THC63LVDF84B-5S - THine Electronics, Inc.

THC63LVDF84B(5S)_Rev.1.10_E

Security E

THC63LVDF84B(5S)

LVDS 24Bit COLOR HOST-LCD PANEL INT ERFACE RECEIVER(Falling Edge Clock)

General Description

The THC63LVDF84B(5S) receiver convert the four

LVDS(Low Voltage Differential Signaling) data streams

back into 28bits of CMOS/TTL data with fallin g edge

clock.

At a transmit clock frequency of 65MHz, 24bits of RGB

data and 4bits of LCD timing and control data

(HSYNC, VSYNC, CNTL1, CNTL2) are transmitted at

a rate of 1.8Gbps.

Features

•Wide dot clock range: 20-65MHz suited for VGA,

SVGA and XGA

•PLL requires No external components

•Low power consumption

•Power-Down Mode

•Low profile 56 Lead TSSOP Package

•Pin compatible with THC63LVDF84A

Block Diagram

LVDS TO TTL PARALLEL

PLL

RA +/-

RB +/-

RC +/-

RD +/-

RCLK +/-

/PDWN

RA0-6

RC0-6

RD0-6

RECEIVER

(20 to 65MHz)

CMOS/TTL

RB0-6

OUTPUT

CLOCK

(LVDS)20 to 65MHz

DATA

(LVDS)

(140-455Mbit/On Each LVDS Channel)

7

CLOCK OUT

THC63LVDF84B(5S)

THC63LVDF84B(5S) _Rev.1.10_E

Security E

Pin Out

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

RC3

RD6

RC4

GND

RC5

RC6

RD0

LVDSGND

RA-

RA+

RB-

RB+

LVDSVCC

LVDSGND

RC-

RC+

RCLK-

RCLK+

RD-

RD+

LVDSGND

PLLGND

PLLVCC

PLLGND

/PDWN

CLKOUT

RA0

GND

VCC

RC2

RC1

RC0

GND

RB6

RD5

RD4

VCC

RB5

RB4

RB3

GND

RB2

RD3

RD2

VCC

RB1

RB0

RA6

GND

RA5

RD1

RA4

RA3

VCC

RA2

RA1

THC63LVDF84B(5S)

Pin Description

Pin Name Pin # Type Description

RA+, RA- 10, 9 LVDS IN

LVDS Data Inputs

RB+, RB- 12, 11 LVDS IN

RC+, RC- 16, 15 LVDS IN

RD+, RD- 20, 19 LVDS IN

RCLK+, RCLK- 18, 17 LVDS IN LVDS Clock Inputs

RA0~RA6 27,29,30,32,33,35,37 OUT

Pixel Data Outputs

RB0~RB6 38,39,43,45,46,47,51 OUT

RC0~RC6 53,54,55,1,3,5,6 OUT

RD0~RD6 7,34,41,42,49,50,2 OUT

CLKOUT 26 OUT Pixel Clock Output

/PDWN 25 IN H: Normal operation

L: Power down (all outputs are pulled to ground )

VCC 31,40,48,56 Power Power Supply Pins for TTL outputs and digital

circuitry

GND 4,28,36,44,52 Ground Ground Pins for TTL outputs and digital circuitry

LVDSVCC 13 Power Power Supply Pin for LVDS inputs

LVDSGND 8,14,21 Ground Ground Pins for LVDS inputs

PLLVCC 23 Power Power Supply Pin for PLL circuitry

PLLGND 22,24 Ground Ground Pins for PLL circuitry

THC63LVDF84B(5S) _Rev.1.10_E

Security E

Electrical Characteristics

CMOS/TTL DC SPECIFICATIONS VCC = VCC = PLL VCC = LVDS VCC

LVDS RECEIVER DC SPECIFICATIONS VCC = VCC = PLL VCC = LVDS VCC

Absolute Maximum Ratings1

Supply Voltage (Vcc) -0.3 to +4V

CMOS/TTL Input Voltage -0.3 to (Vcc + 0.3V)

CMOS/TTL Output Voltage -0.3V to (Vcc + 0.3V)

LVDS Receiver Input Voltage -0.3V to (Vcc + 0.3V)

Junction Temperature +125

Storage Temperature Range -55 to +150

Resistance to soldering heat +260 /10sec

Maximum Power Dissipation@25 0.5W

Recommended Operating Conditions

Symbol Parameter Conditions Min. Typ. Max. Units

VIH High Level Input Voltage 2.0 VCC V

VIL Low Level Input Voltage GND 0.8 V

VOH1 High Level Output Voltage IOH = -4mA 2.4 V

VOL1 Low Level Output Voltage IOL = 4mA 0.4 V

IIN Input Current uA

Symbol Parameter Conditions Min. Typ. Max. Units

VTH Differential Input High Threshold VOC = +1.2V 100 mV

VTL Differential Input Low Thre sh old -10 0 mV

IIN Input Current VIN = +2.4V/0V

VCC = 3.6V uA

1. “Absolute Maximum Ratings” are those valued beyond whi c h the safety of the devi ce can not be guaranteed. They

are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics”

specify conditions for device operation.

Parameter Min Typ Max Unit

All Supply Voltage 3.0 3.3 3.6 V

Operating Ambient Temperature -40 85

Differential CLKIN Frequency 20 65 MHz

0V VIN VCC≤≤ 10±

10±

°C

°C°C

°C

THC63LVDF84B(5S) _Rev.1.10_E

Security E

Supply Current VCC = VCC = PLL VCC = LVDS VCC

Symbol Parameter Condition(*) Typ. Max. Units

IRCCG Receiver Supply Current

16Grayscale Pattern CL=8pF, VCC=3.3V

f = 65MHz

41 53 mA

IRCCW Receiver Supply Current

Worst Case Pattern 72 94 mA

IRCCS Receiver Power Down

Supply Current /P DWN = L 10 mA

CLKIN

Rx0

Rx1

Rx2

Rx3

Rx4

Rx5

Rx6

16 Gray Scale Pattern

CLKIN

EVEN RxIN

ODD RxIN

Worst Case Pattern

THC63LVDF84B(5S) _Rev.1.10_E

Security E

Switching Characteristics VCC =VCC = PLL VCC = LVDS VCC

Symbol Parameter Min. Typ. Max. Units

tRCP CLK OUT Period 15.4 T 50.0 ns

tRCH CLK OUT High Time 4T/7 ns

tRCL CLK OUT Low Time 3T/7 n s

tRCD RCLK +/- to CLK OUT Delay 5T/7 ns

tRS TTL Data Setup to CLK OUT 0.35T-0.3 ns

tRH TTL Data Hold from CKL OUT 0.45T-1.6 ns

tTLH TTL Low to High Transition Time 2.0 3.0 ns

tTHL TTL High to Low Transition Time 1.8 3.0 ns

tRIP1 Input Data Position0 (T = 11.76ns) -0.4 0.0 +0.4 ns

tRIP0 Input Data Position1 (T = 11.76ns) T/7-0.4 T/7 T/7+0.4 ns

tRIP6 Input Data Position2 (T = 11.76ns) 2T/7-0.4 2T/7 2T/7+0.4 ns

tRIP5 Input Data Position3 (T = 11.76ns) 3T/7-0.4 3T/7 3T/7+0.4 ns

tRIP4 Input Data Position4 (T = 11.76ns) 4T/7-0.4 4T/7 4T/7+0.4 ns

tRIP3 Input Data Position5 (T = 11.76ns) 5T/7-0.4 5T/7 5T/7+0.4 ns

tRIP2 Input Data Position6 (T = 11.76ns) 6T/7-0.4 6T/7 6T/7+0.4 ns

tRPLL Phase Lock Loop Set 10.0 ms

AC Timing Diagrams

TTL Output

8pF 20%

80%

20%

80%

tTLH tTHL

TTL Output

TTL Output Load

THC63LVDF84B(5S) _Rev.1.10_E

Security E

AC Timing Diagrams

Vdiff = 0V

Rx+/- Rx6 Rx5 Rx4 Rx3 Rx2 Rx1 Rx0

Vdiff = 0V

tRIP2

tRIP3

tRIP4

tRIP5

tRIP6

tRIP0

tRIP1

tRCD

RCLK+

tRCH tRCL

tRCP

CLKOUT

tRS tRH

DATA VALID

Rx0 - Rx6

VCC/2

VCC/2 VCC/2

VCC/2

VCC/2 VCC/2

Note:

1) Vdiff = (RA+) - (RA-), ... ... (RCLK+) - (RCLK-)

DATA VALID

THC63LVDF84B(5S) _Rev.1.10_E

Security E

AC Timing Diagrams

Phase Lock Loop Set Time

VCC tRPLL

/PDWN

3.6V

RCLK+/-

CLKOUT VCC/2

VCC/2

THC63LVDF84B(5S)_Rev.1.10_E

Security E

Note

1)Power On Sequence

Power on LVDS-Tx after THC63LVDF84B(5S).

2)Cable Connection and Disconnection

Don't connect and disconnect the LVDS cable, when the power is supplied to the system .

3)GND Connection

Connect the each GND of the PCB which LVDS-Tx and THC63LVDF84B(5S) on it. It is better for EMI reduction to

place GND cable as close to LVDS cable as possible.

4)Multi Drop Connection

Multi drop connection is not recommended.

5)Asynchronous use

Asynchronous use such as following systems are not recommended.

THC63LVDF84B(5S)

TCLK+

TCLK-

LVDS-Tx

TCLK+

TCLK- THC63LVDF84B(5S)

TCLK+

TCLK- THC63LVDF84B(5S)

CLKOUT

DATA

IC

LVDS-Tx

CLKOUT

DATA

CLKOUT

DATA

IC

TCLK+

TCLK- THC63LVDF84B(5S)

TCLK+

TCLK- THC63LVDF84B(5S)

CLKOUT

DATA

ICIC

THC63LVDF84B(5S) _Rev.1.10_E

Security E

Package

56 Lead Molded Thin Shrink Small Outline Package, JEDEC

(1.0)

0.10 0.05±

1.2 MAX

0.20 TYP0.50 TYP

8.1 0.1±

4.05

128

6.1 0.1±

14.0 0.1±

2956

Unit : millimeters

THC63LVDF84B(5S) _Rev.1.10_E

Security E

Notices and Requests

1. The product specifications described in this material are subject to change without prior notice.

2. The circuit diagrams described in this material are examples of the application which may not

always apply to the customer's design. We are not responsible for possible errors and omissions

in this material. Please note if errors or omissions should be found in this material, we may not

be able to correct them immediately.

3. This material contains our copy right, know-how or other proprietary. Copying or disclosing to

third parties the contents of this material without our prior permission is prohibited.

4. Note that if infringement of any third party's industrial ownership should occur by using this

product, we will be exempted from the responsibility unless it directly relates to the production

process or functions of the product.

5. Product Application

5.1 Application of this product is intended for and limited to the following applications: audio-

vide deice, officce automation device, communication device, consumer electronics, smart-

phone, feature phone, and amusement machinedevice. This product must not be used for appli-

cations that require extremely high-reliability/safety such as aerospace device, traffic device,

transportation device, nuclear power control device, combustion chamber device, medical

device related to critical care, or any kind of safety device.

5.2 This product is not intended to be used as an automotive part, unless the product is specified

as a product conforming to the demandes and specifications of ISO/TS16949 (“the specified

Product”) in this data sheet. THine Electronics, Inc.(“THine”) accepts no liability what so every

for any product other tha n the Specified Product for it not conforming to the afore mentioned

demands and specifications.

5.3 THine accepts liability for demands and specifications of the Specified Product only to the

extent that the user and THine have been previously and explicitly agreed to each other.

6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur

with a certain small probability, which is inevitable to a semi-conductor product. Therefore, you

are encouraged to have suff iciently redundant or error preventive design applied to the use of the

product so as not to have our product cause any social or public damage.

7. Please note that this product is not designed to be radiation-proof.

8. Customers are asked, if required, to judge by themselves if this product falls under the category

of strategic goods under the Foreign Exchange and Foreign Trade Control Law.

THine Electronics, Inc.

E-mail: sales@thine.co.jp