MOTOROLA SEMICONDUCTOR TECHNICAL DATA General Purpose Transistors BC856AWT1,BWT1 PNP Silicon BC857AWT1,BWT1 BC858AWT1,BWT1, These transistors are designed for general purpose amplifier applications. They are housed in the SOT-323/SC-70 which is designed for low power surface mount applications. CWT1 COLLECTOR 3 Motorola Preferred Devices 1 BASE 3 2 EMITTER 1 MAXIMUM RATINGS 2 Rating Symbol BC856 BC857 BC858 Unit Collector - Emitter Voltage VCEO -65 -45 -30 V Collector - Base Voltage VCBO -80 -50 -30 V Emitter - Base Voltage VEBO -5.0 -5.0 -5.0 V IC -100 -100 -100 mAdc Collector Current -- Continuous CASE 419-02, STYLE 3 SOT-323/SC-70 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR- 5 Board, (1) TA = 25C PD 150 mW Thermal Resistance, Junction to Ambient RqJA 833 C/W TJ, Tstg - 55 to +150 C Junction and Storage Temperature DEVICE MARKING BC856AWT1 = 3A; BC856BWT1 = 3B; BC857AWT1 = 3E; BC857BWT1 = 3F; BC858AWT1 = 3J; BC858BWT1 = 3K; BC858CWT1 = 3L ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector - Emitter Breakdown Voltage (IC = -10 mA) BC856 Series BC857 Series BC858 Series V(BR)CEO -65 -45 -30 -- -- -- -- -- -- V Collector - Emitter Breakdown Voltage (IC = -10 A, VEB = 0) BC856 Series BC857 Series BC858 Series V(BR)CES -80 -50 -30 -- -- -- -- -- -- V Collector - Base Breakdown Voltage (IC = -10 mA) BC856 Series BC857 Series BC858 Series V(BR)CBO -80 -50 -30 -- -- -- -- -- -- V Emitter - Base Breakdown Voltage (IE = -1.0 mA) BC856 Series BC857 Series BC858 Series V(BR)EBO -5.0 -5.0 -5.0 -- -- -- -- -- -- V ICBO -- -- -- -- -15 -4.0 nA A Collector Cutoff Current (VCB = -30 V) Collector Cutoff Current (VCB = -30 V, TA = 150C) 1. FR-5 = 1.0 x 0.75 x 0.062 in Preferred devices are Motorola recommended choices for future use and best overall value. Motorola Small-Signal Transistors, FETs and Diodes Device Data 2-159 BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued) Symbol Min Typ Max Unit hFE -- -- -- 90 150 270 -- -- -- -- 125 220 420 180 290 520 250 475 800 -- -- -- -- -0.3 -0.65 -- -- -0.7 -0.9 -- -- -0.6 -- -- -- -0.75 -0.82 fT 100 -- -- MHz Output Capacitance (VCB = -10 V, f = 1.0 MHz) Cob -- -- 4.5 pF Noise Figure (IC = -0.2 mA, VCE = -5.0 Vdc, RS = 2.0 k, f = 1.0 kHz, BW = 200 Hz) NF -- -- 10 dB Characteristic ON CHARACTERISTICS DC Current Gain (IC = -10 A, VCE = -5.0 V) (IC = -2.0 mA, VCE = -5.0 V) BC856A, BC857A, BC585A BC856A, BC857A, BC858A BC858C BC856A, BC857A, BC858A BC856B, BC857B, BC858B BC858C Collector - Emitter Saturation Voltage (IC = -10 mA, IB = -0.5 mA) (IC = -100 mA, IB = -5.0 mA) VCE(sat) Base - Emitter Saturation Voltage (IC = -10 mA, IB = -0.5 mA) (IC = -100 mA, IB = -5.0 mA) VBE(sat) Base - Emitter On Voltage (IC = -2.0 mA, VCE = -5.0 V) (IC = -10 mA, VCE = -5.0 V) VBE(on) V V V SMALL- SIGNAL CHARACTERISTICS Current - Gain -- Bandwidth Product (IC = -10 mA, VCE = -5.0 Vdc, f = 100 MHz) 2-160 Motorola Small-Signal Transistors, FETs and Diodes Device Data BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1 BC857/BC858 1.5 -1.0 TA = 25C -0.9 VCE = -10 V TA = 25C VBE(sat) @ IC/IB = 10 -0.8 V, VOLTAGE (VOLTS) hFE , NORMALIZED DC CURRENT GAIN 2.0 1.0 0.7 0.5 -0.7 VBE(on) @ VCE = -10 V -0.6 -0.5 -0.4 -0.3 -0.2 0.3 VCE(sat) @ IC/IB = 10 -0.1 0.2 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 IC, COLLECTOR CURRENT (mAdc) 0 -0.1 -0.2 -100 -200 Figure 1. Normalized DC Current Gain -1.2 IC = -10 mA IC = -50 mA IC = -200 mA IC = -100 mA IC = -20 mA -0.4 -0.02 VB , TEMPERATURE COEFFICIENT (mV/ C) VCE , COLLECTOR-EMITTER VOLTAGE (V) TA = 25C -55C to +125C 1.2 1.6 2.0 2.4 2.8 -10 -20 -0.1 -1.0 IB, BASE CURRENT (mA) -0.2 10 Cib 7.0 TA = 25C 5.0 Cob 3.0 2.0 1.0 -0.4 -0.6 -1.0 -2.0 -4.0 -6.0 -10 -20 -30 -40 -10 -1.0 IC, COLLECTOR CURRENT (mA) -100 Figure 4. Base-Emitter Temperature Coefficient f T, CURRENT-GAIN - BANDWIDTH PRODUCT (MHz) Figure 3. Collector Saturation Region C, CAPACITANCE (pF) -100 1.0 -1.6 0 -50 Figure 2. "Saturation" and "On" Voltages -2.0 -0.8 -0.5 -1.0 -2.0 -5.0 -10 -20 IC, COLLECTOR CURRENT (mAdc) 400 300 200 150 VCE = -10 V TA = 25C 100 80 60 40 30 20 -0.5 -1.0 -2.0 -3.0 -5.0 -10 -20 -30 -50 VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mAdc) Figure 5. Capacitances Figure 6. Current-Gain - Bandwidth Product Motorola Small-Signal Transistors, FETs and Diodes Device Data 2-161 BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1 BC856 TJ = 25C VCE = -5.0 V TA = 25C -0.8 V, VOLTAGE (VOLTS) hFE , DC CURRENT GAIN (NORMALIZED) -1.0 2.0 1.0 0.5 VBE(sat) @ IC/IB = 10 -0.6 VBE @ VCE = -5.0 V -0.4 -0.2 0.2 VCE(sat) @ IC/IB = 10 0 -0.2 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 IC, COLLECTOR CURRENT (AMP) -0.1 -0.2 -0.5 -50 -100 -200 -5.0 -10 -20 -1.0 -2.0 IC, COLLECTOR CURRENT (mA) Figure 8. "On" Voltage -2.0 -1.0 -1.6 -1.2 IC = -10 mA -20 mA -50 mA -100 mA -200 mA -0.8 -0.4 TJ = 25C 0 -0.02 -0.05 -0.1 -0.2 -0.5 -1.0 -2.0 IB, BASE CURRENT (mA) -5.0 -10 VB, TEMPERATURE COEFFICIENT (mV/ C) VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS) Figure 7. DC Current Gain -20 -1.4 -1.8 -2.6 -3.0 -0.2 20 Cib 10 8.0 6.0 Cob 4.0 2.0 -0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 VR, REVERSE VOLTAGE (VOLTS) Figure 11. Capacitance 2-162 -50 -100 -0.5 -1.0 -50 -2.0 -5.0 -10 -20 IC, COLLECTOR CURRENT (mA) -100 -200 Figure 10. Base-Emitter Temperature Coefficient f T, CURRENT-GAIN - BANDWIDTH PRODUCT C, CAPACITANCE (pF) TJ = 25C -55C to 125C -2.2 Figure 9. Collector Saturation Region 40 VB for VBE 500 VCE = -5.0 V 200 100 50 20 -100 -1.0 -10 IC, COLLECTOR CURRENT (mA) Figure 12. Current-Gain - Bandwidth Product Motorola Small-Signal Transistors, FETs and Diodes Device Data r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) BC856AWT1,BWT1 BC857AWT1,BWT1 BC858AWT1,BWT1,CWT1 1.0 0.7 0.5 D = 0.5 0.2 0.3 0.2 0.1 0.05 SINGLE PULSE 0.1 0.07 0.05 SINGLE PULSE t1 t2 DUTY CYCLE, D = t1/t2 0.03 0.02 0.01 0.1 ZJC(t) = r(t) RJC RJC = 83.3C/W MAX ZJA(t) = r(t) RJA RJA = 200C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) RJC(t) P(pk) 0.2 0.5 1.0 2.0 10 5.0 20 50 t, TIME (ms) 100 200 500 1.0 k 2.0 k 5.0 k 10 k Figure 13. Thermal Response -200 IC, COLLECTOR CURRENT (mA) 1s 3 ms -100 -50 -10 -5.0 -2.0 -1.0 TA = 25C TJ = 25C BC558 BC557 BC556 BONDING WIRE LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT The safe operating area curves indicate IC-VCE limits of the transistor that must be observed for reliable operation. Collector load lines for specific circuits must fall below the limits indicated by the applicable curve. The data of Figure 14 is based upon TJ(pk) = 150C; TC or TA is variable depending upon conditions. Pulse curves are valid for duty cycles to 10% provided TJ(pk) 150C. TJ(pk) may be calculated from the data in Figure 13. At high case or ambient temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by the secondary breakdown. -5.0 -10 -30 -45 -65 -100 VCE, COLLECTOR-EMITTER VOLTAGE (V) Figure 14. Active Region Safe Operating Area Motorola Small-Signal Transistors, FETs and Diodes Device Data 2-163 EMBOSSED TAPE AND REEL SOT-23, SC-59, SC-70/SOT-323, SC-90/SOT-416, SOT-223 and SO-16 packages are available only in Tape and Reel. Use the appropriate suffix indicated below to order any of the SOT-23, SC-59, SC-70/SOT-323, SOT-223 and SO-16 packages. (See Section 6 on Packaging for additional information). SOT-23: available in 8 mm Tape and Reel Use the device title (which already includes the "T1" suffix) to order the 7 inch/3000 unit reel. Replace the "T1" suffix in the device title with a "T3" suffix to order the 13 inch/10,000 unit reel. SC-59: available in 8 mm Tape and Reel Use the device title (which already includes the "T1" suffix) to order the 7 inch/3000 unit reel. Replace the "T1" suffix in the device title with a "T3" suffix to order the 13 inch/10,000 unit reel. SC-70/ SOT-323: available in 8 mm Tape and Reel Use the device title (which already includes the "T1" suffix) to order the 7 inch/3000 unit reel. Replace the "T1" suffix in the device title with a "T3" suffix to order the 13 inch/10,000 unit reel. SOT-223: available in 12 mm Tape and Reel Use the device title (which already includes the "T1" suffix) to order the 7 inch/1000 unit reel. Replace the "T1" suffix in the device title with a "T3" suffix to order the 13 inch/4000 unit reel. SO-16: available in 16 mm Tape and Reel Add an "R1" suffix to the device title to order the 7 inch/500 unit reel. Add an "R2" suffix to the device title to order the 13 inch/2500 unit reel. RADIAL TAPE IN FAN FOLD BOX OR REEL TO-92 packages are available in both bulk shipments and in Radial Tape in Fan Fold Boxes or Reels. Fan Fold Boxes and Radial Tape Reel are the best methods for capturing devices for automatic insertion in printed circuit boards. TO-92: available in Fan Fold Box Add an "RLR" suffix and the appropriate Style code* to the device title to order the Fan Fold box. available in 365 mm Radial Tape Reel Add an "RLR" suffix and the appropriate Style code* to the device title to order the Radial Tape Reel. *Refer to Section 6 on Packaging for Style code characters and additional information on ordering *requirements. DEVICE MARKINGS/DATE CODE CHARACTERS SOT-23, SC-59, SC-70/SOT-323, and the SC-90/SOT-416 packages have a device marking and a date code etched on the device. The generic example below depicts both the device marking and a representation of the date code that appears on the SC-70/SOT-323, SC-59 and SOT-23 packages. ABC D The "D" represents a smaller alpha digit Date Code. The Date Code indicates the actual month in which the part was manufactured. 2-2 Motorola Small-Signal Transistors, FETs and Diodes Device Data Tape and Reel Specifications and Packaging Specifications Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the "peel-back" cover tape. * * * * * SOD-123, SC-59, SC-70/SOT-323, SC-70ML/SOT-363, SOT-23, TSOP-6, in 8 mm Tape * SOT-223 in 12 mm Tape * SO-14, SO-16 in 16 mm Tape Two Reel Sizes Available (7 and 13) Used for Automatic Pick and Place Feed Systems Minimizes Product Handling EIA 481, -1, -2 Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity. SOD-123 SC-59, SC-70/SOT-323, SOT-23 8 mm 8 mm SOT-223 SC-70ML/SOT-363, TSOP-6 T1 ORIENTATION 8 mm SO-14, 16 12 mm 16 mm SC-70ML/SOT-363 T2 ORIENTATION DIRECTION 8 mm OF FEED EMBOSSED TAPE AND REEL ORDERING INFORMATION Devices Per Reel and Minimum Order Quantity Device Suffix (7) 3,000 T1 178 330 (7) (13) 3,000 10,000 T1 T3 8.0 0.1 (.315 .004) 178 330 (7) (13) 500 2,500 R1 R2 16 16 8.0 0.1 (.315 .004) 178 330 (7) (13) 500 2,500 R1 R2 SOD-123 8 8 4.0 0.1 (.157 .004) 178 330 (7) (13) 3,000 10,000 T1 T3 SOT-23 8 8 4.0 0.1 (.157 .004) 178 330 (7) (13) 3,000 10,000 T1 T3 SOT-223 12 12 8.0 0.1 (.315 .004) 178 330 (7) (13) 1,000 4,000 T1 T3 SC-70ML/SOT-363 8 8 4.0 0.1 (.157 .004) 178 178 (7) (7) 3,000 3,000 T1 T2 TSOP-6 8 4.0 0.1 (.157 .004) 178 (7) 3,000 T1 Package Tape Width (mm) Pitch mm (inch) SC-59 8 4.0 0.1 (.157 .004) 178 SC-70/SOT-323 8 8 4.0 0.1 (.157 .004) SO-14 16 16 SO-16 Tape and Reel Specifications 6-2 Reel Size mm (inch) Motorola Small-Signal Transistors, FETs and Diodes Device Data EMBOSSED TAPE AND REEL DATA FOR DISCRETES CARRIER TAPE SPECIFICATIONS P0 K P2 D t 10 Pitches Cumulative Tolerance on Tape 0.2 mm ( 0.008) E Top Cover Tape A0 K0 B1 F W B0 See Note 1 P For Machine Reference Only Including Draft and RADII Concentric Around B0 D1 For Components 2.0 mm x 1.2 mm and Larger Center Lines of Cavity Embossment User Direction of Feed * Top Cover Tape Thickness (t1) 0.10 mm (.004) Max. Bar Code Label R Min Tape and Components Shall Pass Around Radius "R" Without Damage Bending Radius 10 Embossed Carrier 100 mm (3.937) Maximum Component Rotation Embossment 1 mm Max Typical Component Cavity Center Line Tape 1 mm (.039) Max Typical Component Center Line 250 mm (9.843) Camber (Top View) Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm DIMENSIONS Tape Size B1 Max D D1 E F K P0 P2 R Min T Max W Max 8 mm 4.55 mm (.179) 1.0 Min (.039) 1.75 0.1 mm (.069 .004) 3.5 0.05 mm (.138 .002) 2.4 mm Max (.094) 4.0 0.1 mm (.157 .004) 2.0 0.1 mm (.079 .002) 25 mm (.98) 0.6 mm (.024) 8.3 mm (.327) 12 mm 8.2 mm (.323) 1.5 + 0.1 mm - 0.0 ( 0 9 + .004 004 (.059 - 0.0) 5.5 0.05 mm (.217 .002) 6.4 mm Max (.252) 16 mm 12.1 mm (.476) 7.5 0.10 mm (.295 .004) 7.9 mm Max (.311) 16.3 mm (.642) 24 mm 20.1 mm (.791) 11.5 0.1 mm (.453 .004) 11.9 mm Max (.468) 24.3 mm (.957) 1.5 mm Min (.060) 30 mm (1.18) 12 .30 mm (.470 .012) Metric dimensions govern -- English are in parentheses for reference only. NOTE 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within .05 mm min. to .50 mm max., NOTE 1: the component cannot rotate more than 10 within the determined cavity. NOTE 2: If B1 exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tape feeders. NOTE 3: Pitch information is contained in the Embossed Tape and Reel Ordering Information on pg. 5.12-3. Motorola Small-Signal Transistors, FETs and Diodes Device Data Tape and Reel Specifications 6-3 EMBOSSED TAPE AND REEL DATA FOR DISCRETES T Max Outside Dimension Measured at Edge 1.5 mm Min (.06) A 13.0 mm 0.5 mm (.512 .002) 20.2 mm Min (.795) 50 mm Min (1.969) Full Radius G Size A Max 8 mm 330 mm (12.992) 8.4 mm + 1.5 mm, - 0.0 (.33 + .059, - 0.00) 14.4 mm (.56) 12 mm 330 mm (12.992) 12.4 mm + 2.0 mm, - 0.0 (.49 + .079, - 0.00) 18.4 mm (.72) 16 mm 360 mm (14.173) 16.4 mm + 2.0 mm, - 0.0 (.646 + .078, - 0.00) 22.4 mm (.882) 24 mm 360 mm (14.173) 24.4 mm + 2.0 mm, - 0.0 (.961 + .070, - 0.00) 30.4 mm (1.197) G Inside Dimension Measured Near Hub T Max Reel Dimensions Metric Dimensions Govern -- English are in parentheses for reference only Tape and Reel Specifications 6-4 Motorola Small-Signal Transistors, FETs and Diodes Device Data TO-92 EIA, IEC, EIAJ Radial Tape in Fan Fold Box or On Reel TO-92 RADIAL TAPE IN FAN FOLD BOX OR ON REEL Radial tape in fan fold box or on reel of the reliable TO-92 package are the best methods of capturing devices for automatic insertion in printed circuit boards. These methods of taping are compatible with various equipment for active and passive component insertion. * * * * * * Available in Fan Fold Box Available on 365 mm Reels Accommodates All Standard Inserters Allows Flexible Circuit Board Layout 2.5 mm Pin Spacing for Soldering EIA-468, IEC 286-2, EIAJ RC1008B Ordering Notes: When ordering radial tape in fan fold box or on reel, specify the style per Figures 3 through 8. Add the suffix "RLR" and "Style" to the device title, i.e. MPS3904RLRA. This will be a standard MPS3904 radial taped and supplied on a reel per Figure 9. Fan Fold Box Information -- Order in increments of 2000. Reel Information -- Order in increments of 2000. US/European Suffix Conversions US EUROPE RLRA RL RLRE RL1 RLRM ZL1 Motorola Small-Signal Transistors, FETs and Diodes Device Data Packaging Specifications 6-5 TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L T T2 F1 F2 P2 P2 P1 D P Figure 1. Device Positioning on Tape Specification Inches Symbol Item Millimeter Min Max Min Max D Tape Feedhole Diameter 0.1496 0.1653 3.8 4.2 D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51 Component Lead Pitch 0.0945 0.110 2.4 2.8 .059 .156 1.5 4.0 0.3346 0.3741 8.5 9.5 Deflection Left or Right 0 0.039 0 1.0 Deflection Front or Rear 0 0.051 0 1.0 Feedhole to Bottom of Component 0.7086 0.768 18 19.5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5 F1, F2 H H1 H2A H2B H4 H5 L Bottom of Component to Seating Plane Feedhole Location Defective Unit Clipped Dimension 0.3346 0.433 8.5 11 L1 Lead Wire Enclosure 0.09842 -- 2.5 -- P Feedhole Pitch 0.4921 0.5079 12.5 12.9 P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75 P2 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95 0.06 0.08 0.15 0.20 T Adhesive Tape Thickness T1 Overall Taped Package Thickness -- 0.0567 -- 1.44 T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65 W Carrier Strip Width 0.6889 0.7481 17.5 19 W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3 W2 Adhesive Tape Position .0059 0.01968 .15 0.5 NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7. 4. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes. Packaging Specifications 6-6 Motorola Small-Signal Transistors, FETs and Diodes Device Data TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL FAN FOLD BOX STYLES CCCCCCC CCCCCCC CCCCCCC CCCCCCC ADHESIVE TAPE ON TOP SIDE FLAT SIDE ADHESIVE TAPE ON TOP SIDE ROUNDED SIDE CARRIER STRIP CARRIER STRIP Figure 2. Style M 252 mm 9.92" FLAT SIDE OF TRANSISTOR AND ADHESIVE TAPE VISIBLE. Style M fan fold box is equivalent to styles E and F of reel pack dependent on feed orientation from box. 330 mm 13" MAX ROUNDED SIDE OF TRANSISTOR AND ADHESIVE TAPE VISIBLE. Style P fan fold box is equivalent to styles A and B of reel pack dependent on feed orientation from box. Figure 3. Style P MAX 58 mm 2.28" MAX Figure 4. Fan Fold Box Dimensions ADHESION PULL TESTS 500 GRAM PULL FORCE 70 GRAM PULL FORCE 100 GRAM PULL FORCE 16 mm 16 mm HOLDING FIXTURE The component shall not pull free with a 300 gram load applied to the leads for 3 1 second. Figure 5. Test #1 HOLDING FIXTURE The component shall not pull free with a 70 gram load applied to the leads for 3 1 second. Figure 6. Test #2 Motorola Small-Signal Transistors, FETs and Diodes Device Data HOLDING FIXTURE There shall be no deviation in the leads and no component leads shall be pulled free of the tape with a 500 gram load applied to the component body for 3 1 second. Figure 7. Test #3 Packaging Specifications 6-7 TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL REEL STYLES CORE DIA. 82mm 1mm ARBOR HOLE DIA. 30.5mm 0.25mm MARKING NOTE HUB RECESS 76.2mm 1mm RECESS DEPTH 9.5mm MIN 365mm + 3, - 0mm 38.1mm 1mm 48 mm MAX Material used must not cause deterioration of components or degrade lead solderability Figure 8. Reel Specifications ADHESIVE TAPE ON REVERSE SIDE CARRIER STRIP CARRIER STRIP ROUNDED SIDE FLAT SIDE ADHESIVE TAPE FEED FEED Rounded side of transistor and adhesive tape visible. Flat side of transistor and carrier strip visible (adhesive tape on reverse side). Figure 9. Style A Figure 10. Style B ADHESIVE TAPE ON REVERSE SIDE CARRIER STRIP CARRIER STRIP FLAT SIDE ROUNDED SIDE ADHESIVE TAPE FEED FEED Flat side of transistor and adhesive tape visible. Figure 11. Style E Packaging Specifications 6-8 Rounded side of transistor and carrier strip visible (adhesive tape on reverse side). Figure 12. Style F Motorola Small-Signal Transistors, FETs and Diodes Device Data INFORMATION FOR USING SURFACE MOUNT PACKAGES RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. POWER DISSIPATION FOR A SURFACE MOUNT DEVICE PD = TJ(max) - TA RJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device. For example, for a SOT-223 device, PD is calculated as follows. PD = 150C - 25C = 800 milliwatts 156C/W The 156C/W for the SOT-223 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 800 milliwatts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the drain/collector pad. By increasing the area of the drain/collector pad, the power dissipation can be increased. Although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. For example, a graph of RJA versus drain pad area is shown in Figure 1. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. RJA , THERMAL RESISTANCE, JUNCTION TO AMBIENT (C/W) The power dissipation for a surface mount device is a function of the drain/collector pad size. These can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows: 160 140 Board Material = 0.0625 G-10/FR-4, 2 oz Copper TA = 25C 0.8 Watts 120 1.25 Watts* 1.5 Watts 100 80 0.0 *Mounted on the DPAK footprint 0.2 0.4 0.6 A, AREA (SQUARE INCHES) 0.8 1.0 Figure 1. Thermal Resistance versus Drain Pad Area for the SOT-223 Package (Typical) SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. Solder stencils are used to screen the optimum amount. These stencils are typically 0.008 inches thick and may be made of brass or stainless steel. For packages such as the Surface Mount Information 7-10 SOT-23, SC-59, SC-70/SOT-323, SC-90/SOT-416, SOD-123, SOT-223, SOT-363, SO-14, SO-16, and TSOP-6 packages, the stencil opening should be the same as the pad size or a 1:1 registration. Motorola Small-Signal Transistors, FETs and Diodes Device Data SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used since the use of forced cooling will increase the temperature gradient and will result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 2 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" DESIRED CURVE FOR HIGH MASS ASSEMBLIES actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 4 HEATING ZONES 3 & 6 "SOAK" STEP 5 HEATING ZONES 4 & 7 "SPIKE" STEP 6 VENT STEP 7 COOLING 205 TO 219C PEAK AT SOLDER JOINT 170C 160C 150C 150C 100C 140C 100C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 2. Typical Solder Heating Profile Motorola Small-Signal Transistors, FETs and Diodes Device Data Surface Mount Information 7-11 Footprints for Soldering 0.037 0.95 0.037 0.95 0.037 0.95 0.037 0.95 0.094 2.4 0.079 2.0 0.039 1.0 0.035 0.9 inches 0.031 0.8 0.031 0.8 mm mm SOT-23 0.025 0.025 0.65 0.65 EEE EEE EEE 0.075 0.5 min. (3x) 1.9 0.035 0.9 0.028 1.4 inches 0.7 EEE EEE EEE EEE EEE EEE 0.5 0.5 min. (3x) 1 SC-59 inches mm SC-70/SOT-323 SOT 416/SC-90 0.15 3.8 0.060 1.52 0.079 2.0 0.091 2.3 0.248 6.3 0.091 2.3 0.079 2.0 0.275 7.0 0.155 4.0 0.024 0.6 0.059 1.5 0.059 1.5 0.059 1.5 0.050 1.270 inches inches mm mm SOT-223 Surface Mount Information 7-12 SO-14, SO-16 Motorola Small-Signal Transistors, FETs and Diodes Device Data EEE EEE EEE EEE 2.36 0.093 4.19 0.165 1.22 0.048 0.4 mm (min) EEEE EEEE EEEE EEEE 0.91 0.036 mm inches EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE EEE 0.65 mm 0.65 mm 0.5 mm (min) 1.9 mm SOD-123 SOT-363 (SC-70 6 LEAD) 0.094 2.4 0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 1.0 inches mm TSOP-6 Motorola Small-Signal Transistors, FETs and Diodes Device Data Surface Mount Information 7-13 Package Outline Dimensions Dimensions are in inches unless otherwise noted. A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSION D AND J APPLY BETWEEN L AND K MINIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P L F SEATING PLANE K DIM A B C D F G H J K L N P R V D X X G J H V C SECTION X-X 1 N N STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR STYLE 14: PIN 1. EMITTER 2. COLLECTOR 3. BASE STYLE 2: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 15: PIN 1. ANODE 1 2. CATHODE 3. ANODE 2 STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER STYLE 21: PIN 1. COLLECTOR 2. EMITTER 3. BASE STYLE 5: PIN 1. DRAIN 2. SOURCE 3. GATE STYLE 22: PIN 1. SOURCE 2. GATE 3. DRAIN INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.022 0.016 0.019 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.41 0.55 0.41 0.48 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 --- STYLE 7: PIN 1. SOURCE 2. DRAIN 3. GATE STYLE 30: PIN 1. DRAIN 2. GATE 3. SOURCE CASE 029-04 (TO-226AA) TO-92 PLASTIC A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSIONS D AND J APPLY BETWEEN L AND K MIMIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R SEATING PLANE P L F K X X DIM A B C D F G H J K L N P R V D G H J V 1 2 3 N C SECTION X-X N STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR STYLE 14: PIN 1. EMITTER 2. COLLECTOR 3. BASE INCHES MIN MAX 0.175 0.205 0.290 0.310 0.125 0.165 0.018 0.022 0.016 0.019 0.045 0.055 0.095 0.105 0.018 0.024 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.135 --- 0.135 --- MILLIMETERS MIN MAX 4.44 5.21 7.37 7.87 3.18 4.19 0.46 0.56 0.41 0.48 1.15 1.39 2.42 2.66 0.46 0.61 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 3.43 --- 3.43 --- STYLE 22: PIN 1. SOURCE 2. GATE 3. DRAIN CASE 029-05 (TO-226AE) TO-92 1-WATT PLASTIC Package Outline Dimensions 8-2 Motorola Small-Signal Transistors, FETs and Diodes Device Data PACKAGE OUTLINE DIMENSIONS (continued) B NOTES: 1. PACKAGE CONTOUR OPTIONAL WITHIN DIA B AND LENGTH A. HEAT SLUGS, IF ANY, SHALL BE INCLUDED WITHIN THIS CYLINDER, BUT SHALL NOT BE SUBJECT TO THE MIN LIMIT OF DIA B. 2. LEAD DIA NOT CONTROLLED IN ZONES F, TO ALLOW FOR FLASH, LEAD FINISH BUILDUP, AND MINOR IRREGULARITIES OTHER THAN HEAT SLUGS. D K F A DIM A B D F K F K MILLIMETERS MIN MAX 5.84 7.62 2.16 2.72 0.46 0.56 --- 1.27 25.40 38.10 INCHES MIN MAX 0.230 0.300 0.085 0.107 0.018 0.022 --- 0.050 1.000 1.500 All JEDEC dimensions and notes apply. CASE 51-02 (DO-204AA) DO-7 A B R SEATING PLANE EE EE D P L F K J SECTION X-X X X D G H V 1 2 C N N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND ZONE R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSIONS D AND J APPLY BETWEEN L AND K MINIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIM K MINIMUM. DIM A B C D F G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.022 0.016 0.019 0.050 BSC 0.100 BSC 0.014 0.016 0.500 --- 0.250 --- 0.080 0.105 --- 0.050 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.21 4.32 5.33 3.18 4.49 0.41 0.56 0.407 0.482 1.27 BSC 3.54 BSC 0.36 0.41 12.70 --- 6.35 --- 2.03 2.66 --- 1.27 2.93 --- 3.43 --- STYLE 1: PIN 1. ANODE 2. CATHODE CASE 182-02 (T0-226AC) TO-92 PLASTIC Motorola Small-Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions 8-3 PACKAGE OUTLINE DIMENSIONS (continued) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 3 B S 1 DIM A B C D G H J K L S V 2 V G C H D STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE J K STYLE 10: PIN 1. DRAIN 2. SOURCE 3. GATE STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 18: PIN 1. NO CONNECTION 2. CATHODE 3. ANODE INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236 STYLE 19: PIN 1. CATHODE 2. ANODE 3. CATHODE-ANODE MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60 STYLE 11: PIN 1. ANODE 2. CATHODE 3. CATHODE-ANODE STYLE 21: PIN 1. GATE 2. SOURCE 3. DRAIN CASE 318-08 (TO-236AB) SOT-23 PLASTIC A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. L 3 S 2 DIM A B C D G H J K L S B 1 D G J C H STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR MILLIMETERS MIN MAX 2.70 3.10 1.30 1.70 1.00 1.30 0.35 0.50 1.70 2.10 0.013 0.100 0.09 0.18 0.20 0.60 1.25 1.65 2.50 3.00 INCHES MIN MAX 0.1063 0.1220 0.0512 0.0669 0.0394 0.0511 0.0138 0.0196 0.0670 0.0826 0.0005 0.0040 0.0034 0.0070 0.0079 0.0236 0.0493 0.0649 0.0985 0.1181 K STYLE 2: PIN 1. N.C. 2. ANODE 3. CATHODE STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 4: PIN 1. N.C. 2. CATHODE 3. ANODE STYLE 5: PIN 1. CATHODE 2. CATHODE 3. ANODE CASE 318D-04 SC-59 Package Outline Dimensions 8-4 Motorola Small-Signal Transistors, FETs and Diodes Device Data PACKAGE OUTLINE DIMENSIONS (continued) A F NOTES: 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 4 S INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287 B 1 2 3 D L G J C 0.08 (0003) M H MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30 K STYLE 1: PIN 1. 2. 3. 4. BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. ANODE CATHODE NC CATHODE STYLE 3: PIN 1. 2. 3. 4. GATE DRAIN SOURCE DRAIN CASE 318E-04 SOT-223 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L 6 5 4 2 3 B S 1 D G M J C 0.05 (0.002) H K DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 STYLE 1: PIN 1. 2. 3. 4. 5. 6. INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181 DRAIN DRAIN GATE SOURCE DRAIN DRAIN CASE 318G-02 TSOP-6 PLASTIC Motorola Small-Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions 8-5 PACKAGE OUTLINE DIMENSIONS (continued) A L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3 B S 1 2 DIM A B C D G H J K L N R S V D V G R N C 0.05 (0.002) J K H STYLE 2: PIN 1. ANODE 2. N.C. 3. CATHODE STYLE 3: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 7: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE STYLE 9: PIN 1. ANODE 2. CATHODE 3. CATHODE-ANODE INCHES MIN MAX 0.071 0.087 0.045 0.053 0.035 0.049 0.012 0.016 0.047 0.055 0.000 0.004 0.004 0.010 0.017 REF 0.026 BSC 0.028 REF 0.031 0.039 0.079 0.087 0.012 0.016 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.90 1.25 0.30 0.40 1.20 1.40 0.00 0.10 0.10 0.25 0.425 REF 0.650 BSC 0.700 REF 0.80 1.00 2.00 2.20 0.30 0.40 STYLE 5: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 10: PIN 1. CATHODE 2. ANODE 3. ANODE-CATHODE CASE 419-02 SC-70/SOT-323 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. G V 6 5 4 1 2 3 DIM A B C D G H J K N S V -B- S D 6 PL 0.2 (0.008) M B M N J C H K INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 STYLE 1: PIN 1. 2. 3. 4. 5. 6. EMITTER 2 BASE 2 COLLECTOR 1 EMITTER 1 BASE 1 COLLECTOR 2 STYLE 6: PIN 1. 2. 3. 4. 5. 6. ANODE 2 N/C CATHODE 1 ANODE 1 N/C CATHODE 2 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 CASE 419B-01 SOT-363 Package Outline Dimensions 8-6 Motorola Small-Signal Transistors, FETs and Diodes Device Data PACKAGE OUTLINE DIMENSIONS (continued) A C AAA AAA AAA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. H 1 K DIM A B C D E H J K B INCHES MIN MAX 0.055 0.071 0.100 0.112 0.037 0.053 0.020 0.028 0.004 --- 0.000 0.004 --- 0.006 0.140 0.152 MILLIMETERS MIN MAX 1.40 1.80 2.55 2.85 0.95 1.35 0.50 0.70 0.25 --- 0.00 0.10 --- 0.15 3.55 3.85 E 2 STYLE 1: PIN 1. CATHODE 2. ANODE J D CASE 425-04 SOD-123 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. -A- S 2 3 D 3 PL 0.20 (0.008) G -B- 1 M B K J 0.20 (0.008) A MILLIMETERS MIN MAX 0.70 0.80 1.40 1.80 0.60 0.90 0.15 0.30 1.00 BSC --- 0.10 0.10 0.25 1.45 1.75 0.10 0.20 0.50 BSC INCHES MIN MAX 0.028 0.031 0.055 0.071 0.024 0.035 0.006 0.012 0.039 BSC --- 0.004 0.004 0.010 0.057 0.069 0.004 0.008 0.020 BSC STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR C L DIM A B C D G H J K L S STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE H CASE 463-01 SOT-416/SC-90 Motorola Small-Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions 8-7 PACKAGE OUTLINE DIMENSIONS (continued) 14 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. 8 B 1 7 A F DIM A B C D F G H J K L M N L C J N H G D SEATING PLANE K M INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 CASE 646-06 14-PIN DIP PLASTIC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. -A- 16 9 1 8 B F C L S -T- SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 CASE 648-08 16-PIN DIP PLASTIC Package Outline Dimensions 8-8 Motorola Small-Signal Transistors, FETs and Diodes Device Data PACKAGE OUTLINE DIMENSIONS (continued) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 14 8 -B- 1 P 7 PL 0.25 (0.010) 7 G M B M R X 45 _ C F -T- 0.25 (0.010) M J M K D 14 PL SEATING PLANE T B A S S DIM A B C D F G J K M P R MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 CASE 751A-03 SO-14 PLASTIC -A- 16 9 1 8 -B- P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 8 PL 0.25 (0.010) B M S G R K F X 45 _ C -T- SEATING PLANE M D 16 PL 0.25 (0.010) M T B S A S J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 CASE 751B-05 SO-16 PLASTIC Motorola Small-Signal Transistors, FETs and Diodes Device Data Package Outline Dimensions 8-9