ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-51928XXXEPN Effective : 27-SEP-2000 14:46:03 Package : EPN 40 LEAD PDIP Metal ID : Issue : 0 Status : RELEASED Scale : 20X Printed : 14-MAY-2001 08:56:04 EST PLASTIC_PKG Data as of 14-MAY-2001 08:56:27 by sherpa at farview Die Area: 18375 sq mils (11.855 sq mm) Die size: X = 147 mils (3734 microns) Y = 125 mils (3175 microns) Thickness = 20 mils 84-1LMISR4 Die Attach 1.2 MIL GOLD Bond Wire S6300H Mold Compound R004-0041 Frame Special Note : 1) OFFSET DIE FROM CENTER LINE TO RIGHT, SEE ABOVE. PAD 1 BACKSIDE VIEW Cavity size Y .200 X .200 These Drawings & Specifications are the Property of Intersil Corp. & shall not be used, reproduced or copied without Written Permission.