31.75
27.55
21
9.52
9.52
Chip 23.00
Pitch 1
4x 3
4x 1.60
2.90
2.90
2x 1
"Corner A1"
"Optional locating peg"
3.10
0.90
1
5
0.80
1.60
X
0.75
0.80
0.50
DETAIL X
SCALE 5 : 1
33.75
27.55
15
2.2
4
4
US.EP.CN.TW.JP.KR Patent
E tec E-tec
US.EP.CN.TW.JP.KR Patent
E tec E-tec
US.EP.CN.TW.JP.KR Patent
E tec E-tec
US.EP.CN.TW.JP.KR Patent
E tec E-tec
2.50
484 contacts
Thickness: 5.00 mm
Material: TG 200
Socket
Thickness: 2.50mm
Material: Epoxy FR4
Retention frame
Recommended PCB layout
for BGA socket
PCB holes for locating pegs
- ø1.10±0.02
PCB pad diameter
-minimum ø0.60
484 contacts
Thickness: 5.00 mm
Material: TG 200
Socket
Thickness: 2.50mm
Material: Epoxy FR4
Retention frame
Recommended PCB layout
for BGA socket
PCB holes for locating pegs
- ø1.10±0.02
PCB pad diameter
-minimum ø0.60
DRAWN
CHK'D
APPV'D
MFG
Q.A
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILLIMETERS
SURFACE FINISH:
GENERAL TOLERANCES: ±0.10
LINEAR:
ANGULAR:
Remark:
Modification Visa Date
MATERIAL:
WEIGHT: REVISION
w/o locating pegs
Scale: 2:1
SHEET 1 OF 1
A4V
BUW0484-10-07201-22AAA
0
29.09.05
0L.G Date Name www.e-tec.com
G:\Konstruktion\Dessins Solidworks\Dessins\BGA\BUW\BUW484\BUW0484-10-07201-22AAA\BUW0484-10-07201-22AAA
Drawn by
The information contained in this drawing is proprietary to
E-tec and shall not be reproduced or disclosed in whole
or in part or used for any design or manufacture except whe
such user possesses direct, written authorization from E-tec
29.09.05
.
BUA screw Lock socket, 484 pins,
Pitch 1.00mm, matrix 22x22
Retention frame, Basic system 18x18
BUW484-1030-22AA01
29.09.05
K.S
L.G
"top view drawing"
BUW484-1030-22AA01L
with locating pegs
BPW0484-10-07201-22AAAL
with locating pegs
w/o locating pegs
"E-tec code"
"Production code"
"E-tec code"
"Production code"
