4x 0.50 0.80 0.75 9.52 2.90 PCB holes for locating pegs - o1.100.02 "Corner A1" 1.60 ng ati loc al on pti "O PCB pad diameter -minimum o0.60 21 0.90 1 E tec E-tec US.EP.CN.TW.JP.KR Patent 2.2 5 E tec E-tec US.EP.CN.TW.JP.KR Patent 3.10 1 g" pe 31.75 Retention frame 0.80 2x 27.55 Material: Epoxy FR4 X DETAIL X SCALE 5 : 1 Pitch 1 2.90 Chip 23.00 Recommended PCB layout for BGA socket 0 1.6 Material: TG 200 Thickness: 5.00 mm 484 contacts 9.52 3 4x Socket 4 Thickness: 2.50mm E tec E-tec 4 E tec E-tec US.EP.CN.TW.JP.KR Patent US.EP.CN.TW.JP.KR Patent 15 2.50 27.55 33.75 UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN MILLIMETERS SURFACE FINISH: GENERAL TOLERANCES: 0.10 LINEAR: ANGULAR: Remark: "top view drawing" DRAWN BUA screw Lock socket, 484 pins, Pitch 1.00mm, matrix 22x22 Retention frame, Basic system 18x18 Name Modification Visa Date Drawn by Date 0 L.G 29.09.05 L.G 29.09.05 K.S 29.09.05 CHK'D APPV'D MFG Scale: 2:1 MATERIAL: Q.A The information contained in this drawing is proprietary to E-tec and shall not be reproduced or disclosed in whole or in part or used for any design or manufacture except whe such user possesses direct, written authorization from E-tec . www.e-tec.com w/o locating pegs "E-tec code" w/o locating pegs "Production code" with locating pegs "E-tec code" WEIGHT: SHEET 1 OF 1 with locating pegs "Production code" BUW484-1030-22AA01 A4V BUW0484-10-07201-22AAA BUW484-1030-22AA01L BPW0484-10-07201-22AAAL G:\Konstruktion\Dessins Solidworks\Dessins\BGA\BUW\BUW484\BUW0484-10-07201-22AAA\BUW0484-10-07201-22AAA 0 REVISION