7.
5
FITTING NAIL
金具
(DETAIL OF FITTING NAIL)
(金具部投影図)
VIEW K
K
24.1 22.1 18.15 17.0 52437-3533 35
EMBOSSED PACKAGE
ORDER No. オーダー番号
CONNECTOR SERIES NO. : 52437-**22
極数
CKT.
(A)BCD
21
17.1 15.1 10.0
11.15 52437-2133
17.6 15.6 11.65 10.5 52437-2233 22
23
24
25
26
27
28
29
30
52437-2333
52437-2433
52437-2533
52437-2633
52437-2733
52437-2833
52437-2933
52437-3033
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
12.15
12.65
13.15
13.65
14.15
14.65
15.15
15.65
16.118.1
16.618.6
19.1 17.1
17.619.6
20.1 18.1
18.620.6
21.1 19.1
19.621.6
0.250.5
0.7
0.65 1.65
0.9
0.63
2.605
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/03/02
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
KMIYAHARA
2012/09/05
APPR:
KMORIKAWA
2013/04/05
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52437
DIMENSION UNITS
SCALE
mm
10:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5MM FPC CONN ZIF R/A
HOUSING ASSY (LOWER CONTACT)
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52437-023
PSD
001
A
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 1 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:48
NOTES
1.使用材料
MATERIAL
ハウジング:ポリアミド(PA)、ナチュラル(白色)、ガラス充填、UL94V-0
HOUSING:POLYAMIDE NATURAL(WHITE)、GLASS FILLED,UL94V-0
アクチュエータ:ポリフェニレンサルファイド(PPS)、ナチュラル(茶色)、
ガラス充填、UL94V-0
ACTUATOR: PPS ,NATURAL(BROWN), GLASS FILLED, UL94V-0
ターミナル:リン青銅( t = 0.2)
TERMINAL:PHOSPHOR BRONZE( t = 0.2)
金具:リン青銅( t = 0.2)
FITTING NAIL: PHOSPHOR BRONZE( t = 0.2)
2.メッキ仕様 PLATING
 ターミナル TERMINAL
     錫銀ビスマスメッキ (1.0μm以上)
TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM)
下地メッキ:ニッケルメッキ (1.0μm以上)
UNDER PLATING : NICKEL PLATING (1.0 MICROMETER MINIMUM)
  金具 NAIL
     錫メッキ (1.0μm以上)
TIN PLATING (1.0 MICROMETER MINIMUM)
下地メッキ:ニッケルメッキ (1.0μm以上)
UNDER PLATING : NICKEL PLATING (1.0 MICROMETER MINIMUM)
3.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR OF PART
NO.52437-**22 SHOULD BE LOCKED.
偶数極に適用
APPLY FOR EVEN CIRCUIT.
パターン剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
R0.3は、FPCの導体部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
 ソルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
 基準面 H に対して上方向に0.1MAXIMUM、下方向に0.15MAXIMUMとする。
 MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM H.
 UPPER DIRECTION : 0.1 MAXIMUM
 LOWER DORECTION : 0.15MAXIMUM
8.ELV及びRoHS適合品
ELV AND RoHS COMPLIANT
7.
4.
5.
6.
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR   ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
6
(PITCH)
補強板
(STIFFENER BOARD)
適合FPC推奨寸法
    APPLICABLE FPC
PLATING RECOMMENDED DIMENSION
仕上がり厚さ:0.3
±
0.05
THICKNESS: 0.3+0.05/-0.05
(PITCH)
補強板
(STIFFENER BOARD)
適合FFC推奨寸法
    APPLICABLE FFC
PLATING RECOMMENDED DIMENSION
仕上がり厚さ:0.3
±
0.05
THICKNESS: 0.3+0.05/-0.05
(FROM PATTERN EDGE)
VIEW M
M
PATTERN
BOARD
SOLDERING AREA
OF FITTING NAIL
金具パターンエリア
パターンおよび
半田禁止エリア
KEEPING OUT AREA OF
PATTERN AND SOLDERING
DETAIL L
(DETAIL OF FITTING NAIL
ON PATTERN)
     FPC/FFCについて ABOUT FPC/FFC
     打ち抜き方向は導体側から補強板側を推奨します。
接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様、お願い致します。
     RECOMMENDED PUNCHING DIRECTION: FROM CONDUCTOR SIDE TO STIFFENER SIDE
     PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE
THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE CAUSES THE DEFECT IN
     ELECTRICAL CONTINUITY.
マスク厚    :  100μm
マスク開口率  :  100%
SCREEN THICKNESS : 100μm
SCREEN OPEN RATIO : 100%
L
(NON-ACCUMULATIVE)
(公差非累積)
(PITCH)
(ピッチ)
±
0.05
コネクタ位置
CONNECTOR
POSITION
0.5
±
0.05
0.5
±
0.1 0.5(N-1)
±
0.05 0.5
±
0.1
0.5(N+1)
±
0.07
0.35+0.04
-0.03
4
±
0.5
6
±
0.5
0.5
±
0.05
0.5
±
0.08 0.5(N-1)
±
0.05 0.5
±
0.08
0.5(N+1)
±
0.07
0.3
±
0.03
6
±
0.5
4
±
0.5
0.45MAX.
(0.605)
1.85MIN.
(0.3)
0.5(N-1)
1.1
1.25
(0.3)
2.2
(0.2)
0.5
±
0.05 (0.3)
1.25
0.55MAX.
(0.3)
0.83.05
3.65 3.65
R0.3
R0.3
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 600082
DRWN:
YCHEN128
2018/03/02
CHK'D:
KTAKAHASHI
2018/03/14
APPR:
NUKITA
2018/03/14
INITIAL REVISION:
DRWN:
KMIYAHARA
2012/09/05
APPR:
KMORIKAWA
2013/04/05
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52437
DIMENSION UNITS
SCALE
mm
5:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.2
3 PLACES
±
0.25
2 PLACES
±
0.3
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.5MM FPC CONN ZIF R/A
HOUSING ASSY (LOWER CONTACT)
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
SD-52437-023
PSD
001
A
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL MARKET 2 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:48
導体部: 銅箔(35μmか50μm)
COPPER FOIL (35μm or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
0.3
±
0.05
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
補強板:ポリエステル系
REINFORCE BOARD: PET
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
仕上がり厚さ
THICKNESS
ベースフィルム:ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ:ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
めっき:錫めっき(0.5~1.2μm) 
 下地ニッケル(1-5μm)
PLATING: TIN(0.5~1.2μm)     
NICKEL UNDER(1-5μm)
接着剤(難燃ポリエステル系)
ADHESIVE(FLAME-RETARDANT
POLYESTER ADHESIVE)
熱硬化接着剤
THERMOSETTING ADHESIVE
導体部: 銅箔(35 か 50μm)
COPPER FOIL (35 or 50μm)
めっき:錫めっき(0.5~1.2μm) 
 下地ニッケル(1-5μm)
PLATING: TIN(0.5~1.2μm)     
NICKEL UNDER(1-5μm)
仕上がり厚さ
THICKNESS
補強板:ポリイミド
REINFORCE BOARD: POLYMIDE
0.3
±
0.05
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER ± 0.2
10 OVER 30 UNDER ± 0.25
30 OVER ± 0.3
ANGULAR   ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
FPC構成推奨仕様
STRUCTURE OF FPC
FFC構成推奨仕様
STRUCTURE OF FFC
 推奨基板レイアウト
(マウンド面)
RECOMMENDED P.C.BOARD
PATTERN DIMENSION
(MOUNTING SIDE)
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E