(1,27 mm) .050"
SEAF SERIES
SEAF–30–05.0–S–08–2–A–K–TR
SEAF–20–05.0–S–10–2–A–K–TR
SEAF–30–05.0–S–08–2–A–LP–K–TR
Up to
500 Pins
5, 8 and 10 row footprint
compatible with SamArray®.
Samples recommended.
Solder
charges
Low
Insertion/
Extraction
Forces
WWW.SAMTEC.COM
Mates with:
SEAM, SEAMP,
SEAR, SEAMI,
SEAC (Requires –LP)
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?SEAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Solder Charge:
95.5% Sn, 3.8% Ag, 0.7% Cu
(Tin/Lead also available.
Call Samtec.)
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Contact Resistance:
5.5 mΩ
Working Voltage:
240 VAC
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SPECIFICATIONS
Note: Some sizes, styles and
options are non-standard,
non-returnable.
100 GbE
Fibre Channel
Rapid I/O
PCI Express
®
SATA
InfiniBand
™
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
PISMO 2
VITA 47
VITA 57
Industry
Standards
Protocols
Supported
DIFFERENTIAL
(1,27) .050
(1,27)
.050
PAIR
COUNT
ARRAY
80
60
75
60
45
50
40
25
40x8
40x6
30x10
30x8
30x6
20x10
20x8
20x5
PAIR
COUNT
ARRAY
125
100
100
50x10
50x8
40x10
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 30µ" Gold
TM
Call Samtec for maximum cycles mated with SEAM
HIGH SPEED/HIGH DENSITY OPEN PIN FIELD
LEAD
STYLE A
–05.0 (5,05) .199
–06.0 (6,05) .238
–06.5 (6,55) .258
No. of positions x
(1,27) .050 + (5,82) .229
No. of positions x
(1,27) .050 + (3,58) .141
A
(0,20)
.008
(1,27) .050 (1,27)
.050
01
08
(1,27)
.050
(1,12) .044 DIA
(1,78)
.070
(15,49)
.610
B
–LP
SEAF 2 A K TR
PLATING
OPTION
NO. OF
ROWS
LEAD
STYLE
–04
=Four
Rows
–05
=Five
Rows
–06
=Six
Rows
–08
=Eight
Rows
–10
=Ten
Rows
–2
= Lead-Free
Solder Charge
–K
= Polyimide
fi lm Pick &
Place Pad)
(Not available
with –10 and
–15 pins
with –LP
Latch post)
–LP
= Latch
Post
(–LP
required
for SEAC
mate only)
(Available
with –05.0
lead style
and –04,
–06, –08
& –10
rows only)
Specify
LEAD
STYLE
from
chart
NO. PINS
PER ROW
–L
= 10µ"
(0,25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
= 30µ"
(0,76 µm)
Gold on
contact area,
Matte Tin on
solder tail
OPTION
–10, –15, – 20,
– 30, –40, –50
(–10 only available in 04 row)
(–15 only available in 10 row)
F-213-1
NO. OF
ROWS B
–04 (5,66) .223
–05, –06 (8,20) .323
–08 (10,74) .423
–10 (13,28) .523
SEAM/SEAF
7 mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling 9.5 GHz / 19 Gbps 12.5 GHz / 25 Gbps
Differential Pair Signaling 10.5 GHz / 21 Gbps 13 GHz / 26 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?SEAF or contact sig@samtec.com
(1,15 mm)
.045"
NOMINAL
WIPE
f
i
n
a
l
i
n
c
h
.
c
o
m
®
PATENT PENDING CURRENT RATING
(PER CONTACT)
AMBIENT
TEMP SEAM/SEAF
20°C 2.3A
40°C 2A
60°C 1.75A
95°C 1.14A
30 ADJACENT
POSITIONS POWERED
MATED HEIGHTS
SEAM
LEAD
STYLE
SEAF LEAD STYLE
–05.0 –06.0 –06.5
–02.0 7 mm 8 mm 8.5 mm
–03.0 8 mm 9 mm 9.5 mm
–03.5 8.5 mm 9.5 mm 10 mm
–06.5 11.5 mm 12.5 mm 13 mm
–07.0 12 mm 13 mm 13.5 mm
–09.0 14 mm 15 mm 15.5 mm
–11.0 16 mm 17 mm 17.5 mm
