©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
MPSA05/MMBTA05
Absolute Maximum Ratings TC=25°C unless otherwise noted
Electrical Characteristics TC=25°C unless otherwise noted
* Pulse Test: Pulse Width 300µs, Duty Cycle 2.0%
Thermal Charac teris tics TA=25°C unless otherwise noted
* Device mounted on FR-4 PCB 1.6” × 0.06"
Symbol Parameter Value Units
VCEO Collector-Emitter Voltage 60 V
VCBO Collector-Base Voltage 60 V
VEBO Emitter-Base Voltage 4.0 V
ICCollector current - Continuous 500 mA
TJ, Tstg Junction and Storage Temperature -55 ~ +150 °C
Symbol Parameter Test Cond ition Min. Typ. Max. Units
Off Characteristics
V(BR)CEO Collector-E mit ter Br eakdown Volt age * IC = 1mA, IB = 0 60 V
V(BR)EBO Emitter-Base Breakdown Volt age IC = 100µA, IC = 0 4 V
ICEO Collector Cutoff Current VCE = 60V, IB = 0 0.1 µA
ICBO Emitter Cutoff Current VCB = 60V, IE = 0 0.1 µA
On Characteristics
hFE DC Current Gain IC = 10mA, VCE = 1.0V
IC = 100mA, VCE = 1.0V 100
100
VCE(sat) Collector-Emitter Saturation Voltage IC = 100mA, IB = 10mA 0.25 V
VBE(on) Base-Emitter On Voltage IC = 100mA, VCE = 1.0V 1.2 V
Small Signal Characteristics
fTCurrent Gain Bandwidth Product IC = 10mA, VCE = 2V,
f = 100MHz 100 MHz
Symbol Parameter Max. Units
MPSA05 *MMBTA05
PDTotal Device Dissipation
Derate above 25°C625
5350
2.8 mW
mW/°C
RθJC Thermal Resistance, Junction to Case 83.3 °C/W
RθJA Thermal Resistance, Junction to Ambient 200 357 °C/W
MPSA05/MMBTA05
NPN General Purpose Amplifier
This device is designed for general purpose amplifier
applications at collector currents to 300mA.
Sourced from process 10.
SOT-23
1. Base 2. Emitter 3. Collector
1
2
3
Mark: 1H
TO-92
1
1. Emitter 2. Base 3. Collector
Package Dimensions
MPSA05/MMBTA05
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
0.46 ±0.10
1.27TYP
(R2.29)
3.86MAX
[1.27 ±0.20]1.27TYP
[1.27 ±0.20]
3.60 ±0.20
14.47 ±0.40
1.02 ±0.10
(0.25) 4.58 ±0.20
4.58 +0.25
–0.15
0.38 +0.10
–0.05
0.38 +0.10
–0.05
TO-92
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
MPSA05/MMBTA05
Package Dimensions (Continued)
0.96~1.14
0.12
0.03~0.10
0.38 REF
0.40 ±0.03
2.90 ±0.10
0.95 ±0.03 0.95 ±0.03
1.90 ±0.03 0.508REF
0.97REF 1.30 ±0.10 0.45~0.60
2.40 ±0.10
+0.05
0.023
0.20 MIN
0.40 ±0.03
SOT-23
Dimensions in Millimeters
©2002 Fairchild Semiconductor Corporation Rev. I1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all su ch trademarks .
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY A NY LICENSE UNDER ITS PATENT RIGHTS, N OR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devic es or syst em s
which, (a) ar e intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a lif e support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconduct or reserv es the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
FACT™
FACT Quiet series™
FAST®
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
ImpliedDisconnect™
ISOPLANAR™
LittleFET
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
SILENT SWITCHER®
SMART START™
SPM™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation
UHC™
UltraFET®
VCX™
ACEx™
ActiveArray™
Bottomless
CoolFET™
CROSSVOLT
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
Across the board. Around the world.™
The Power Franchise™
Programmab le Acti ve Droo p™