EMS12HHA-33.333M RoHS Pb EMS12 H H A -33.333M Series RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD 2.5Vdc LVCMOS MEMS Spread Spectrum Oscillator Frequency Tolerance/Stability 50ppm Maximum over -40C to +85C Nominal Frequency 33.333MHz Spread Spectrum 0.25% Center Spread Output Control Function Tri-State (Disabled Output High Impedance) ELECTRICAL SPECIFICATIONS Nominal Frequency 33.333MHz Frequency Tolerance/Stability 50ppm Maximum over -40C to +85C (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, 260C Reflow, Shock, and Vibration) Aging at 25C 1ppm Maximum First Year Supply Voltage 2.5Vdc 10% Maximum Supply Voltage -0.5Vdc to +3.65Vdc Input Current 35mA Maximum (Unloaded; Nominal Vdd) Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 2nSec Maximum (Measured from 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Output Control Function Tri-State (Disabled Output High Impedance) Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output Disable Current 20mA Maximum (Disabled Output: High Impedance) (Pad 1=Ground) Spread Spectrum 0.25% Center Spread Modulation Frequency 30kHz Minimum, 32kHz Typical, 35kHz Maximum Period Jitter 40pSec Maximum (Cycle to Cycle; Spread Spectrum-On; Fo=133.333M, Vdd=2.5Vdc) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only) Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 3/12/2011 | Page 1 of 5 EMS12HHA-33.333M MECHANICAL DIMENSIONS (all dimensions in millimeters) 0.85 0.15 5.00 0.15 1.20 0.10 (x4) 2.1 0.08 MAX 2 7.00 0.15 5.08 0.10 2.60 0.15 R0.70 0.10 1.70 A 1 C0.25 0.10 3 PIN CONNECTION 1 Tri-State (High Impedance) 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1 XXXX or XXXXX XXXX or XXXXX=Ecliptek Manufacturing Lot Code 4 1.40 0.10 (x4) Note A: Center paddle is connected internally to oscillator ground (Pad 2). Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 3/12/2011 | Page 2 of 5 EMS12HHA-33.333M CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down or Spread Disable Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 3/12/2011 | Page 3 of 5 EMS12HHA-33.333M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 3/12/2011 | Page 4 of 5 EMS12HHA-33.333M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 3/12/2011 | Page 5 of 5