Semiconductor Components Industries, LLC, 1996
July, 2019 − Rev. 3
1Publication Order Number:
NC7SZ126/D
NC7SZ126
TinyLogic UHS Buffer with
Three-State Output
Description
The NC7SZ126 is a single buffer with three−State output from
ON Semiconductor’s Ultra−High Speed (UHS) series of TinyLogic.
The device is fabricated with advanced CMOS technology to achieve
ultra−high speed with high output drive while maintaining low static
power dissipation over a broad VCC operating range. The device is
specified to operate over the 1.65 V to 5.5 V VCC operating range. The
inputs and output are high impedance above ground when VCC is 0 V.
Inputs tolerate voltages up to 5.5 V independent of VCC operating
voltage. The output tolerates voltages above VCC in the 3−STATE
condition.
Features
•Ultra−High Speed: tPD 2.6 ns (Typical) into 50 pF at 5 V VCC
•High Output Drive: ±24 mA at 3 V VCC
•Broad VCC Operating Range: 1.65 V to 5.5 V
•Matches Performance of LCX when Operated at 3.3 V VCC
•Power Down High−Impedance Inputs / Outputs
•Over−Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
•Proprietary Noise / EMI Reduction Circuitry
•Ultra−Small MicroPak Packages
•Space−Saving SC−74A and SC−88A Packages
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
Y
OE
1
A
EN
7Z26T
FF, 7Z26, Z26 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
T = Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= Eight−Week Datacoding Scheme
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
SC−88A
CASE 419AC−01
SIP6
CASE 127EB
UDFN6
CASE 517DP
FFKK
XYZ
FFKK
XYZ
Z26T
Pin 1
Pin 1
SC−74A
CASE 318BQ
NC7SZ126
www.onsemi.com
2
Pin Configurations
OE
A
VCC
GND Y
1
2
3
5
4
Figure 2. SC−88A and SC−74A (Top View)
OE 1 6 VCC
A 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
Pin # SC−88A /
SC74A Pin # MicroPak Name Description
1 1 OE Input
2 2 A Input
3 3 GND Ground
4 4 Y Output
5 6 VCC Supply Voltage
5 NC No Connect
FUNCTION TABLE
Inputs Output
OE In A Out Y
H L L
H H H
L X Z
H = HIGH Logic Level
L = LOW Logic Level
X = HIGH or LOW Logic Level
Z = HIGH Impedance State
NC7SZ126
www.onsemi.com
3
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.0 V
VIN DC Input Voltage −0.5 6.0 V
VOUT DC Output Voltage −0.5 6.0 V
IIK DC Input Diode Current VIN < −0.5 V − −50 mA
VIN > 6.0 V −+20
IOK DC Output Diode Current VOUT < −0.5 V − −50 mA
VOUT > 6 V, VCC = GND −+20
IOUT DC Output Current −±50 mA
ICC or IGND DC VCC or Ground Current −±50 mA
TSTG Storage Temperature Range −65 +150 °C
TJJunction Temperature Under Bias −+150 °C
TLJunction Lead Temperature (Soldering, 10 Seconds) −+260 °C
PDPower Dissipation in Still Air SC−74A −225 mW
SC−88A−5−190
MicroPak−6−327
MicroPak2−6−327
ESD Human Body Model, JEDEC: JESD22−A114 −4000 V
Charge Device Model, JEDEC: JESD22−C101 −2000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating 1.65 5.50 V
Supply Voltage Data Retention 1.50 5.50
VIN Input Voltage 0 5.5 V
VOUT Output Voltage Active State 0 VCC V
Three−State 0 5.5
TAOperating Temperature −40 +85 °C
tr, tfInput Rise and Fall Times VCC = 1.8 V, 2.5 V ±0.2 V 0 20 ns/V
VCC = 3.3 V ±0.3 V 0 10
VCC = 5.0 V ±0.5 V 0 5
JA Thermal Resistance SC−74A −555 °C/W
SC−88A−5−659
MicroPak−6−382
MicroPak2−6−382
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
NC7SZ126
www.onsemi.com
4
DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
VIH HIGH Level Input Voltage 1.65 to 1.95 0.65 VCC − − 0.65 VCC −V
2.30 to 5.50 0.70 VCC − − 0.70 VCC −
VIL LOW Level Input Voltage 1.65 to 1.95 − − 0.35 VCC −0.35 VCC V
2.30 to 5.50 − − 0.30 VCC −0.30 VCC
VOH HIGH Level Output Voltage 1.65 VIN = VIH,
IOH = −100 A
1.55 1.65 −1.55 −V
1.80 1.70 1.80 −1.70 −
2.30 2.20 2.30 −2.20 −
3.00 2.90 3.00 −2.90 −
4.50 4.40 4.50 −4.40 −
1.65 IOH = −4 mA 1.29 1.52 −1.29 −
2.30 IOH = −8 mA 1.90 2.15 −1.90 −
3.00 IOH = −16 mA 2.40 2.80 −2.40 −
3.00 IOH = −24 mA 2.30 2.68 −2.30 −
4.50 IOH = −32 mA 3.80 4.20 −3.80 −
VOL LOW Level Output Voltage 1.65 VIN = VIL,
IOL = 100 A
−0.00 0.10 −0.10 V
1.80 −0.00 0.10 −0.10
2.30 −0.00 0.10 −0.10
3.00 −0.00 0.10 −0.10
4.50 −0.00 0.10 −0.10
1.65 IOL = 4 mA −0.80 0.24 −0.24
2.30 IOL = 8 mA −0.10 0.30 −0.30
3.00 IOL = 16 mA −0.15 0.40 −0.40
3.00 IOL = 24 mA −0.22 0.55 −0.55
4.50 IOL = 32 mA −0.22 0.55 −0.55
IIN Input Leakage Current 1.65 to 5.5 VIN = 5.5 V, GND − − ±1−±10 A
IOZ 3−STATE Output Leakage 0 to 5.5 VIN = VIH or VIL
VO = VCC or GND
− − ±1−±10 A
IOFF Power Off Leakage Current 0 VIN or VOUT = 5.5 V − − 1−10 A
ICC Quiescent Supply Current 1.65 to 5.50 VIN = 5.5 V, GND − − 2−20 A
NC7SZ126
www.onsemi.com
5
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
tPLH, tPHL Propagation Delay (Figure 4, 6) 1.65 CL = 15 pF,
RD = 1 M
S1=OPEN
−6.4 13.2 −13.8 ns
1.80 −5.3 11.0 −11.5
2.50 ±0.20 −3.4 7.5 −8.0
3.30 ±0.30 −2.5 5.2 −5.5
5.00 ±0.50 −2.1 4.5 −4.8
3.30 ±0.30 CL = 50 pF,
RD = 500
S1 = OPEN
−3.2 5.7 −6.0
5.00 ±0.50 −2.6 5.0 −5.3
tPZL, tPZH Output Enable Time
(Figure 4, 6)
1.65 CL = 50 pF,
RD = 500
RU = 500
S1 = GND for tPZH
S1 = VIN for tPZL
VIN = 2 · VCC
−8.4 15.0 −15.6 ns
1.80 −6.1 11.5 −12.0
2.50 ±0.20 −3.8 8.0 −8.5
3.30 ±0.30 −3.2 5.7 −6.0
5.00 ±0.50 −2.3 5.0 −5.3
tPLZ, tPHZ Output Disable Time
(Figure 4, 6)
1.65 CL = 50 pF,
RD = 500
RU = 500
S1 = GND for tPHZ
S1 = VIN for tPLZ
VIN = 2 · VCC
−6.5 13.2 −14.5
1.80 −5.6 11.0 −12
2.50 ±0.20 −4.0 8.0 −8.5
3.30 ±0.30 −3.5 5.7 −6.0
5.00 ±0.50 −2.5 4.7 −5.0
CIN Input Capacitance 0.00 −4− − − pF
COUT Output Capacitance 0.00 −8− − − pF
CPD Power Dissipation Capacitance
(Note 2) (Figure 5)
3.30 −17 − − − pF
5.00 −24 − − −
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
NC7SZ126
www.onsemi.com
6
NOTE:
3. CL includes load and stray capacitance;
Input PRR = 1.0 MHz; tW = 500 ns
Figure 4. AC Test Circuit
NOTE:
4. Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
A
INPUT
VCC
Figure 5. ICCD Test Circuit
VCC
CLRD
INPUT OUTPUT
OE INPUT RU GND
OPEN
VI
OUTPUT
OE
Figure 6. AC Waveforms
ORDERING INFORMATION
Part Number Top Mark Packages Shipping†
NC7SZ126M5X 7Z26 SC−74A 3000 / Tape & Reel
NC7SZ126P5X Z26 SC−88A 3000 / Tape & Reel
NC7SZ126L6X FF MicroPak 5000 / Tape & Reel
NC7SZ126FHX FF MicroPak2 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NC7SZ126
www.onsemi.com
8
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
NC7SZ126
www.onsemi.com
9
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
E1
D
A
L
L1 L2
ee
bA1
A2
c
TOP VIEW
SIDE VIEW END VIEW
1
1
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
E
SYMBOL MIN NOM MAX
θ
A
A1
b
c
D
E
E1
e
L
0º 8º
L2
0.00
0.15
0.10
0.26
1.80
1.80
1.15
0.65 BSC
0.15 BSC
1.10
0.10
0.30
0.18
0.46
2.20
2.40
1.35
L1
0.80
θ1 4º 10º
A2 0.80 1.00
0.42 REF
0.36
2.00
2.10
1.25
NC7SZ126
www.onsemi.com
11
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
NC7SZ126/D
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
◊
