GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter LD 274 Wesentliche Merkmale Features * GaAs-LED mit sehr hohem Wirkungsgrad * Hohe Zuverlassigkeit * Gute spektrale Anpassung an Si-Fotoempfanger * Gehausegleich mit SFH 484 * * * * Anwendungen Applications * IR-Fernsteuerung von Fernseh- und Rundfunkgeraten, Videorecordern, Lichtdimmern * Geratefernsteuerungen fur Gleich- und Wechsellichtbetrieb * Sensorik * Diskrete Lichtschranken * IR remote control of hi-fi and TV-sets, video tape recorders, dimmers * Remote control for steady and varying intensity * Sensor technology * Discrete interrupters Very highly efficient GaAs-LED High reliability Spectral match with silicon photodetectors Same package as SFH 484 Typ Type Bestellnummer Ordering Code Gehause Package LD 274 Q62703-Q1031 LD 274-3 Q62703-Q1820 5-mm-LED-Gehause (T 1 3/4), graugetontes EpoxyGieharz, Anschlusse im 2.54-mm-Raster (1/10''), Kathodenkennzeichnung: Kurzerer Lotspie, flat 5 mm LED package (T 1 3/4), grey colored epoxy resin lens, solder tabs lead spacing 2.54 mm (1/10''), cathode marking: shorter solder lead, flat 2001-02-22 1 LD 274 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlastrom Forward current IF 100 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 165 mW Warmewiderstand Thermal resistance RthJA 450 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms 55 nm 10 Grad Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm Abstand Chipoberflache bis Linsenscheitel Distance chip front to lens top H 4.9 ... 5.5 mm tr, tf 0.5 s Kennwerte (TA = 25 C) Characteristics Abstrahlwinkel Half angle Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 2001-02-22 2 LD 274 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Kapazitat Capacitance VR = 0 V, f = 1 MHz Co 25 pF VF VF 1.30 ( 1.5) 1.90 ( 2.5) V V Sperrstrom, VR = 5 V Reverse current IR 0.01 ( 1) A Gesamtstrahlungsflu Total radiant flux IF = 100 mA, tp = 20 ms e 15 mW Temperaturkoeffizient von Ie bzw. e, TCI - 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlaspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA 2001-02-22 3 LD 274 Gruppierung der Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.001 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.001 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s 1) Nur auf Anfrage lieferbar. 1) Available only on request. 2001-02-22 Symbol Symbol Wert Value Einheit Unit LD 274 LD 274-21) LD 274-3 Ie min Ie max 50 - 50 100 80 - mW/sr mW/sr Ie typ. 350 600 800 mW/sr 4 LD 274 e Radiant Intensity 100 mA = f (IF) e Relative Spectral Emission rel = f () Single pulse, tp = 20 s OHRD1938 100 OHR00883 120 I F mA e (100 mA) % rel OHR01038 10 2 e Max. Permissible Forward Current IF = f (T A ) 100 80 80 10 1 60 RthjA = 450 K/W 60 40 10 0 40 20 20 0 880 920 960 nm 1000 10 -1 10 -2 1060 10 -1 10 0 IF OHR01041 10 4 OHR00860 tp F mA 5 D= tp T F D = 0.005 typ. 10 0 10 1 Permissible Pulse Handling Capability IF = f (), TC 25 C, duty cycle D = parameter Forward Current IF = f (VF), single pulse, tp = 20 s 10 1 A A F T max. 0.01 0.02 10 3 5 10 -1 0.05 0.1 0.2 0.5 10 -2 1 1.5 2 2.5 3 3.5 DC 10 2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp 4 V 4.5 VF Radiation Characteristics, rel = f () 40 30 20 10 0 OHR01882 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2001-02-22 0.8 0.6 0.4 0 20 40 60 80 100 5 120 0 0 20 40 60 80 100 C 120 TA LD 274 Mazeichnung Package Outlines 9.0 (0.354) 1.8 (0.071) 1.2 (0.047) 29 (1.142) 27 (1.063) 5.9 (0.232) 5.5 (0.217) o4.8 (0.189) 7.5 (0.295) 0.8 (0.031) 0.4 (0.016) Area not flat 2.54 (0.100) spacing 0.6 (0.024) 0.4 (0.016) 7.8 (0.307) o5.1 (0.201) 8.2 (0.323) 5.7 (0.224) 0.6 (0.024) 5.1 (0.201) 0.4 (0.016) Chip position Cathode GEXY6051 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2001-02-22 6