HLMP-CWxx T-13/4 Precision Optical Performance White LED Lamps Data Sheet HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24, HLMP-CW30, HLMP-CW31, HLMP-CW70, HLMP-CW72 Description Features These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 CIE Chromaticity Diagram. * Highly luminous white emission These T-134 lamps are untinted, nondiffused, and incorporate precise optics producing well defined spatial radiation patterns at specific viewing cone angle. * Small area illumination * 15, 23, 30, and 70 viewing angle Applications * Indoor Electronic signs and signals * Legend backlighting * General purpose indicators Benefit * Reduced power consumption, higher reliability, and increased optical/mechanical design flexibility compared to incandescent bulbs and other alternative white light sources CAUTION: These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Device Selection Guide Part Number Viewing Angle Typ. Min. Luminous Intensity Iv (mcd) @ 20 mA Min. Max. Standoff Leads Package Dimension HLMP-CW15-TW0xx 15 2500 7200 No A HLMP-CW15-TW0xx 15 2500 7200 No A HLMP-CW15-UV0xx 15 3200 5500 No A HLMP-CW15-VWBxx 15 4200 7200 No A HLMP-CW15-VY0xx 15 4200 12000 No A HLMP-CW15-VYBxx 15 4200 12000 No A HLMP-CW15-VYGxx 15 4200 12000 No A HLMP-CW15-VYKxx 15 4200 12000 No A HLMP-CW16-R00xx 15 1500 - Yes B HLMP-CW16-TW0xx 15 2500 7200 Yes B HLMP-CW16-VY0xx 15 4200 12000 Yes B HLMP-CW23-SV0xx 23 1900 5500 No A HLMP-CW23-SVKxx 23 1900 5500 No A HLMP-CW23-TW0xx 23 2500 7200 No A HLMP-CW24-SV0xx 23 1900 5500 Yes B HLMP-CW24-TW0xx 23 2500 7200 Yes B HLMP-CW30-PS0xx 30 880 2500 No A HLMP-CW30-RU0xx 30 1500 4200 No A HLMP-CW30-STBxx 30 1900 3200 No A HLMP-CW30-SV0xx 30 1900 5500 No A HLMP-CW31-M00xx 30 520 - Yes B HLMP-CW31-PS0xx 30 880 2500 Yes B HLMP-CW31-SV0xx 30 1900 5500 Yes B HLMP-CW70-LMBxx 70 400 680 No A HLMP-CW70-LP0xx 70 400 1150 No A HLMP-CW72-LP0xx 70 400 1150 Yes B Notes: 1. Tolerance for each intensity limit is 15%. 2. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs. Package Dimensions 5.00 0.20 (0.197 0.008) 5.00 0.20 (0.197 0.008) 8.71 0.20 (0.343 0.008) d 1.14 0.20 (0.045 0.008) 8.71 0.20 (0.343 0.008) 1.14 0.20 (0.045 0.008) 0.70 (0.028) MAX. 2.35 (0.093) MAX. 31.60 MIN. (1.244) CATHODE FLAT CATHODE LEAD 0.50 0.10 SQ. TYP. (0.020 0.004) 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) PACKAGE DIMENSION A NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 1.50 0.15 (0.059 0.006) 0.70 (0.028) MAX. CATHODE LEAD 1.00 MIN. (0.039) 31.60 MIN. (1.244) 1.00 MIN. (0.039) CATHODE FLAT 0.50 0.10 SQ. TYP. (0.020 0.004) 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) PACKAGE DIMENSION B HLMP-CW16 HLMP-CW24 HLMP-CW31 HLMP-CW72 d = 12.6 0.25 d = 12.52 0.25 d = 11.96 0.25 d = 12.52 0.25 (0.496 0.010) (0.493 0.010) (0.471 0.010) (0.493 0.010) Part Numbering System HLMP - C Wxx - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack Color Bin Option 0: Full color bin distribution B: Color bins 2 & 3 G: Color bins 2, 3 & 4 K: Color bins 2 & 4 Maximum Intensity Bin Limit 0: No maximum intensity bin limit Others: Refer to Device Selection Guide Minimum Intensity Bin Limit Refer to Device Selection Guide Viewing Angle and Standoff Option 15: 15 without standoffs 16: 15 with standoffs 23: 23 without standoffs 24: 23 with standoffs 30: 30 without standoffs 31: 30 with standoffs 70: 50 without standoffs 72: 50 with standoffs Note: Please refer to AB 5337 for complete information about part numbering system. Absolute Maximum Ratings TA = 25C Parameter Value Units DC Forward Current[1] 30 mA Peak Forward Current[2] 100 mA Power Dissipation 111 mW Reverse Voltage (IR = 10 A) 5 V LED Junction Temperature 110 oC Operating Temperature Range -40 to +80 oC Storage Temperature Range -40 to +100 oC Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10% Frequency 1 kHz. Electrical Characteristics TA = 25C Forward Voltage, VF (V) @ IF = 20 mA Typ. Max. Reverse Breakdown, VR (V) @ IR = 10 A Min. Capacitance, C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RJ-PIN (C/W) Typ. 3.2 5 70 240 3.7 Optical Characteristics TA = 25C Part Number Typical Chromaticity Coordinates[1] X Y Viewing Angle 21/2 Degrees[2] Typ. HLMP-CW3x-xxxxx 0.32 0.32 30 HLMP-CW2x-xxxxx 0.32 0.32 23 HLMP-CW1x-xxxxx 0.32 0.32 15 HLMP-CW7x-xxxxx 0.32 0.32 50 Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 12 the peak intensity. 35 0.8 0.6 0.4 0.2 0 380 480 580 680 30 25 20 15 10 5 0 780 1.5 RELATIVE LUMINOUS INTENSITY FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY 1.0 0 1 Figure 1. Relative intensity vs. wavelength MAXIMUM FORWARD CURRENT - mA Y-COORDINATES 1 mA 5 mA 0.010 10 mA 0.005 15 mA 20 mA 0 25 mA -0.005 30 mA -0.010 -0.004 -0.002 0 4 Figure 2. Forward current vs. forward voltage 0.025 0.015 3 FORWARD VOLTAGE - V WAVELENGTH - nm 0.020 2 0.002 0.004 35 30 25 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE - C X-COORDINATES (X,Y) VALUES @ 20 mA REFERENCE TO (0,0) Figure 4. Chromaticity shift vs. current Figure 5. Maximum forward current vs. temperature RELATIVE INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 6a. CW1x spatial radiation pattern 60 90 1.2 0.9 0.6 0.3 0 0 10 20 FORWARD CURRENT - mA Figure 3. Relative lv vs. forward current 30 RELATIVE LUMINOUS INTENSITY 1 0.5 0 -90 -60 -30 0 30 60 90 60 90 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 6b. CW2x spatial radiation pattern RELATIVE LUMINOUS INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 6c. CW3x spatial radiation pattern RELATIVE LUMINOUS INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 6c. CW7x spatial radiation pattern Intensity Bin Limits Color Bin Limit Table (mcd at 20 mA) Rank Limits (Chromaticity Coordinates) Bin Min. Max. 1 L 400 520 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 M 520 680 2 N 680 880 x y 0.287 0.295 0.296 0.276 0.330 0.318 0.330 0.339 3 P 880 1150 x y 0.264 0.267 0.280 0.248 0.296 0.276 0.283 0.305 Q 1150 1500 4 R 1500 1900 x y 0.283 0.305 0.287 0.295 0.330 0.339 0.330 0.360 S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 Tolerance for each bin limit is 0.01. Note: Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for information on currently available bins. Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 Y-COORDINATE Tolerance for each bin limit is 15%. 0.35 4 1 BLACK BODY CURVE 2 0.30 3 0.25 0.20 0.26 0.30 0.34 0.38 X-COORDINATE Relative Light Output vs. Junction Temperature RELATIVE LIGHT OUTPUT ( NORMALIZED AT TJ = 25C) 10 1 0.1 -40 -20 0 20 40 60 TJ - JUNCTION TEMPERATURE - C 80 100 Precautions: Note: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm * ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 C Max. - Preheat time 60 sec Max - Peak temperature 250 C Max. 260 C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. * Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration CATHODE InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. * Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) * Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (C) Flux: Rosin flux 200 Solder bath temperature: 245C 5C (maximum peak temperature = 250C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) CATHODE 20.50 1.00 (0.807 0.039) 9.125 0.625 (0.3593 0.0246) 18.00 0.50 (0.7087 0.0197) A 12.70 0.30 (0.50 0.0118) 0.70 0.20 (0.0276 0.0079) A VIEW A-A ALL DIMENSIONS IN MILLIMETERS (INCHES). Note: The ammopacks drawing is applicable to option -DD & -ZZ and regardless of standoff or non standoff. 10 4.00 0.20 TYP. (0.1575 0.008) Packaging Box Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + O AG ES AV LOGI DE NO HO - CH AT E OD AN TE C ANODE LEAD LEAVES THE BOX FIRST. C ER TH MO L BE LA Note: For InGaN device, the ammo pack packaging box contains ESD logo. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity LPN CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: REV: (V) Vendor ID DeptID: (1P) Item: Part Number Made In: Country of Origin 11 (ii) Avago Baby Label (Only available on bulk packaging) RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) VB: VF bin "VB" 2: Color bin 2 only DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4125EN AV02-0214EN - April 4, 2008