F-219 QTH-090-01-C-D-A (R) QTH-030-01-L-D-A QTH-060-07-F-D-A (0.50 mm) .0197" QTH SERIES HIGH-SPEED GROUND PLANE HEADER For complete specifications and recommended PCB layouts see www.samtec.com?QTH Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 " (1.27 m) Ni Current Rating: Contact: 2 A per pin (2 pins powered) Ground Plane: 25 A per ground plane (1 ground plane powered) Operating Temp Range: -55 C to +125 C Voltage Rating: 175 VAC (5 mm Stack Height) Max Cycles: 100 RoHS Compliant: Yes POWER/SIGNAL APPLICATION 10 YEAR MFG WITH 50 " GOLD HIGH MATING CYCLES HIGH-SPEED CHANNEL PERFORMANCE 25 QTH/QSH @ 5 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (030-060) (0.15 mm) .006" max (090)* *(.004" stencil solution may be available; contact IPG@samtec.com) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com LEAD STYLE Specify LEAD STYLE from chart -030, -060, -090 (60 total pins per bank = -D) -020, -040, -060 For complete scope of recognitions see www.samtec.com/quality Compatible with UMPT/UMPS for flexible two-piece power/signal solutions G b p s PINS PER ROW NO. OF PAIRS QTH RECOGNITIONS (20 pairs per bank = -D-DP) PLATING OPTION -F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails -L -DP = (No. of Pairs per Row/20) x (20.00) .7875 (20.00) .7875 STANDARDS 01 * PISMOTM 1 Visit www.samtec.com/standards for more information. (7.11) .280 02 ALSO AVAILABLE (0.50) .0197 (MOQ Required) A -01 & -02 -03 thru -09 (0.76) .030 (0.89) .035 DIA -L (0.64) .025 *Note: -C Plating passes 10 year MFG testing = Single-Ended -D-DP = Differential Pair (-01 only) = (7.00 mm) .275" DIA Polyimide film Pick & Place Pad (N/A with -05 & -07 lead style) -TR = Tape & Reel (-090 positions maximum) -L QTH LEAD STYLE -01 -02 -03 -04 -05 -07 -09 A HEIGHT WITH QSH* (4.27) .168 (7.26) .286 (10.27) .404 (15.25) .600 (18.26) .718 (24.24) .954 (13.26) .522 (5.00) .197 (8.00) .315 (11.00) .433 (16.00) .630 (19.00) .748 (25.00) .984 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM OTHER OPTION -K -D -C* = Electro-Polished Selective 50 " (1.27 m) min Au over 150 " (3.81 m) Ni on Signal Pins in contact area, 10 " (0.25 m) min Au over 50 " (1.27 m) A Ni on Ground Plane in contact area, Matte Tin over 50 " (1.27 m) min Ni on all solder tails (0.20) .008 A TYPE = 10 " (0.25 m) Gold on Signal Pins and Ground Plane, Matte Tin on tails -D = (No. of Pins per Row/30) x (20.00) .7875 FILE NO. E111594 Note: Some lengths, styles and options are non-standard, non-returnable. Standard Stack Heights from 5 mm to 25 mm EXTENDED LIFE PRODUCT PROCESSING * 15 mm, 22 mm and 30 mm stack height * 30 " (0.76 m) Gold (Specify -H plating for Data Rate cable mating applications.) * Edge Mount & Guide Posts * 80 (-DP), 120, 150 positions per row * Retention Option Integral metal plane for power or ground Board Mates: QSH Cable Mates: HQCD, HQDP (See Also Available Note) Standoffs: SO SPECIFICATIONS All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. = Latching Option (-01 lead style only) (N/A on -060 (-D-DP) & -090)