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TechnischeInformation/TechnicalInformation
FF200R12KE4P
IGBT-Modul
IGBT-Module
preparedby:AKB
approvedby:MK
dateofpublication:2016-04-04
revision:V2.0
VorläufigeDaten
PreliminaryData
IGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1200 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TH = 85°C, Tvj max = 175°C IC nom 200 A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 400 A
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage
IC = 200 A, VGE = 15 V
IC = 200 A, VGE = 15 V
IC = 200 A, VGE = 15 V
VCE sat
1,75
2,00
2,05
2,15 V
V
V
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 7,60 mA, VCE = VGE, Tvj = 25°C VGEth 5,20 5,80 6,40 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG1,80 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 3,8 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 14,0 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 0,50 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload
IC = 200 A, VCE = 600 V
VGE = ±15 V
RGon = 2,7 Ω
td on 0,20
0,25
0,27
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Anstiegszeit,induktiveLast
Risetime,inductiveload
IC = 200 A, VCE = 600 V
VGE = ±15 V
RGon = 2,7 Ω
tr0,045
0,05
0,055
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload
IC = 200 A, VCE = 600 V
VGE = ±15 V
RGoff = 2,7 Ω
td off 0,50
0,60
0,62
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Fallzeit,induktiveLast
Falltime,inductiveload
IC = 200 A, VCE = 600 V
VGE = ±15 V
RGoff = 2,7 Ω
tf0,10
0,16
0,18
µs
µs
µs
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse
IC = 200 A, VCE = 600 V, LS = 30 nH
VGE = ±15 V, di/dt = 4000 A/µs (Tvj = 150°C)
RGon = 2,7 ΩEon
10,0
15,0
17,0
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse
IC = 200 A, VCE = 600 V, LS = 30 nH
VGE = ±15 V, du/dt = 4000 V/µs (Tvj = 150°C)
RGoff = 2,7 ΩEoff
17,0
26,0
29,0
mJ
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Tvj = 150°C
Kurzschlußverhalten
SCdata
VGE ≤ 15 V, VCC = 800 V
VCEmax = VCES -LsCE ·di/dt ISC 800 A
Tvj = 150°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisKühlkörper
Thermalresistance,junctiontoheatsink
proIGBT/perIGBT
validwithIFXpre-appliedthermalinterfacematerial RthJH 0,162 K/W
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 150 °C