
500mW 100 Volt
Silicon Switching Diode
DL4148
SUGGESTED SOLDER
PAD LAYOUT
Features
• Low Current Leakage
• Compression Bond Construction
• Low Cost
• Surface Mount Applications
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .134 .142 3.40 3.60
B .008 .016 .20 .40
C .055 .059 1.40 1.50
∅
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 35°C/W Junction To Ambient
Electrical Characteristics @ 25°C Unless Otherwise Specified
Reverse Voltage VR75V
Peak Reverse
Voltage VRM 100V
Average Rectified
Current IO150mA Resistive Load
f > 50Hz
Power Dissipation PTOT 500mW
Junction
Temperature TJ 150°C
Peak Forward Surge
Current IFSM
500mA t<1s
Maximum
Instantaneous
Forward Voltage VF
1.0V IFM = 10mA;
TJ = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR
5.0µA
50µA
VR=20Volts
TJ=25°C
TJ=150°C
Typical Junction
Capacitance CJ4pF Measured at
1.0MHz, VR=4.0V
Reverse Recovery
Time Trr 4nS IF=10mA
VR=6V
RL=100Ω
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
A
B
C
h
M
.165
.075
.030
VR=20V
VR=75V
25nA
MINIMELF
omponents
20736 Marilla Street Chatsworth
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MCC
www.mccsemi.com
Revision: 3 2003/01/07