MOTOROLA SEMICONDUCTOR @ TECHNICAL Silicon ~ning Order this document by MMBV105GLTl~ DATA Diode MMBVI05GLT1 This device is designed in the Suflace Mount package for general frequency control and tuning applications. It provides solid-state reliability in replacement of mechanical tuning methods. MNIMUM a Preferred Devlu Controlled and Uniform Tuning Ratio 3+el Cathode I Motorola RATINGS Rating Symbol Reverse Voltage Foward Anode VR Current .,,;.s IF ,:'t';$~ ;,, Device Dissipation @ TA = 25C Derate above 25C Junction Temperature Storage Temperature Range .:*. Unit `w .p $0 Vdc 200 mAdc 225 1.8 mW mW/OC +125 "c -55 to+150 `c DEVICE MARKING *,\,*l) ,.. ,.* ..,\i,. ,\t,+. ~y,,w Characteristic Reverse Breakdo~n"q@ge (IR = 10 w~:~ Reverse ~o;wkeakage (v~w2$~dc) Min Max Unit V(BR)R 30 -- Vdc IR -- 50 nAdc Current Device Type MMBV105GLT1 0 Symbol VR = 25 Vdc, f = 1.0 MHz pF Q VR = 3.0 Vdc f=50MHz CR C#C25 f=l.OMHz Min Max Typ Min Max 1.5 2.8 250 4.0 8.5 Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 MOTOROLA @ Motorola, Inc. 1997 @ ,, MMBVI05GLT1 WPICAL 0,3 0,5 1,0 2.0 3,0 5,0 10 CHARACTERISTICS 20 30 10 1000 VR, REVERSE VOLTAGE (VOLTS) Figure 1. Diode Capacitance ` -i 0.96 I Figure 3. Diode Capacitance o 2 MotorolaSmall-Signal Transistors,FETs and Diodes Device Data MMBVI05GLTI INFORMATION FOR USING THE SOT-23 MINIMUM RECOMMENDED @ FOOTPRINT SURFACE MOUNT PACKAGE FOR SURFACE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection MOUNTED APPLICATIONS intetiace between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. -- SOT-23 POWER DISSli The power dissipation of the SOT-23 is a function of the a ,?s'~$; SOLDERING PRECAUTIONS pad size. This can vary from the minimum pad size for f"'"'">?; `s ,B,.'*, +./The melting temperature of solder is higher than the rated soldering to a pad size given for maximum power dissipation., y:i + ~+u.~!,temperature of the device. When the entire device is heated Power dissipation for a surface mount device is determined'~+$~, to a high temperature, failure to complete soldering within a by TJ(m=), the maximum rated junction temperatur~}of t~ short time could result in device failure. Therefore, the die, ReJA, the thermal resistance from the device jw$on to following items should always be observed in order to ambient, and the operating temperature, T~$J1~,n&the minimize the thermal stress to which the devices are values provided on the data sheet for the SO$F~~~dckage, subjected. .qkg$+ PD can be calculated as follows: #$k\\@h, ,$:.' Always preheat the device. ,>, ,., .,,, .,, ) ,<., ?,.$'..: ,,..1; ~ ,$. ,, The delta temperature between the preheat and , ~>>;\yp;~. TJ(max) - TA*2?,.*Y soldering should be 10OC or less.* PD = ROJA,,&V'''~<%)$? When preheating and soldering, the temperature of the ,., $, J leads and the case must not exceed the maximum The values for the equa@Wi$#@found in the maximum temperature ratings as shown on the data sheet. When ratings table on the data x"~,<~bstituting these values into using infrared heating with the reflow soldering method, the equation for an amb&t'$mperature TA of 25C, one can the difference shall be a maximum of 10C. :$,-,<, ,,~;'~~. calculate the pow+':~~sslp~tlon of the device which in this The soldering temperature and time shall not exceed case is 225 milli~~~$$$:fi *,,..b.* ?$, ~~.+ .~>,*</t\k\, = 225 milliwatts ...... ..<:, 556C~ ,*;! ~*..,, `;i%;k~~% 1500c - 250c .. :>:? ,::~ .L~@`%C~ for the SOT-23 package assumes the use ,)::.,>:~ ,!rt . :?$q~~~recommended footprint on a glass epoxy printed circuit `$$%~d to achieve a power dissipation of 225 milliwatts. There ~e other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad'". Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. 260C for more than 10 seconds. When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. Mechanical stress or shock should not be applied during cooling. Solderina a device without preheating can cause excessive thermal sh;ck and stress which can result in damage to the device. @ Motorola Small-Signal Transistors, FETs and Diodes Device Data 3 MMBV105GLTI : PACWGE DIMENSIONS NOTES 1, DIMENSIONING AND TOLERANCING PER ANSI Y14.5M. 1982. 2, CON~OLLING DIMENSION INCH. 3. WIUMUM LWD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. ~,.,, Motorola (es$tiwa:right to make changes without further notice to any products herein. Motorola makes no warran~, representation or guarantee regarding the suitab~~~~% ~oducts for any particular purpose, nor does Motorola assume any liabifi~ arising out of the apphcation or use of any product or circuit, and specific@ d]@$~s any and all tiabihty,including without limitation consequential or incidental damages. Typical" parameters which maybe provided in Motorola data~ka#/orspecificationscan and dovaryin @fferentapplicationsand actual performance mayvaryovertime. Alloperatingparameters, including~~icals" m@'&tY{~Nated for each customer appflcafion by customers technical experts. Motorola does not conveYanY license under its Patent rights nor the rights of .oth~: tiotorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other `$w~$%onsintended tosupportorsustain ~fe,orforanyotherapptication in wMchtiefailureof the Motorola pmductcouldcreate a situation where personal injury ~deathmaymcur. Should BuyerPurchaseoruse MotorolaProdu~sforanYsuch Unintendedorunauthorizedapplication, Buyershallindemnify and hold Motorola ad its officers, employees, subsidiaries, affihates, and dis~butors harmless against all claime, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal inju~ or death associated Mfh such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regardng the design or manufacture of the part. Motorola and@ are registered trademarks of Motorola, inc. Motorola, Inc. is an Equal Opportunity/Affimafive Action Employer. Mfax is a trademark of Motorola, Inc. How to reach u% USA/EUROPE/Locations Not Lfeted Motorola Literature Mstnbution; P.O. Box 5405, Denvar, Colorado 80217. 3W7+2140 or l+WI-2447 MfaxTM:RMFWO@email.sps. mot.com -TOUCHTONE 6W-2W609 - US& Canada ONLY l-0W77&1648 INTERNET hftp//motorola.codsps JAPAN: Nip Motoda Ltd; TafsumWP~LDC, 6F SeibMutsu@entsr, >142 Tatsumi Kottiu, To~o .1%, Ja~n. 81%521+315 ASfA/PACIFIC MotorofaSamicondKtors H.K. Ltd; 6B Tai Ping IndustrialPark, 51 Tng Kok Road, Tai Po, N.T, Hong Kong. 652-2~29296 MOTOROLA .@ o MMBvlo5GLT1/D