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Model
XE
C24
A
6
-
03G
Rev A
Hybrid Coupler
3 dB, 90°
°°
°
Description
The XEC24A6-03G is a low profile, high performance 3dB hybrid coupler in a
new easy to use, manufacturing friendly surface mount package. It is
designed for IMS band, RF heating applications in the 2400MHz to 2500MHz
range. It can be used in high power applications up to 600 Watts.
Parts have been subjected to rigorous qualification testing and they are
manufactured using materials with coefficients of thermal expansion (CTE)
compatible with common substrates such as FR4, G-10, RF-35, RO4350 and
polyimide. Available in 6 of 6 ENIG (XEC24A6-03G) RoHS compliant finish.
Electrical Specifications **
Features:
• 2400 - 2500 MHz
• RF Heating
• High Power
• Very Low Loss
• Production Friendly
• Tape and Reel
• ENIG Finish
Frequency Isolation
Insertion
Loss VSWR
Amplitude
Balance
MHz dB Min dB Max Max : 1 dB Max
2400 - 2500 20 0.15 1.22 ± 0.30
Phase Power
Operating
Temp.
Degrees Avg. CW Watts ºC
90 ± 4.0 600 -55 to +95
*Power Handling for commercial, non-life critical applications. See derating chart for other applications
**Specification based on performance of unit properly installed on Anaren Test Board 58481-0001 with small
signal applied. Specifications subject to change without notice. Refer to parameter definitions for details.
Mechanical Outline
.560±.010
[14.22±0.25]
ORIENTATION
MARK DENOTES
PIN 1
Dimensions are in Inches [Millimeters]
XEC24A6-03G Mechanical Outline
4X .059±.004 SQ
[1.50±0.10]
.350±.010
[8.89±0.25]
.110±.011
[2.80±0.28]
PIN 2
PIN 3
PIN 1
PIN 4
GND
4X .040±.004
[1.02±0.10]
4X .040±.004
[1.02±0.10]
.430±.004
[10.92±0.10]
.220±.004
[5.59±0.10]
PIN 2
PIN 3
PIN 1
PIN 4
GND
Tolerances are Non-cumulative
Top View (Near-Side) Side View Bottom View (Far-Side)
DENOTES ARRAY
ROW (RR) &
COLUMN (CC)
RR CC
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E
C24A
6
-
03G
Rev A
Hybrid Coupler Pin Configuration
The XEC24A6-03G has an orientation marker to denote Pin 1. Once port one has been identified the other ports are
known automatically. Please see the chart below for clarification:
Configuration
Pin 1
Pin 2
Pin 3
Pin 4
Splitter
Input Isolated -3dB 90
−
∠
θ
-3dB
θ
∠
Splitter
Isolated Input -3dB
θ
∠
-3dB 90
−
∠
θ
Splitter
-3dB 90
−
∠
θ
-3dB
θ
∠
Input Isolated
Splitter
-3dB
θ
∠
-3dB 90
−
∠
θ
Isolated Input
*Combiner
A90
−
∠
θ
A
θ
∠
Isolated Output
*Combiner
A
θ
∠
A 90
−
∠
θ
Output Isolated
*Combiner
Isolated Output A90
−
∠
θ
A
θ
∠
*Combiner
Output Isolated A
θ
∠
A 90
−
∠
θ
*Note: “A” is the amplitude of the applied signals. When two quadrature signals with equal amplitudes are
applied to the coupler as described in the table, they will combine at the output port. If the amplitudes are
not equal, some of the applied energy will be directed to the isolated port.
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-
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Insertion Loss and Power Derating Curves
Insertion Loss Derating:
The insertion loss, at a given frequency, of a group of
couplers is measured at 25°C and then averaged. The
measurements are performed under small signal
conditions (i.e. using a Vector Network Analyzer). The
process is repeated at 85°C and 150°C. A best-fit line
for the measured data is computed and then plotted
from -55°C to 150°C.
Power Derating:
The power handling and corresponding power derating
plots are a function of the thermal resistance, mounting
surface temperature (base plate temperature),
maximum continuous operating temperature of the
coupler, and the thermal insertion loss. The thermal
insertion loss is defined in the Power Handling section of
the data sheet.
As the mounting interface temperature approaches the
maximum continuous operating temperature, the power
handling decreases to zero.
If mounting temperature is greater than 95°C, Xinger
coupler will perform reliably as long as the input power
is derated to the curve above.
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E
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-
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Typical Performance (-55°C, 25°C, 95°C & 105°C): 2400-2500 MHz
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-
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Typical Performance (-55°C, 25°C , 95°C & 105°C): 2400-2500 MHz
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E
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-
03G
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Definition of Measured Specifications
Parameter Definition Mathematical Representation
VSWR
(Voltage Standing Wave
Ratio)
The impedance match of
the coupler to a 50Ω
system. A VSWR of 1:1
is optimal.
VSWR =
min
max
V
V
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss
The impedance match of
the coupler to a 50Ω
system. Return Loss is
an alternate means to
express VSWR.
Return Loss (dB)= 20log
1
-
VSWR
1VSWR
+
Insertion Loss
The input power divided
by the sum of the power
at the two output ports.
Insertion Loss(dB)= 10log
direct cpl
in
PP
P
+
Isolation
The input power divided
by the power at the
isolated port.
Isolation(dB)= 10log
iso
in
P
P
Phase Balance
The difference in phase
angle between the two
output ports.
Phase at coupled port – Phase at direct port
Amplitude Balance
The power at each output
divided by the average
power of the two outputs.
10log
+
2
PP
P
directcpl
cpl and 10log
+
2
PP
P
directcpl
direct
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Notes on RF Testing and Circuit Layout
The XEC24A6-03G Surface Mount Coupler requires the use of a test fixture for verification of RF performance. This
test fixture is designed to evaluate the coupler in the same environment that is recommended for installation.
Enclosed inside the test fixture, is a circuit board that is fabricated using the recommended footprint. The part being
tested is placed into the test fixture and pressure is applied to the top of the device using a pneumatic piston. A four
port Vector Network Analyzer is connected to the fixture and is used to measure the S-parameters of the part. Worst
case values for each parameter are found and compared to the specification. These worst case values are reported to
the test equipment operator along with a Pass or Fail flag. See the illustrations below.
3 dB
Test Board
Test Board
In Fixture
Test Station
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E
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-
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The effects of the test fixture on the measured data must be minimized in order to accurately determine the
performance of the device under test. If the line impedance is anything other than 50Ω and/or there is a discontinuity
at the microstrip to SMA interface, there will be errors in the data for the device under test. The test environment can
never be “perfect”, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an
attempt to minimize the errors associated with testing these devices. The lower the signal level that is being
measured, the more impact the fixture errors will have on the data. Parameters such as Return Loss and
Isolation/Directivity, which are specified as low as 27dB and typically measure at much lower levels, will present the
greatest measurement challenge.
The test fixture errors introduce an uncertainty to the measured data. Fixture errors can make the performance of the
device under test look better or worse than it actually is. For example, if a device has a known return loss of 30dB and
a discontinuity with a magnitude of –35dB is introduced into the measurement path, the new measured Return Loss
data could read anywhere between –26dB and –37dB. This same discontinuity could introduce an insertion phase
error of up to 1°.
There are different techniques used throughout the industry to minimize the effects of the test fixture on the
measurement data. Anaren uses the following design and de-embedding criteria:
• Test boards have been designed and parameters specified to provide trace impedances of 50
±1Ω. Furthermore, discontinuities at the SMA to microstrip interface are required to be less than
–35dB and insertion phase errors (due to differences in the connector interface discontinuities
and the electrical line length) should be less than ±0.50° from the median value of the four
paths.
• A “Thru” circuit board is built. This is a two port, microstrip board that uses the same SMA to
microstrip interface and has the same total length (insertion phase) as the actual test board. The
“Thru” board must meet the same stringent requirements as the test board. The insertion loss
and insertion phase of the “Thru” board are measured and stored. This data is used to
completely de-embed the device under test from the test fixture. The de-embedded data is
available in S-parameter form on the Anaren website (www.anaren.com).
Note: The S-parameter files that are available on the anaren.com website include data for frequencies that are
outside of the specified band. It is important to note that the test fixture is designed for optimum performance through
2.3GHz. Some degradation in the test fixture performance will occur above this frequency and connector interface
discontinuities of –25dB or more can be expected. This larger discontinuity will affect the data at frequencies above
2.3GHz.
Circuit Board Layout
The dimensions for the Anaren test board are shown below. The test board is printed on Rogers RO4003 material
that is 0.032” thick. Consider the case when a different material is used. First, the pad size must remain the same to
accommodate the part. But, if the material thickness or dielectric constant (or both) changes, the reactance at the
interface to the coupler will also change. Second, the linewidth required for 50Ω will be different and this will introduce
a step in the line at the pad where the coupler interfaces with the printed microstrip trace. Both of these conditions will
affect the performance of the part. To achieve the specified performance, serious attention must be given to the
design and layout of the circuit environment in which this component will be used.
If a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance
that is present on the Anaren RO4003 test board. When thinner circuit board material is used, the ground plane will
be closer to the pad yielding more capacitance for the same size interface pad. The same is true if the dielectric
constant of the circuit board material is higher than is used on the Anaren test board. In both of these cases,
narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will
compensate for the extra capacitive reactance. If a thicker circuit board or one with a lower dielectric constant is used,
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-
03G
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the interface pad will have less capacitive reactance than the Anaren test board. In this case, a wider section of line
before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tuned will
match the performance of the Anaren test board.
Notice that the board layout for the 3dB couplers is different from that of the 30dB couplers. The test board for the
3dB couplers has all four traces interfacing with the coupler at the same angle. The test board for the 30dB couplers
has two traces approaching at one angle and the other two traces at a different angle. The entry angle of the traces
has a significant impact on the RF performance and these parts have been optimized for the layout used on
the test boards shown below.
3 dB Test Board
Testing Sample Parts Supplied on Anaren Test Boards
If you have received a coupler installed on an Anaren produced microstrip test board, please remember to remove the
loss of the test board from the measured data. The loss is small enough that it is not of concern for Return Loss and
Isolation/Directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss
of the coupler. An S-parameter file for a “Thru” board (see description of “Thru” board above) will be supplied upon
request. As a first order approximation, one should consider the following loss estimates:
Frequency Band
Avg. Ins. Loss of Test Board @ 25
°
C
410 – 480 MHz ~ 0.03dB
869-894 MHz ~0.064dB
925-960 MHz ~0.068dB
1805-1880 MHz ~0.119dB
1930-1990 MHz ~0.126dB
2110-2170 MHz ~0.136dB
The loss estimates in the table above come from room temperature measurements. It is important to note that the
loss of the test board will change with temperature. This fact must be considered if the coupler is to be evaluated at
other temperatures.
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E
C24A
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-
03G
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Peak Power Handling
At Sea-level
High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown
voltage of 2.0kV (minimum recorded value). This voltage level corresponds to a breakdown resistance capable of
handling at least 12dB peaks over average power levels, for very short durations. The breakdown location
consistently occurred across the air interface at the coupler contact pads (see illustration below). The breakdown
levels at these points will be affected by any contamination in the gap area around these pads. These areas must be
kept clean for optimum performance.
At High Altitudes
Breakdown voltage at high altitude reduces significantly comparing with the one at sea level. As an
example, plot below illustrates reduction in breakdown voltage of 1700 V at sea level with increasing altitude. The plot
uses Paschen’s Law to predict breakdown voltage variation over the air pressure.
It is recommended that the user test for voltage breakdown under the maximum operating conditions and over worst
case modulation induced power peaking. This evaluation should also include extreme environmental conditions (such
as high humidity) and physical conditions such as alignment of part to carrier board, cleanliness of carrier board etc.
Test Plan
Xinger couplers are manufactured in large panels and then separated. All parts are RF small signal tested and DC
tested for shorts/opens at room temperature in the fixture described above . (See “Qualification Flow Chart” section
for details on the accelerated life test procedures.)
Breakdown Voltage (Volts)
Altitude (ft)
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-
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Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
• Internal circuit temperature.
• Unit mounting interface temperature.
• Unit thermal resistance
• Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
• The unit has reached a steady state operating condition.
• Maximum mounting interface temperature is 95oC.
• Conduction Heat Transfer through the mounting interface.
• No Convection Heat Transfer.
• No Radiation Heat Transfer.
• The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
• Unit material stack-up.
• Material properties.
• Circuit geometry.
• Mounting interface temperature.
• Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta (∆T) divided by thermal resistance (R). The
dissipated power (Pdis) can also be calculated as a function of the total input power (Pin) and the thermal insertion loss
(ILtherm):
)(101 10 WP
R
T
P
therm
IL
indis
−⋅=
∆
=
−
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
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E
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-
03G
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Pin 1
Pin 4
Input Port
Coupled Port Direct Port
Isolated Port
PIn POut(RL) POut(ISO)
POut(CPL) POut(DC)
Figure 1
The coupler is excited at the input port with Pin (watts) of power. Assuming the coupler is not ideal, and that there are
no radiation losses, power will exit the coupler at all four ports. Symbolically written, Pout(RL) is the power that is
returned to the source because of impedance mismatch, Pout(ISO) is the power at the isolated port, Pout(CPL) is the
power at the coupled port, and Pout(DC) is the power at the direct port.
At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and
direct ports:
Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a
negative number. Obviously, a mere sign change equates the two quantities.
)dB(
PP
P
log10IL
)DC(out)CPL(out
in
10
+
⋅= (2)
In terms of S-parameters, IL can be computed as follows:
)dB(SSlog10IL 2
41
2
3110
+⋅−= (3)
We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the
isolated port.
For thermal calculations, we are only interested in the power lost “inside” the coupler. Since Pout(RL) is lost in the
source termination and Pout(ISO) is lost in an external termination, they are not be included in the insertion loss for
thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations:
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-
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)(log10
)()()()(
10 dB
PPPP
P
IL
RLoutISOoutDCoutCPLout
in
therm
+++
⋅= (4)
In terms of S-parameters, ILtherm can be computed as follows:
)(log10 2
41
2
31
2
21
2
1110 dBSSSSILtherm
+++⋅−= (5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (Pin) therefore is:
)(
101101 1010
W
R
T
P
P
thermtherm ILIL
dis
in
−
∆
=
−
=−− (6)
Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt):
)( CTTT o
mntcirc −=∆ (7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF
performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
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E
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-
03G
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Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines
leading to and from all of the RF ports. Also, there
must be a very good ground plane underneath the
part to ensure proper electrical performance. If
either of these two conditions is not satisfied,
electrical performance may not meet published
specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom
ground layers of the PCB. This minimizes ground
inductance and improves ground continuity. All of
the Xinger hybrid and directional couplers are
constructed from ceramic filled PTFE composites
which possess excellent electrical and mechanical
stability having X and Y thermal coefficient of
expansion (CTE) of 17-25 ppm/oC.
When a surface mount hybrid coupler is mounted to
a printed circuit board, the primary concerns are;
ensuring the RF pads of the device are in contact
with the circuit trace of the PCB and insuring the
ground plane of neither the component nor the PCB
is in contact with the RF signal.
Mounting Footprint
To ensure proper electrical and thermal performance there
must be a ground plane with 100% solder connection
underneath the part orientated as shown with text facing up
.430
[10.92]
.220
[5.59]
4X .040
[1.02]
4X 50Ω
Transmission
Line
Multiple plated thru
holes to ground
Dimensions are in inches [Millimeters]
XEC24A6-03G Mounting Footprint
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high
volume usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger Couplers are
available in ENIG finish. Dry packaging will be effective
for a least one year if stored at less than 40 °C and 90%
RH (see IPC/JEDEC J-STD-033). For more than one
year, shelf life and storage are similar to parts with Tin
Lead Finish.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This
coefficient minimizes solder joint stresses due to similar
expansion rates of most commonly used board
substrates such as RF35, RO4003, FR4, polyimide and
G-10 materials. Mounting to “hard” substrates (alumina
etc.) is possible depending upon operational temperature
requirements. The solder surfaces of the coupler are all
copper plated with either an immersion tin or tin-lead
exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
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-
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Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.069 gram
coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. Low and high
temperature thermal reflow profiles are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
Solder Joint Composition
The percentage by mass of gold in Xinger Couplers with
ENIG plating is low enough that it does not pose a gold
embrittlement risk.
Table below illustrates the configurations evaluated
assuming the ENIG plating thickness is min 7µin,
thickness of solder is 2000µin and thickness of Tin lead
plating is 200µin
Xinger
Finish
PCB Pad
Finish
Solder
Composition
%
Gold,Wt
1 ENIG Tin-lead Eutectic tin-lead <3%
2 ENIG ENIG Eutectic tin-lead <3%
3 ENIG Tin-lead Tin-silver <3%
4 ENIG ENIG Tin-silver <3%
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E
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-
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Figure 5 – Low Temperature Eutectic Solder ( 63/37) Reflow Thermal Profile
Figure 6 – High Temperature SnAg or SAC Solder Reflow Thermal Profile
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Qualification Flow Chart
Xinger
Product
Qualification
Visual Inspection
n=55
Mechanical Inspection
n=50
Solderability Test
n=
5
Initial RF Test
n=50
Visual Inspection
n=50
Automated Handler Testing
n=45
Visual Inspection
n=50
Post
Automated Handler Test
RF Test
n=50
Visual Inspection
n=50
Solder Units to Test
Board
n=25
Post Solder Visual
Inspection
n=25
Visual Inspection
n=25
RF Test at
-
55°C, 25°C,
95°C
n=20
Initial RF Test Board
Mounted
n=25
Visual Inspection
n=25
Post Resistance Heat RF
Test
n=20
Mechanical Inspection
n=20
Voltage Breakdown
Test MIL
202F, Method 301 25°C 5KV
n=
40
Visual Inspection
n=50
Control Units RF Test
25°C only
n=5
Loose
Control Un
its
n=5
Resistance to Solder
MIL 202G
Method 210F, Condition K Heat
n=20
Loose
Control Un
its
n=5
Control Units
n=5
Loose Control Units
n=5
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model
X
E
C24A
6
-
03G
Rev A
Control U nits
n=10
Post Voltage RF Test
n=50
Thermal Cycle
100
cycles
-
55°
to
125°C. Dwell time= 30 min
n=40
Visual Inspection
n=50
Control Units
n=10
Visual Inspection
n=50
Bake Units for 1 hour at
100° to 120°C
n=40
125% Power
Life Test 72 hrs
n= 3
Post Bake RF Test
n=50
Visual Inspection
n=30
Microsection
3 test units 1 control
Final RF Test @ 25°C
n=
2
5
Microsection
2 Life, 1 high power and
1 control
Post Moisture Resistance
RF Test
n=50
Post Thermal RF Test
n=50
Moisture Resistanc e Testing -25° to 65°C for 2
hrs @ 90% humidity. Soak for 168 hr s at 90% to
85% humidity. Ramp temp to 25°C in 2 hrs @
90% humidity. Then soak @ -10°C for 3 hrs.
n=40
Post
Moisture Resistance
RF Test n=50
Control Units
n=10
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model
XE
C24
A
6
-
03G
Rev A
B
ØA ØC
TABLE 1: REEL DIMENSIONS (mm)
XEC24A6-03GR
XEC24A6-03GR1
QUANTITY/REEL ØA ØC ØD
B
1000
250
330.00
330.00
24.0
24.0
102.03
177.80
13.00
13.00
Packaging and Ordering Information
Parts are available in a reel. Packaging follows EIA 481-D for reels. Parts are oriented in tape and reel as shown
below. See Model Numbers below for further ordering information.
.945
[24.00]
.582
[14.78]
.373
[9.47]
.472
[12.00]
.157
[4.00]
.079
[2.00] .069
[1.75]
.453
[11.50]
.157
[4.00]
A
A
SECTION A-A Direction of
Part Feed
(unloading)
Dimensions are in Inches [MM]
.014
[.36]
Ø.059
[Ø1.50]
Ø.059
[Ø1.50]
