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LM6152

LM6154

SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

LM6152/LM6154 Dual and Quad 75 MHz GBW Rail-to-Rail I/O Operational Amplifiers

1 Features 3 Description

Using patented circuit topologies, the

1• At VS= 5V, typical unless noted. LM6152/LM6154 provides new levels of speed vs.

• Greater than Rail-to-rail Input CMVR −0.2 5V to power performance in applications where low voltage

5.25 V supplies or power limitations previously made

• Rail-to-rail Output Swing 0.01 V to 4.99 V compromise necessary. With only 1.4 mA/amplifier

supply current, the 75 MHz gain bandwidth of this

• Wide Gain-bandwidth 75 MHz @ 100 kHz device supports new portable applications where

• Slew Rate higher power devices unacceptably drain battery life.

– Small Signal 5 V/µs The slew rate of the devices increases with

increasing input differential voltage, thus allowing the

– Large Signal 45 V/µs device to handle capacitive loads while maintaining

• Low Supply Current 1.4 mA/amplifier large signal amplitude.

• Wide Supply Range 2.7 V to 24 V The LM6152/LM6154 can be driven by voltages that

• Fast Settling Time of 1.1 µs for 2 V Step (to exceed both power supply rails, thus eliminating

0.01%) concerns about exceeding the common-mode voltage

• PSRR 91 dB range. The rail-to-rail output swing capability provides

the maximum possible dynamic range at the output.

• CMRR 84 dB This is particularly important when operating on low

supply voltages.

2 Applications Operating on supplies from 2.7 V to over 24 V, the

• Portable High Speed Instrumentation LM6152/LM6154 is excellent for a very wide range of

• Signal Conditioning Amplifier/ADC Buffers applications, from battery operated systems with

• Barcode Scanners large bandwidth requirements to high speed

instrumentation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM6152 SOIC (8) 4.902 mm × 3.912 mm

LM6154 SOIC (14) 8.636 mm × 3.912 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

Offset Voltage vs. Supply voltage

Supply Current vs. Supply Voltage

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM6152

LM6154

SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

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Table of Contents

6.7 2.7 V DC Electrical Characteristics.......................... 7

1 Features.................................................................. 16.8 2.7 V AC Electrical Characteristics.......................... 7

2 Applications ........................................................... 16.9 24 V DC Electrical Characteristics........................... 8

3 Description............................................................. 16.10 24 V AC Electrical Characteristics......................... 8

4 Revision History..................................................... 26.11 Typical Performance Characteristics ...................... 9

5 Pin Configuration and Functions......................... 37 Application and Implementation ........................ 14

6 Specifications......................................................... 48 Device and Documentation Support.................. 16

6.1 Absolute Maximum Ratings ...................................... 48.1 Related Links .......................................................... 16

6.2 Handling Ratings....................................................... 48.2 Trademarks............................................................. 16

6.3 Recommended Operating Conditions(1) ................... 48.3 Electrostatic Discharge Caution.............................. 16

6.4 Thermal Information.................................................. 48.4 Glossary.................................................................. 16

6.5 5.0 V DC Electrical Characteristics.......................... 59 Mechanical, Packaging, and Orderable

6.6 5.0 V AC Electrical Characteristics.......................... 6Information........................................................... 16

4 Revision History

Changes from Revision D (March 2013) to Revision E Page

• Changed "Junction Temperature Range" to "Operating Temperature Range" and deleted "TJ" in Recommended

Operating Conditions ............................................................................................................................................................. 4

• Deleted TJ= 25°C for Electrical Characteristics Tables......................................................................................................... 5

Changes from Revision C (March 2013) to Revision D Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 15

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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

5 Pin Configuration and Functions

Package D08A Package D14A

8-Pin 14-Pin

Top View Top View

Pin Functions

LM6152 LM6154 I/O DESCRIPTION

NAME D08A D14A

-IN A 2 2 I ChA Inverting Input

+IN A 3 3 I ChA Non-inverting Input

-IN B 6 6 I ChB Inverting Input

+IN B 5 5 I ChB Non-inverting Input

-IN C 9 I ChC Inverting Input

+IN C 10 I ChC Non-inverting Input

-IN D 13 I ChD Inverting Input

+IN D 12 I ChD Non-inverting Input

OUT A 1 1 O ChA Output

OUT B 7 7 O ChB Output

OUT C 8 O ChC Output

OUT D 14 O ChD Output

V-4 11 I Negative Supply

V+8 4 I Positive Supply

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6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT

Differential Input Voltage ±15 V

(V+) + 0.3

Voltage at Input/Output Pin V

(V−)−0.3

Supply Voltage (V+−V−) 35 V

Current at Input Pin ±10 mA

Current at Output Pin (3) ±25 mA

Current at Power Supply Pin 50 mA

Lead Temperature (soldering, 10 sec) 260 °C

Junction Temperature (4) 150 °C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(4) The maximum power dissipation is a function of TJ(MAX) , RθJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD= (TJ(MAX)–T A)/RθJA. All numbers apply for packages soldered directly into a PC board.

6.2 Handling Ratings MIN MAX UNIT

Tstg Storage temperature range -65 +150 °C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2500

V(ESD) Electrostatic discharge V

pins(1)

(1) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process. Human body model

is 1.5 kΩin series with 100 pF

6.3 Recommended Operating Conditions(1)

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Supply Voltage 2.7 ≤V+≤24 V

Operating Temperature Range, LM6152,LM6154 0 +70 °C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

6.4 Thermal Information D08A D14A

THERMAL METRIC(1) UNIT

8 PINS 14 PINS

RθJA Junction-to-ambient thermal resistance 193°C/W 126°C/W °C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Product Folder Links: LM6152 LM6154

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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

6.5 5.0 V DC Electrical Characteristics

Unless otherwise specified, all limits are ensured for V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface

limits apply at the temperature extremes. LM6154BC

LM6152AC

PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT

LIMIT(2) LIMIT(2)

VOS Input Offset Voltage 2 5 mV

0.54 4 7 max

TCVOS Input Offset Voltage Average Drift 10 µV/°C

IBInput Bias Current 0V ≤VCM ≤5V 500 980 980 nA max

750 1500 1500

IOS Input Offset Current 32 100 100 nA max

40 160 160

RIN Input Resistance, CM 0V ≤VCM ≤4V 30 MΩ

CMRR Common Mode Rejection Ratio 0V ≤VCM ≤4V 94 70 70 dB

min

0V ≤VCM ≤5V 84 60 60

PSRR Power Supply Rejection Ratio 5V ≤V+≤24V dB

91 80 80 min

VCM Input Common-Mode Voltage Range Low −0.25 0 0 V

High 5.25 5.0 5.0 V

AVLarge Signal Voltage Gain RL= 10 kΩV/mV

214 50 50 min

VOOutput Swing RL= 100 kΩ0.02 0.02 V

0.006 0.03 0.03 max

4.97 4.97 V

4.992 4.96 4.96 min

RL= 2 kΩ0.10 0.10 V

0.04 0.12 0.12 max

4.80 4.80 V

4.89 4.70 4.70 min

ISC Output Short Circuit Current Sourcing 3 3 mA

2.5 2.5 min

6.2 27 27 mA

17 17 max

Sinking 7 7 mA

5 5 min

16.9 mA

40 40 max

ISSupply Current Per Amplifier 2 2 mA

1.4 2.25 2.25 max

(1) Typical Values represent the most likely parametric norm.

(2) All limits are specified by testing or statistical analysis.

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6.6 5.0 V AC Electrical Characteristics

Unless otherwise specified, all limits ensured for V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface limits

apply at the temperature extremes. LM6154BC

LM6152AC

PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT

LIMIT(2) LIMIT(2)

SR Slew Rate ±4V Step @ VS= ±6V, 24 24 V/µs

RS< 1 kΩ15 15 min

GBW Gain-Bandwidth Product f = 100 kHz 75 MHz

Amp-to-Amp Isolation RL= 10 kΩ125 dB

enInput-Referred Voltage Noise f = 1 kHz 9 nV/√Hz

inInput-Referred Current Noise f = 1 kHz 0.34 pA/√Hz

T.H.D Total Harmonic Distortion f = 100 kHz, RL= 10 kΩdBc

−65

AV=−1, VO= 2.5 VPP

ts Settling Time 2V Step to 0.01% 1.1 µs

(1) Typical Values represent the most likely parametric norm.

(2) All limits are specified by testing or statistical analysis.

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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

6.7 2.7 V DC Electrical Characteristics

Unless otherwise specified, all limits are ensured for V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface

limits apply at the temperature extremes. LM6154BC

LM6152AC

PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT

LIMIT(2) LIMIT(2)

VOS Input Offset Voltage 2 5 mV

0.8 5 8 max

TCVOS Input Offset Voltage Average Drift 10 µV/°C

IBInput Bias Current 500 nA

IOS Input Offset Current 50 nA

RIN Input Resistance, CM 0V ≤VCM ≤1.8V 30 MΩ

CMRR Common Mode Rejection Ratio 0V ≤VCM ≤1.8V 88 dB

0V ≤VCM ≤2.7V 78

PSRR Power Supply Rejection Ratio 3V ≤V+≤5V 69 dB

VCM Input Common-Mode Voltage Range Low −0.25 0 0 V

High 2.95 2.7 2.7 V

AVLarge Signal Voltage Gain RL= 10 kΩ5.5 V/mV

VOOutput Swing RL= 10 kΩ0.07 0.07 V

0.032 0.11 0.11 max

2.64 2.64 V

2.68 2.62 2.62 min

ISSupply Current Per Amplifier 1.35 mA

(1) Typical Values represent the most likely parametric norm.

(2) All limits are specified by testing or statistical analysis.

6.8 2.7 V AC Electrical Characteristics

Unless otherwise specified, all limits are ensured for V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface

limits apply at the temperature extremes. LM6154BC

LM6152AC

PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT

LIMIT(2) LIMIT(2)

GBW Gain-Bandwidth Product f = 100 kHz 80 MHz

(1) Typical Values represent the most likely parametric norm.

(2) All limits are specified by testing or statistical analysis.

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6.9 24 V DC Electrical Characteristics

Unless otherwise specified, all limits are ensured for V+= 24V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface

limits apply at the temperature extremes. LM6154BC

LM6152AC

PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT

LIMIT(2) LIMIT(2)

VOS Input Offset Voltage 2 7 mV

0.3 4 9 max

TCVOS Input Offset Voltage Average Drift 10 µV/°C

IBInput Bias Current 500 nA

IOS Input Offset Current 32 nA

RIN Input Resistance, CM 0V ≤VCM ≤23V 60 Meg Ω

CMRR Common Mode Rejection Ratio 0V ≤VCM ≤23V 94 dB

0V ≤VCM ≤24V 84

PSRR Power Supply Rejection Ratio 0V ≤VCM ≤24V 95 dB

VCM Input Common-Mode Voltage Range Low −0.25 0 0 V

High 24.25 24 24 V

AVLarge Signal Voltage Gain RL= 10 kΩ55 V/mV

VOOutput Swing RL= 10 kΩ0.075 0.075 V

0.044 0.090 0.090 max

23.8 23.8 V

23.91 23.7 23.7 min

ISSupply Current Per Amplifier 2.25 2.25 mA

1.6 2.50 2.50 max

(1) Typical Values represent the most likely parametric norm.

(2) All limits are specified by testing or statistical analysis.

6.10 24 V AC Electrical Characteristics

Unless otherwise specified, all limits are ensured for V+= 24V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2. Boldface

limits apply at the temperature extremes. LM6154BC

LM6152AC

PARAMETER TEST CONDITIONS TYP(1) LM6152BC UNIT

LIMIT(2) LIMIT(2)

GBW Gain-Bandwidth Product f = 100 kHz 80 MHz

(1) Typical Values represent the most likely parametric norm.

(2) All limits are specified by testing or statistical analysis.

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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

6.11 Typical Performance Characteristics

Figure 1. Supply Current vs. Supply Voltage Figure 2. Offset Voltage vs. Supply voltage

Figure 3. Bias Current vs. Supply voltage Figure 4. Bias Current vs. VCM

Figure 5. Bias Current vs. VCM Figure 6. Bias Current vs. VCM

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Typical Performance Characteristics (continued)

Figure 7. Output Voltage vs. Source Current Figure 8. Output Voltage vs. Source Current

Figure 9. Output Voltage vs. Source Current Figure 10. Output Voltage vs. Sink Current

Figure 11. Output Voltage vs. Sink Current Figure 12. Output Voltage vs. Sink Current

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Typical Performance Characteristics (continued)

Figure 13. Crosstalk (dB) vs. Frequency Figure 14. GBWP (@ 100 kHz) vs. Supply Voltage

Figure 15. Unity Gain Frequency vs. Supply Voltage Figure 16. CMRR

for Various Loads

Figure 17. Voltage Swing vs. Frequency Figure 18. PSRR vs. Frequency

(CL= 100 pF)

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Typical Performance Characteristics (continued)

Figure 19. Open Loop Gain/Phase Figure 20. Open Loop Gain/Phase

(VS= 5V) (VS= 10V)

Figure 21. Open Loop Gain/Phase Figure 22. Noise Voltage vs. Frequency

(VS= 24V)

Figure 23. Noise Current vs. Frequency Figure 24. Voltage Error vs. Settle Time

Product Folder Links: LM6152 LM6154

100k 1M

FREQUENCY (Hz)

-100

-90

-70

-60

-50

-40

-20

-10

HD (dBc)

-30

-80

HD2

HD3

THD

VS = ±5V

AV = -1

VIN = 5 VPP

RL = 10 k:

LM6152

LM6154

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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

Typical Performance Characteristics (continued)

Figure 25. Distortion vs. Frequency

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7 Application and Implementation

The LM6152/LM6154 is ideally suited for operation with about 10 kΩ(Feedback Resistor, RF) between the output

and the negative input terminal.

With RFset to this value, for most applications requiring a close loop gain of 10 or less, an additional small

compensation capacitor (CF) (see Figure 26) is recommended across RFin order to achieve a reasonable

overshoot (10%) at the output by compensating for stray capacitance across the inputs.

The optimum value for CFcan best be established experimentally with a trimmer cap in place since its value is

dependant on the supply voltage, output driving load, and the operating gain. Below, some typical values used in

an inverting configuration and driving a 10 kΩload have been tabulated for reference:

Table 1. Typical BW (−3 dB) at Various

Supply Voltage and Gains

VSCFBW (−3 dB)

GAIN

Volts pF MHz

−1 5.6 4

3−10 6.8 1.97

−100 None 0.797

−1 2.2 6.6

24 −10 4.7 2.2

−100 None 0.962

In the non-inverting configuration, the LM6152/LM6154 can be used for closed loop gains of +2 and above. In

this case, also, the compensation capacitor (CF) is recommended across RF(= 10 kΩ) for gains of 10 or less.

Figure 26. Typical Inverting Gain Circuit AV=−1

Because of the unique structure of this amplifier, when used at low closed loop gains, the realizable BW will be

much less than the GBW product would suggest.

The LM6152/LM6154 brings a new level of ease of use to op amp system design.

The greater than rail-to-rail input voltage range eliminates concern over exceeding the common-mode voltage

range. The rail-to-rail output swing provides the maximum possible dynamic range at the output. This is

particularly important when operating on low supply voltages.

The high gain-bandwidth with low supply current opens new battery powered applications where higher power

consumption previously reduced battery life to unacceptable levels.

The ability to drive large capacitive loads without oscillating functional removes this common problem.

To take advantage of these features, some ideas should be kept in mind.

The LM6152/LM6154, capacitive loads do not lead to oscillations, in all but the most extreme conditions, but they

will result in reduced bandwidth. They also cause increased settling time.

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SNOS752E –MAY 1999–REVISED SEPTEMBER 2014

Unlike most bipolar op amps, the unique phase reversal prevention/speed-up circuit in the input stage, causes

the slew rate to be very much a function of the input pulse amplitude. This results in a 10 to 1 increase in slew

rate when the differential input signal increases. Large fast pulses will raise the slew-rate to more than 30 V/µs.

Figure 27. Slew Rate vs. VDIFF

The speed-up action adds stability to the system when driving large capacitive loads.

A conventional op amp exhibits a fixed maximum slew-rate even though the differential input voltage rises due to

the lagging output voltage. In the LM6152/LM6154, increasing lag causes the differential input voltage to

increase but as it does, the increased slew-rate keeps the output following the input much better. This effectively

reduces phase lag. As a result, the LM6152/LM6154 can drive capacitive loads as large as 470 pF at gain of 2

and above, and not oscillate.

Capacitive loads decrease the phase margin of all op amps. This can lead to overshoot, ringing and oscillation.

This is caused by the output resistance of the amplifier and the load capacitance forming an R-C phase shift

network. The LM6152/6154 senses this phase shift and partly compensates for this effect.

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8 Device and Documentation Support

8.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LM6152 Click here Click here Click here Click here Click here

LM6154 Click here Click here Click here Click here Click here

8.2 Trademarks

All trademarks are the property of their respective owners.

8.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

8.4 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

9 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LM6152 LM6154

PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM6152ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM61

52ACM

LM6152ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM61

52ACM

LM6152ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM61

52ACM

LM6152BCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM61

52BCM

LM6152BCMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM61

52BCM

LM6154BCM NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM6154BCM

LM6154BCM/NOPB ACTIVE SOIC D 14 55 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM6154BCM

LM6154BCMX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 70 LM6154BCM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM6152ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM6152BCMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM6154BCMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Sep-2018

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM6152ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM6152BCMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM6154BCMX/NOPB SOIC D 14 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 15-Sep-2018

Pack Materials-Page 2

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PACKAGE OUTLINE

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

6X .050

[1.27]

8X .012-.020

[0.31-0.51]

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8 .004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

.189-.197

[4.81-5.00]

NOTE 3

B .150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

.010 [0.25] C A B

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

www.ti.com

EXAMPLE BOARD LAYOUT

.0028 MAX

[0.07]

ALL AROUND

.0028 MIN

[0.07]

ALL AROUND

(.213)

[5.4]

6X (.050 )

[1.27]

8X (.061 )

[1.55]

8X (.024)

[0.6]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSED

METAL

OPENING

SOLDER MASK METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

SYMM

SEE

DETAILS

SYMM

www.ti.com

EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27] (.213)

[5.4]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL

SCALE:8X

SYMM

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