Type Drawing SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HCT139DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HCT139PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HCT139PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT139DBR SSOP DB 16 2000 367.0 367.0 38.0 SN74HCT139DR SOIC D 16 2500 333.2 345.9 28.6 SN74HCT139PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HCT139PWT TSSOP PW 16 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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