PCF8576DT/S400/2,1"" - NXP SEMICONDUCTORS

1. General description

The PCF8576D is a peripheral device which interfaces to almost any Liquid Crystal

Display (LCD)1 with low multiplex rates. It generates the drive signals for any static or

multiplexed LCD cont aining up to four backplan es and up to 40 segments . It can be easily

cascaded for larger LCD applications. The PCF8576D is compatible with most

microcontrollers and communicate s via the two-li ne bidirectiona l I2C-bus. Communication

overheads are minimized by a display RAM with auto-incremented addressing, by

hardware subaddressing and by display memory switching (static and du pl ex dr ive

modes).

•PCF8576DT/2 shou ld not be use d fo r new design-ins. Replacement part is

PCF85176T/1 for industrial applicatio ns

•PCF8576DT/S400/2 should no t be used for new design-ins. Replacement part is

PCA85176T/Q900/1 for automotive applications

For a selection of NXP LCD segment drivers, see Table 30 on page 50.

2. Features and benefits

AEC-Q100 compliant (PCF8576DT/S400/2) for automotive applications

Single chip LCD controller and driver

Selectable backplan e drive configuration: static or 2, 3, 4 backplane multiplexing

Selectable display bias configuration: static, 1⁄2, or 1⁄3

Internal LCD bias generation with voltage-follower buffers

40 s egm en t dr ive s :

Up to 20 7-segment numeric characters

Up to 10 14-segment alphanumeric characters

Any graphics of up to 160 segments/elements

40  4-bit RAM for display data storage

Auto-incremented display data loading across device subaddress boundaries

Display memory bank switching in static and duplex drive modes

Versatile blinking modes

Independent supplies possible for LCD and logic voltages

Wide power supply range: from 1.8 V to 5.5 V

Wide logic LCD supply range:

From 2.5 V for low-threshold LCDs

Up to 6.5 V for high-threshold twisted nematic LCDs

PCF8576D

40 × 4 universal LCD driver for low multiplex rates

Rev. 15 — 12 February 2015 Product data sheet

1. The definition of the abbreviations and acronyms used in this data sheet can be found in Section 22.

Product data sheet Rev. 15 — 12 February 2015 2 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

Low power consum pt ion

400 kHz I2C-bus in te r face

May be cascaded for large LCD applicatio ns (up to 2560 segments/element s possib le)

No external components required

Compatible with chip-on-glass and chip-on-board technology

Manufactured in silicon gate CMOS process

3. Ordering information

[1] Not to be used for new designs. Replacement part is PCF85176T/1 for industrial applications.

[2] Not to be used for new designs. Replacement part is PCA85176T/Q900/1 for automotive applications.

3.1 Ordering options

4. Marking

Table 1. Ordering information

Product type number Package

Name Description Version

PCF8576DT/2[1] T SSOP56 plastic thin shrink small outline package, 56 leads;

body width 6.1 mm SOT364-1

PCF8576DT/S400/2[2] TSSOP56 plastic thin shrink small outline package, 56 leads;

body width 6.1 mm SOT364-1

PCF8576DU/DA/2 wire bond die 59 bonding pads PCF8576DU/DA

PCF8576DU/2DA/2 bare die 59 bumps PCF8576DU/2DA

Table 2. Ordering options

Product type number Orderable part number Sales item

(12NC) Delivery form IC

revision

PCF8576DT/2 PCF8576DT/2,118 935276166118 tape and reel, 13 inch 2

PCF8576DT/S4 00/2 PCF8576DT/S400/2,1 935287131118 tape and reel, 13 inch 2

PCF8576DU/DA/2 PCF8576DU/DA/2,026 935276239026 chips in tray 2

PCF8576DU/2DA/2 PCF8576DU/2DA/2,02 935276249026 chips in tray 2

Table 3. Marking codes

Product type number Marking code

PCF8576DT/2 PCF8576DT

PCF8576DT/S400/2 PCF8576DT/S400

PCF8576DU/DA/2 PC8576D-2

PCF8576DU/2DA/2 PC8576D-2

Product data sheet Rev. 15 — 12 February 2015 3 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

5. Block diagram

Fig 1. Block diagram of PCF8576D

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Product data sheet Rev. 15 — 12 February 2015 4 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

6. Pinning information

6.1 Pinning

Top view. For mechanical details, see Figure 25.

Fig 2. Pinning diagram for PCF8576DT (TSSOP56)

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Product data sheet Rev. 15 — 12 February 2015 5 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

Viewed from active side. C1 and C2 are alignment marks. For mechanical details, see Figure 26

and Figure 27.

Fig 3. Pinning diagram for PCF8576DU (bare die)

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Product data sheet Rev. 15 — 12 February 2015 6 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

6.2 Pin description

[1] The substrate (rear side of the die) is connected to VSS and should be electrically isolated.

Table 4. Pin description

Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.

Symbol Pin Description

PCF8576DT PCF8576DU

SDA 44 1, 58, 59 I2C-bus serial data input and output

SCL 45 2, 3 I2C-bus serial clock input

CLK 47 5 external clock input or output

VDD 48 6 supply voltage

SYNC 46 4 cascade synchronization input or output; if

not used it must be left open

OSC 49 7 internal oscillator enable input

A0 to A2 50 to 52 8 to 10 subaddress inputs

SA0 53 11 I2C-bus address input; bit 0

VSS 54 12[1] ground supply voltage

VLCD 55 13 LCD supply voltage

BP0, BP2,

BP1, BP3 56, 1, 2, 3 14 to 17 LCD backplane outputs

S0 to S39 4 to 43 18 to 57 LCD segment outputs

n.c. - - not connected

Product data sheet Rev. 15 — 12 February 2015 7 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7. Functional description

The PCF8576D is a versatile peripheral device designed to interface between any

microcontroller to a wide variety of LCD segment or dot matrix displays ( se e Figure 4). It

can directly drive any static or multiplexed LCD containing up to four backplanes and up to

40 segments.

The possible display configurations of the PCF8576D depend on the number of active

backplane outputs required. A selection of display configurations is shown in Table 5. All

of these configurations can be implemented in the typical system shown in Figure 5.

[1] 7 segment display has 8 segments/elements including the decimal point.

[2] 14 segment display has 16 segments/elements including decimal point and accent dot.

Fig 4. Example of displays suitable for PCF8576D

Table 5. Selection of possible display configurations

Number of

Backplanes Icons Digits/Characters Dot matrix:

segments/

elements

7-segment[1] 14-segment[2]

4 160 20 10 160 (4  40)

3 120 15 7 120 (3  40)

28010580 (2  40 )

1405240 (1  40)

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Product data sheet Rev. 15 — 12 February 2015 8 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

The host microcontroller maintains the 2-line I2C-bus communication channel with the

PCF8576D. The internal oscillator is enabled by connecting pin OSC to pin VSS. The

appropriate biasing voltages for the multiplexed LCD waveforms are generated intern ally.

The only other connections required to complete the system are to the po we r su pp lies

(VDD, VSS, and VLCD) and the LCD panel chosen for the application.

7.1 Power-On Reset (POR)

At power-on the PCF8576D resets to the following starting conditions:

•All backplane and segment outputs are set to VLCD

•The selected drive mode is: 1:4 multiplex with 1⁄3 bias

•Blinking is switched off

•Input and output bank selectors are reset

•The I2C-bus interface is initialized

•The data pointer and the subaddress counter are cleared (set to logic 0)

•The display is disabled (bit E = 0, see Table 12)

Remark: Do not transfer data on the I2C-bus for at least 1 ms after a power-on to allow

the reset action to complete.

7.2 LCD bias generator

Fractional LCD biasing voltages are obtained from an inter nal voltage divider of three

impedances connected between pins VLCD and VSS. The center impedance is bypassed

by switch if the 1⁄2bias voltage level for the 1:2 multiplex drive mode configuration is

selected. The LCD voltage can be temperature compensated externally using the supply

to pin VLCD.

The resistance of the power lines must be kept to a minimum.

For chip-on-glass applications, due to the Indium Tin Oxide (ITO ) track resistance, each supply line

must be routed separately between the chip and the connector.

Fig 5. Typical system configuration

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Product data sheet Rev. 15 — 12 February 2015 9 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.3 LCD voltage selector

The LCD voltage selector coord ina te s th e mult iplexing of the LCD in accordance with the

selected LCD drive configuration. The operation of the voltage selector is controlled by the

mode-set command from the command decoder. The biasing configurations that apply to

the preferred modes of o per ation , to gether with the bia sing chara cteristics as function s of

VLCD and the resulting discrimination ratios (D) are given in Table 6.

Discrimination is a term which is defined as the ratio of the on a nd off RMS volt age across

a segment. It can be thought of as a measurement of contrast.

A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD

threshold volt age (Vth(off)) , typically when the LCD exhibits appr oximately 10 % contrast. In

the static drive mode a suitable choice is VLCD >3V

th(off).

Multiplex drive modes of 1:3 and 1:4 with 1⁄2 bias are possible but the discr imination and

hence the contrast ratios are smaller.

Bias is calculated by , where the values for a are

a = 1 for 1⁄2 bias

a = 2 for 1⁄3 bias

The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 1:

(1)

where the values for n are

n = 1 for static drive mode

n = 2 for 1:2 multiplex drive mode

n = 3 for 1:3 multiplex drive mode

n = 4 for 1:4 multiplex drive mode

The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 2:

(2)

Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 3:

Table 6. Biasing characteristics

LCD drive

mode Number of: LCD bias

configuration

Backplanes Levels

static 1 2 static 0 1 

1:2 multiplex 2 3 1⁄20.354 0.791 2.236

1:2 multiplex 2 4 1⁄30.333 0.745 2.236

1:3 multiplex 3 4 1⁄30.333 0.638 1.915

1:4 multiplex 4 4 1⁄30.333 0.577 1.732

Voff RMS

VLCD

-------------------------

Von RMS

VLCD

------------------------

DVon RMS

Voff RMS

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1a+

-------------

Von RMS a22a n++

n1a+



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VLCD

Voff RMS a22a–n+

n1a+



------------------------------

VLCD

Product data sheet Rev. 15 — 12 February 2015 10 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

(3)

Using Equation 3, the discrimination for an LCD drive mode of 1:3 multiplex with

1⁄2bias is and the discrimination for a n LCD drive mode of 1:4 multiplex with

1⁄2bias is .

The advanta ge of these LCD drive modes is a reduction of the LCD full scale volt age VLCD

as follows:

•1:3 multiplex (1⁄2 bias):

•1:4 multiplex (1⁄2 bias):

These compare with when 1⁄3 bias is used.

It should be noted that VLCD is sometimes referred as the LCD operating voltage.

7.3.1 Electro-optical performance

Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The

RMS voltage, at which a pixel will be switched on or off, determine the transmissibility of

the pixel.

For any given liquid, there are two threshold values defined. One point is at 10 % relative

transmission (at Vth(off)) and the other at 90 % relative transm ission (at Vth(on)), see

Figure 6. For a good contrast performance, the following rules should be followed:

(4)

(5)

Von(RMS) and Voff(RMS) are properties of the display driver and ar e affected by the selection

of a, n (see Equation 1 to Equation 3) and the VLCD voltage.

Vth(off) and Vth(on) ar e properties of the LCD liquid and can be provided by the module

manufacturer. Vth(off) is sometimes just named Vth. Vth(on) is sometimes named saturation

voltage Vsat.

It is important to match the module properties to those of the driver in order to achieve

optimum performance.

DVon RMS

Voff RMS

-----------------------a22a n++

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---------------------------==

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---------- 1.528=

VLCD 6V

off RMS

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VLCD 43

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VLCD 3Voff RMS

Von RMS

Vth on



Voff RMS

Vth off



Product data sheet Rev. 15 — 12 February 2015 11 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

Fig 6. Electro-optical chara cteristic: relative tran smission curve of the liquid

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Product data sheet Rev. 15 — 12 February 2015 12 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.4 LCD drive mode waveforms

7.4.1 Static drive mode

The static LCD drive mode is used when a single backplane is provided in the LCD. The

backplane (BPn) and segment drive (Sn) waveforms for this mode are shown in Figure 7.

(1) Vstate1(t) = VSn(t)  VBP0(t).

(2) Von(RMS) = VLCD.

(3) Vstate2(t) = VSn+1(t)  VBP0(t).

(4) Voff(RMS) = 0 V.

Fig 7. Static drive mode wavefo rm s

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Product data sheet Rev. 15 — 12 February 2015 13 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.4.2 1:2 Multiplex drive mode

The 1:2 multiplex drive mode is used when two b ackplanes a re pr ovide d in the LCD. This

mode allows fractional LCD bias voltages of 1⁄2 bias or 1⁄3 bias as shown in Figure 8 and

Figure 9.

(1) Vstate1(t) = VSn(t)  VBP0(t).

(2) Von(RMS) = 0.791VLCD.

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Fig 8. W aveforms for the 1:2 multiplex drive mode with 1⁄2 bias

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Product data sheet Rev. 15 — 12 February 2015 14 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

(1) Vstate1(t) = VSn(t)  VBP0(t).

(2) Von(RMS) = 0.745VLCD.

(3) Vstate2(t) = VSn+1(t)  VBP1(t).

(4) Voff(RMS) = 0.333VLCD.

Fig 9. W aveforms for the 1:2 multiplex drive mode with 1⁄3 bias

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Product data sheet Rev. 15 — 12 February 2015 15 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.4.3 1:3 Multiplex drive mode

When three backplanes ar e provided in the LCD, the 1:3 multiplex drive mode applies

(see Figure 10).

(1) Vstate1(t) = VSn(t)  VBP0(t).

(2) Von(RMS) = 0.638VLCD.

(3) Vstate2(t) = VSn+1(t)  VBP1(t).

(4) Voff(RMS) = 0.333VLCD.

Fig 10. Waveforms for the 1:3 multiplex drive mode with 1⁄3 bias

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Product data sheet Rev. 15 — 12 February 2015 16 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.4.4 1:4 Multiplex drive mode

When four backplanes are provided in the LCD, the 1:4 multiplex dr ive mode applies (see

Figure 11).

(1) Vstate1(t) = VSn(t)  VBP0(t).

(2) Von(RMS) = 0.577VLCD.

(3) Vstate2(t) = VSn+1(t)  VBP1(t).

(4) Voff(RMS) = 0.333VLCD.

Fig 11. Waveforms for the 1:4 multiplex drive mode with 1⁄3 bias

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Product data sheet Rev. 15 — 12 February 2015 17 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.5 Oscillator

7.5.1 Internal clock

The internal logic of the PCF8576D and its LCD drive signals are timed either by its

internal oscillator or by an external clock. The internal oscillator is enabled by connecting

pin OSC to pin VSS. If the internal oscillator is used, the output from pin CLK can be used

as the clock signal for several PCF8576Ds in the system that are connected in cascade.

7.5.2 External clock

Pin CLK is enable d as an ext erna l cl oc k inpu t by conne ctin g pin OSC to VDD. The LCD

frame signal frequency is determined by the clock frequency (fclk).

Remark: A clock signal must always be supplied to the device; removing the clock may

freeze the LCD in a DC state, which is not suitable for the liquid crystal.

7.6 Timing

The PCF8576D timing controls the internal data flow of the device. This includ es the

transfer of display dat a from the display RAM to the display segmen t outputs. In casca ded

applications, the correct timing relationship betwe en each PCF8576D in the system is

maintained by the synchronization signal at pin SYNC. The timing also genera tes the LCD

frame signal whose frequency is derived from the clock frequency. The frame signal

frequency is a fixed division of the clock frequency from either the internal or an external

clock: .

7.7 Display register

The display latch holds the display data while the corresponding multiplex signals are

generated.

7.8 Segment outputs

The LCD drive section includes 40 segment outputs S0 to S39 which should be

connected dir ec tly to the LC D. Th e segm e nt output signals are generated in accordance

with the multiplexed backplane signals and with data residing in the display latch. When

less than 40 segment outputs are required, the unused segment outputs should be left

open-circuit.

7.9 Backplane outputs

The LCD drive section includes four backplane outputs BP0 to BP3 which must be

connected directly to the LCD. The backplane output signals are generated in accordance

with the selected LCD drive mode. If less than four backplane outputs are required, the

unused outp uts can be left open-c ircu it.

ffr fclk

-------

Product data sheet Rev. 15 — 12 February 2015 18 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

•In 1:3 multiplex drive mode, BP3 carries the same signal as BP1 , theref ore these two

adjacent outputs can be tied together to give enhanced drive capabilities.

•In 1:2 multiplex drive mode, BP0 and BP2, respectively, BP1 and BP3 all carry the

same signals and may also be paired to increase the drive capa bilities.

•In static drive mode the same signal is carried by all four backplane outputs and they

can be connected in parallel for very high drive requirement s.

7.10 Display RAM

The display RAM is a static 40  4-bit RAM which stores LCD data.

There is a one-to-one correspondence between

•the bits in the RAM bitmap and the LCD segments/elemen ts

•the RAM columns and the se gm e nt outpu ts

•the RAM rows and the backplane outputs.

A logic 1 in the RAM bitmap indicates the on-state of the corresponding LCD element;

similarly, a log ic 0 indicates the off-state.

The display RAM bit map, Figure 12, shows the rows 0 to 3 which correspond with the

backplane outputs BP0 to BP3, and the columns 0 to 39 which correspond with the

segment outputs S0 to S39. In multiplexed LCD applications the segment data of the first,

second, third and fourth row of the display RAM are time-multiplexed with BP0, BP1 , BP2,

and BP3 respectively.

When display data is transmitted to the PCF8576D, the received display bytes are stored

in the display RAM in accordance with the selected LCD drive mode. The data is stored as

it arrives and depending o n the current multiplex dr ive mode the bit s are sto red singularly,

in pairs, triples, or quadruples. To illustrate the filling order, an example of a 7-segment

display showing all drive modes is given in Figure 13; the RAM filling organization

depicted applies equally to other LCD types.

The display RAM bitmap shows the direct relationship between the display RAM column and the

segment outputs; and between the bits in a RAM row and the backplane outputs.

Fig 12. Display RAM bit map

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Product data sheet Rev. 15 — 12 February 2015 19 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

x = data bit unchanged.

Fig 13. Relationsh ip between LCD layout, drive mode, display RAM filling order and display data transmitted over the I2C-bus

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Product data sheet Rev. 15 — 12 February 2015 20 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

The following applies to Figure 13:

•In static drive mode the eight transmitted dat a bits are placed into row 0 as one byte.

•In 1:2 multiplex drive mode the eight transmitted data bits are placed in pairs into

row 0 and 1 as four successive 2-bit RAM words.

•In 1:3 multiplex drive mode the eight bits are placed in triples into row 0, 1, and 2 as

three successive 3-bit RAM words, with bit 3 of the third address left unchanged. It is

not recommended to use this bit in a display because of the difficult addressing. This

last bit may, if necessary, be controlled by an additional transfer to this address, but

care should be t aken to avoid overwriting adjacent dat a because always fu ll bytes are

transmitted (see Section 7.10.3).

•In 1:4 multiplex drive mode, the eight transmitted data bits are placed in quadruples

into row 0, 1, 2, and 3 as two successive 4-bit RAM words.

7.10.1 Data pointer

The addressing mechanism for the display RAM is realized using the data pointer. This

allows the loading of an individual display data byte, or a series of display data bytes, into

any location of the display RAM. The sequence commences with the initialization of the

data pointer by the load-data-pointer command (see Table 13). Following this command,

an arriving data byte is stored at the display RAM address indicated by the data pointer.

The filling order is shown in Figure 13. After each byte is stored, the content of the data

pointer is automatically incremen ted by a value dependent on the selected LCD drive

mode:

•In static drive mode by eight.

•In 1:2 multiplex drive mode by four.

•In 1:3 multiplex drive mode by three.

•In 1:4 multiplex drive mode by two.

If an I2C-bus data access terminates early then the state of the data pointer is unknown.

Consequently, the data pointe r must be rewritten prior to further RAM accesses.

7.10.2 Subaddress counter

The storage of display data is determined by the contents of the subaddress counter.

Storage is allowed only when the content of the subaddress counter match with the

hardware subaddr ess applied to A0, A1, and A2. The subadd ress counter value is defined

by the device-select command (see Table 14). If the content of the subaddress counter

and the hardware subaddress do not match then data storage is inhibited but the data

pointer is incremented as if d ata storage had t a ken place. The subaddress co unter is also

incremented when the data pointer overflows.

The storage arra nge ments described lead to extremely ef ficient da ta loading in cascaded

applications. When a series of display bytes are sent to the display RAM, automatic

wrap-over to the next PCF8576D occurs when the last RAM address is exceeded.

Subaddressing across device boundaries is successful even if the change to the next

device in the cascade occur s within a transmitted character.

The hardware subadd ress must not be changed while the device is being accesse d on the

I2C-bus interface.

Product data sheet Rev. 15 — 12 February 2015 21 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.10.3 RAM writing in 1:3 multiplex drive mode

In 1:3 multiplex drive mode, the RAM is written as shown in Table 7 (see Figure 13 as

well).

If the bit at position BP2/S2 would be written by a second byte transmitted, then the

mapping of the segment bits would change as illustrated in Table 8.

In the case described in Table 8 the RAM has to be written entirely and BP2/S2, BP2/S5,

BP2/S8 etc. have to be connected to segments/elements on the display. This can be

achieved by a combination of writing and rewriting the RAM like follows:

•In the first write to the RAM, bits a7 to a0 are written.

•In the second write, bits b7 to b0 are written, overwriting bits a1 and a0 with bits b7

and b6.

•In the third write, bits c7 to c0 are written, overwriting bits b1 and b0 with bits c7 and

c6.

Depending on the method of writing to the RAM (standard or entire filling by rewriting),

some segments/elements remain unused or can be used, but it has to be considered in

the module layout process as well as in the driver software design.

7.10.4 Writing over the RAM address boundary

In all multiplex drive modes, depending on the setting of the data pointer, it is possible to

fill the RAM over the RAM address boundary. If the PCF8576D is part of a cascade the

additional bits fall into the next device that also generates the acknowledge signal. If the

PCF8576D is a single device or the last device in a cascade the additional bits will be

discarded and no acknowledge signal will be generated.

Table 7. Standard RAM filling in 1:3 multiplex drive mode

Assumption: BP2/S2, BP2/S5, BP2/S8 etc. are not connected to any segments/elements on the

display.

Display RAM

bits (rows)/

backplane

outputs (BPn)

Display RAM addresses (columns)/segment ou tputs (Sn)

0123456789:

0a7 a4 a1 b7 b4 b1 c7 c4 c1 d7 :

1a6 a3 a0 b6 b3 b0 c6 c3 c0 d6 :

2a5 a2 - b5 b2 - c5 c2 - d5 :

3----------:

Table 8. Entire RAM filling by rewriting in 1:3 multiplex drive mode

Assumption: BP2/S2, BP2/S5, BP2/S8 etc. are connected to segments/elements on the display.

Display RAM

bits (rows)/

backplane

outputs (BPn)

Display RAM addresses (columns)/segment ou tputs (Sn)

0123456789:

0a7 a4 a1/b7 b4 b1/c7 c4 c1/d7 d4 d1/e7 e4 :

1a6 a3 a0/b6 b3 b0/c6 c3 c0/d6 d3 d0/e6 e3 :

2a5 a2 b5 b2 c5 c2 d5 d2 e5 e2 :

3----------:

Product data sheet Rev. 15 — 12 February 2015 22 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

7.10.5 Output bank selector

The output bank selector (see Table 15) selects one of the four rows per display RAM

address for transfer to the display register. The actual row selected depends on the

selected LCD drive mode in op eration and on the instant in the multiplex sequence.

•In 1:4 multiplex mode, all RAM addresses of ro w 0 are selected , these are followed by

the contents of row 1, 2, and then 3

•In 1:3 multiplex mode, rows 0, 1, and 2 are selected sequentially

•In 1:2 multiplex mode, rows 0 and 1 are selected

•In static mode, row 0 is selected

The PCF8576D includes a RAM bank switching feature in the static and 1:2 multiplex

drive modes. In the static drive mod e, the bank-select command may req uest the contents

of row 2 to be selected for display instead of the contents of row 0. In the 1:2 multiplex

mode, the contents of rows 2 and 3 may be selected instead of rows 0 and 1. This gives

the provision for preparing display information in an alternative bank and to be able to

switch to it once it is assembled.

7.10.6 Input bank selector

The input bank sele cto r loads disp lay da ta into the dis pla y RAM in accordance with the

selected LCD drive configuration. Display dat a can be loaded in row 2 in static drive mode

or in rows 2 and 3 in 1:2 multiplex drive mode by using the bank-select command (see

Table 15). The input bank selector functions independently to the output bank selector.

7.11 Blinking

The display blinking capabilities of the PCF8576D are very versatile. The whole display

can blink at frequen cie s selected by the blink-select command (see Table 16). The blink

frequencies are derived from the clock frequency. The ratio between the clock and blin k

frequencies depends on the blink mode selected (see Table 16).

An additional feature is for an arbitrary select ion of LCD segments/elements to blink. This

applies to the static and 1:2 multiplex drive modes and can be implemented with out any

communication overheads. By means of the output bank selector, the displayed RAM

banks are exchanged with alternate RAM banks at th e blink frequency. This mode can

also be specified by the blink-sele ct command.

In the 1:3 and 1:4 multiplex modes, where no alternative RAM bank is available, groups of

LCD segments /elements can blink by selectively changing the display RAM data at fixed

time intervals.

The entire display can blink at a frequency other than the nominal blink frequency. This

can be effectively performed by resetting and setting the display enable bit E at the

required rate using the mode-set command (se e Table 12).

Product data sheet Rev. 15 — 12 February 2015 23 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

[1] Blink modes 1, 2 and 3 and the nominal blink frequencies 0.5 Hz, 1 Hz and 2 H z correspond to an oscillator

frequency (fclk) of 1536 Hz (see Section 13).

7.12 Command decoder

The command decoder identifies command bytes that arr ive on the I2C-bus. The

commands availa ble to th e PCF 85 7 6D ar e defin ed in Table 10.

[1] Not used.

All available commands carry a continuation bit C in their most significant bit position as

shown in Figure 19. When this bit is set logic 1, it indicates that the next byte of the

transfer to arrive will also represent a command. If this bit is set logic 0, it indicates that

the command byte is the last in the transfer . Further bytes will be regarded as display data

(see Table 11).

Table 9. Blinking frequencies

Blink mode Normal operating mode ra tio Nominal blink frequen cy [1]

off - blinking off

12 Hz

21 Hz

3 0.5 Hz

fclk

768

----------

fclk

1536

-------------

fclk

3072

-------------

Table 10. Definition of PCF8576D commands

Command Operation code Reference

Bit 76543210

mode-set C 1 0 -[1] E B M[1:0] Table 12

load-data-pointer C 0 P[5:0] Table 13

device-select C1100A[2:0] Table 14

bank-select C 1 1 1 1 0 I O Table 15

blink-select C 1 1 1 0 AB BF[1:0] Table 16

Tabl e 11. C bit description

Bit Symbol Value Description

7C continue bit

0 last control byte in the transfer; next byte w ill be re garded

as display data

1 control bytes continue; next byte will be a command too

Product data sheet Rev. 15 — 12 February 2015 24 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

[1] The possibility to disable the display allows implementation of blinking under external control.

[2] Default value.

[3] The display is disabled by setting all backplane and segment outputs to VLCD.

[4] Not applicable for static drive mode.

[1] Default value.

Table 12. Mode-set command bit description

Bit Symbol Value Description

7C0, 1see Table 11

6, 5 - 10 fixed value

4 - - unused

3E display status[1]

0[2] disabled (blank)[3]

1 enabled

2B LCD bias configuration[4]

0[2] 1⁄3 bias

11⁄2 bias

1 to 0 M[1:0] LCD drive mode selection

01 static; BP0

10 1:2 multiplex; BP0, BP1

11 1:3 multiplex; BP0, BP1, BP2

00[2] 1:4 multiplex; BP0, BP1, BP2, BP3

Table 13. Load-data-pointer command bit description

See Section 7.10.1.

Bit Symbol Value Description

7C0, 1see Table 11

6 - 0 fixed value

5 to 0 P[5:0] 000000[1] to

100111 6 bit binary value, 0 to 39; tra nsferred to the data pointer to

define one of forty display RAM addresses

Table 14. Device-select command bit description

See Section 7.10.2.

Bit Symbol Value Description

7C0, 1see Table 11

6 to 3 - 1100 fixed value

2 to 0 A[2:0] 000[1] to 111 3 bit binary value, 0 to 7; transferred to the subaddress

counter to define one of eight hardware subaddresses

Product data sheet Rev. 15 — 12 February 2015 25 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

[1] The bank-select command has no effect in 1:3 and 1:4 multiplex drive modes.

[2] Default value.

[1] Normal blinking is assumed when the LCD multiplex drive modes 1:3 or 1:4 are selected.

[2] Default value.

[3] Alternate RAM bank blinking does not apply in 1:3 and 1:4 multiplex drive modes.

7.13 Display controller

The display controller executes the commands identified by the command decoder. It

contains the device’s status registers and coordinates their effects. The display controller

is also responsible for loading display dat a into the display RAM in the correct filling order.

Table 15. Bank-select command bit description

See Section 7.10.5 and Section 7.10.6.

Bit Symbol Value Description

Static 1:2 multiplex[1]

7 C 0, 1 see Table 11

6 to 2 - 11110 fixed value

1I input bank selection; storage of arriving display data

0[2] RAM row 0 RAM rows 0 and 1

1 RAM row 2 RAM rows 2 and 3

0O output bank selec t ion ; retrieval of LCD display data

0[2] RAM row 0 RAM rows 0 and 1

1 RAM row 2 RAM rows 2 and 3

Table 16. Blink-select command bit description

See Section 7.11.

Bit Symbol Value Description

7C0, 1see Table 11

6 to 3 - 1110 fixed value

2AB blink mode selection

0[2] normal blinking[1]

1 alternate RAM bank blinking[3]

1 to 0 BF[1:0] blink frequency selection

00[2] off

01 1

10 2

11 3

Product data sheet Rev. 15 — 12 February 2015 26 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

8. Characteristics of the I2C-bus

The I2C-bus is for bidirection al, two-line communication between dif ferent ICs or modules.

The two lines are a Serial DAt a line (SDA) and a Serial CLock line (SCL). Both lines must

be connected to a positive supply via a pull-up resistor when connected to the output

stages of a device. Data transfer may be initiated only when the bus is not busy.

8.1 Bit transfer

One data b it is transferred durin g each clock pulse . The data on th e SDA line must remain

stable during the HIGH period of the clock pulse as changes in the data line at this time

will be interpreted as a control signal (see Figure 14).

8.2 START and STOP conditions

Both data and clock lines remain HIGH when the bus is not busy.

A HIGH-to-LOW transition of the dat a line while the clock is HIGH is defined as the START

condition - S.

A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP

condition - P.

The START and STOP conditions are illustrated in Figure 15.

8.3 System configuration

A device generating a message is a transmitter, a device receiving a message is the

receiver. The device that controls the message is the master and the devices which are

controlled by the master are the slaves. The system configuration is shown in Figure 16.

Fig 14. Bit transfer

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Product data sheet Rev. 15 — 12 February 2015 27 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

8.4 Acknowledge

The number of data bytes tran sf er re d be tween the START and STOP conditions from

transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowled ge

cycle.

•A slave receiver, which is addressed, must generate an acknowledge after the

reception of each byte.

•A master receiver must generate an acknowledge after the reception of each byte that

has been cloc ke d ou t of th e slave transmi tte r.

•The device that acknowledges must pull-down the SDA line during the ac knowledge

clock pulse, so that the SDA line is stable LOW during the HIGH period of the

acknowledge related clock pulse (set-up and hold times must be taken into

consideration).

•A master receiver must signal an end of data to the transmitter by not generating an

acknowledge on the last byte that has been clocked out of the slave. In this event, the

transmitter must leav e th e da ta line HIGH to enable the master to generate a STOP

condition.

Acknowledgement on the I2C-bus is illustrated in Figure 17.

Fig 16. System configuration

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Product data sheet Rev. 15 — 12 February 2015 28 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

8.5 I2C-bus controller

The PCF8576D acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or

transmit data to an I2C-bus master receiver. The only data output from the PCF8576D are

the acknowledge signals of the selected devices. Device selection depends on the

I2C-bus slave address, on the transferred command data and on the hardware

subaddress.

In single device applications, the hardware subadd ress inputs A0, A1, and A2 are

normally tied to VSS which defines the hardware subaddress 0. In multiple device

applications A0, A1, and A2 are tied to VSS or VDD using a binary coding scheme, so that

no two devices with a common I2C-bus slave address have the same hardware

subaddress.

8.6 Input filters

To enhance noise immunity in electrically adverse environments, RC low-pass filters are

provided on the SDA and SCL lines.

8.7 I2C-bus protocol

Two I2C-bus slave addresse s (0111 000 and 0111 001) are used to address the

PCF8576D. The entir e I 2C-bus slave address byte is shown in Table 17.

The PCF8576D is a write-only device and will not respond to a read access, therefore bit

0 should always be logic 0. Bit 1 of the slave address byte that a PCF8576D will respond

to, is defined by the level tied to its SA0 input (VSS for logic 0 and VDD for logic 1).

Having two reserved slave addresses allows the following on the same I2C-bus:

•Up to 16 PCF8576D for very large LCD application s

•The use of two types of LCD multiplex drive

The I2C-bus protocol is shown in Figure 18. The sequence is initiated with a START

condition (S) from the I2C-bus master which is followed by one of two possible PCF8576D

slave addresses available. All PCF8576Ds whose SA0 inputs correspond to bit 0 of the

slave address respond by asserting an acknowledge in parallel. This I2C-bus transfer is

ignored by all PCF8576Ds whose SA0 inputs are set to the alternative level.

Table 17. I2C slave address byte

Slave address

Bit 7 6 5 4 3 2 1 0

MSB LSB

011100SA0R/W

Product data sheet Rev. 15 — 12 February 2015 29 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

After an acknowledgement, one or more command bytes follow, that define the status of

each addressed PCF8576D.

The last command byte sent is identified by resetting its most significant bit, continuation

bit C, (see Figure 19). The command bytes are also acknowledged by all add ressed

PCF8576D on the bus.

After the last command byte, one or more display data bytes may follow. Display data

bytes are stored in the display RAM at the address specified by the data pointer and the

subaddress counter. Both data poin ter and subaddre ss counter are auto matically updated

and the data dir ected to the intended PCF8576D device.

An acknowledgement after each byte is asserted only by the PCF8576Ds that are

addressed via address lines A0, A1, and A2. After the last display byte, the I2C-bus

master asserts a STOP condition (P). Alternately a START may be asserted to restart an

I2C-bus access.

Fig 18. I2C-bus protocol

Fig 19. F ormat of co mman d by te

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Product data sheet Rev. 15 — 12 February 2015 30 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

9. Internal circuitry

Fig 20. Device protection circuits

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Product data sheet Rev. 15 — 12 February 2015 31 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

10. Safety notes

CAUTION

This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling

electrostatic sensitive devices.

Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or

equivalent standards.

CAUTION

Static voltages across the liquid crystal display can build up when the LCD supply voltage

(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted

display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.

CAUTION

Semiconductors are light sensitive. Exposure to light sources can cause the IC to

malfunction. The IC must be protected against light. The protection must be applied to all

sides of the IC.

Product data sheet Rev. 15 — 12 February 2015 32 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

11. Limiting values

[1] Pass level; Human Body Model (HBM) according to Ref. 8 “ JESD22-A114”.

[2] Pass level; Machine Model (MM), according to Ref. 9 “JESD22-A115”.

[3] Pass level; Charged-Device Model (CDM), according to Ref. 10 “JESD22-C101”.

[4] Pass level; latch-up testing according to Ref. 11 “JESD78” at maximum ambient temperature (Tamb(max)).

[5] According to the store and transport requirements (see Ref. 15 “UM10569”) the devices have to be stored at a temperature of +8 C to

+45 C and a humidity of 25 % to 75 %.

Table 18. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.5 +6.5 V

VLCD LCD supply voltage 0.5 +7.5 V

VIinput voltage on each of the pins CLK,

SDA, SCL, SYNC, SA0,

OSC, A0 to A2

0.5 +6.5 V

VOoutput voltage on each of the pins S0 to

S39, BP0 to BP3 0.5 +7.5 V

IIinput current 10 +10 mA

IOoutput current 10 +10 mA

IDD supply current 50 +50 mA

IDD(LCD) LCD supply current 50 +50 mA

ISS ground supply current 50 +50 mA

Ptot total power dissipation - 400 mW

Pooutput power - 100 mW

VESD electrostatic discharge

voltage HBM [1] -5000 V

MM [2] -200 V

CDM [3] -1500 V

Ilu latch-up current [4] -200mA

Tstg storage temperature [5] 65 +150 C

Tamb ambient temperature operating device 40 +85 C

Product data sheet Rev. 15 — 12 February 2015 33 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

12. Static characteristics

[1] VLCD > 3 V for 1⁄3 bias.

[2] LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50 % duty factor; I2C-bus inactive.

[3] The I2C-bus interface of PCF8576D is 5 V tolerant.

[4] When tested, I2C pins SCL and SDA have no diode to VDD and may be driven to the VI limiting values given in Table 18.

[5] Propagation delay of driver between clock (CLK) and LCD driving signals.

[6] Periodically sampled, not 100 % tested.

[7] Outputs measured one at a time.

Table 19 . Static characteristics

VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 6.5 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supplies

VDD supply voltage 1.8 - 5.5 V

VLCD LCD supply voltage [1] 2.5- 6.5V

IDD supply current fclk(ext) = 1536 Hz [2] -3.57A

VDD = 3.0 V; Tamb =25C- 2.7 - A

IDD(LCD) LCD supply current fclk(ext) = 1536 Hz [2] -2332A

VDD(LCD) =3.0V;

Tamb =25C-13-A

Logic[3]

VP(POR) power-on reset supply

voltage 1.01.31.6V

VIL LOW-level input voltage on pins CLK, SYNC, OSC,

A0 to A2, SA0, SCL, SDA VSS -0.3V

DD V

VIH HIGH-level input voltage on pins CLK, SYNC, OSC,

A0 to A2, SA0, SCL, SDA [4][5] 0.7VDD -V

DD V

IOL LOW-level output current output sink current;

VOL = 0.4 V; VDD =5V

on pins CLK and SYNC 1- - mA

on pin SDA 3 - - mA

IOH(CLK) HIGH-level output current

on pin CLK output source current;

VOH =4.6V; V

DD =5V 1- - mA

ILleakage current VI=V

DD or VSS;

on pins CLK, SCL, SDA, A0

to A2 and SA0

1- +1A

IL(OSC) leakage current on pin

OSC VI=V

DD 1- +1A

CIinput capacitance [6] --7pF

LCD outputs

VOoutput voltage variation on pins BP0 to BP3 and

S0 to S39 100 - +100 mV

ROoutput resistance VLCD = 5 V [7]

on pins BP0 to BP3 - 1.5 - k

on pins S0 to S39 - 6.0 - k

Product data sheet Rev. 15 — 12 February 2015 34 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

13. Dynamic characteristics

[1] Typical output duty factor: 50 % measured at the CLK output pin.

[2] Not tested in production.

[3] All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an

input voltage swing of VSS to VDD.

Table 20. Dynamic characteristics

VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 2.5 V to 6.5 V; Tamb =





C to +85



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Clock

fclk(int) internal clock frequency [1] 1440 1850 2640 Hz

fclk(ext) external clock frequency 960 - 2640 Hz

tclk(H) HIGH-level clock time 60 - - s

tclk(L) LOW-level clock time 60 - - s

Synchronization

tPD(SYNC_N) SYNC propagation delay - 30 - ns

tSYNC_NL SYNC LOW time 1 - - s

tPD(drv) driver propagation delay VLCD = 5 V [2] --30s

I2C-bus[3]

Pin SCL

fSCL SCL clock frequency - - 400 kHz

tLOW LOW period of the SCL

clock 1.3 - - s

tHIGH HIGH period of the SCL

clock 0.6 - - s

Pin SDA

tSU;DAT data set-up time 100 - - ns

tHD;DAT data hold time 0 - - ns

Pins SCL and SDA

tBUF bus free time between a

STOP and START

condition

1.3 - - s

tSU;STO set-up time for STOP

condition 0.6 - - s

tHD;STA hold time (repeated)

START condition 0.6 - - s

tSU;STA set-up time for a repeate d

START condition 0.6 - - s

trrise time of both SDA and

SCL signals fSCL = 400 kHz - - 0.3 s

fSCL < 125 kHz - - 1.0 s

tffall time of both SDA and

SCL signals --0.3s

Cbcapacitive load for each

bus line --400pF

tw(spike) spike pulse width on the I2C-bus - - 50 ns

Product data sheet Rev. 15 — 12 February 2015 35 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

14. Application information

14.1 Cascaded operation

In large display configurations, up to 16 PCF8576Ds can be differentiated on the same

I2C-bus by using the 3-bit hardware subaddresses (A0, A1 and A2) and the

programmable I2C-bus slave address (SA0).

Fig 21. Driver timing waveforms

Fig 22. I2C-bus timing waveforms

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Product data sheet Rev. 15 — 12 February 2015 36 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

PCF8576Ds connected in cascade are synchronized to allow the backplane signals from

only one device in the cascade to be shared. This arrangement is cost-effective in large

LCD applications since the backplane outputs of only one device need to be

through-plated to the backplane electrodes of the display. The other PCF8576D of the

cascade contribute additional segment outputs. The backplanes can either be connected

together to enhance the drive capability or some can be left open-circuit (such as the ones

from the slave in Figure 23) or just some of the master and some of the slave will be taken

to facilitate the layout of the display.

All PCF8576Ds connected in cascade are correctly synchronized by the SYNC signal.

This synchronization is guarante ed after the power-on reset. The only time that SYNC is

likely to be needed is if synchronization is lost accidentally, for example, by noise in

adverse electrical environments, or if the LCD multiplex drive mode is changed in an

application using several cascaded PCF857 6Ds, as the drive mode cannot be changed

on all of the cascaded devices simultaneously. SYNC can be either an input or an output

signal; a SYNC output is implemented as an open-drain driver with an internal pull-up

resistor. The PCF8576D asserts SYNC at the start of its last active backplane signal and

monitors the SYNC line at all other times. If cascade synchronization is lost, it is restored

by the first PCF8576D to assert SYNC. The timing relationship between the backplane

waveforms and the SYNC signal for each LCD drive mode is shown in Figure 24.

The contact resistance between the SYNC on each cascaded device must be controlled.

If the resistance is too high, the device is not able to synchronize properly; this is

particularly applicable to chip-on-glass applications. The maximum SYNC contact

resistance allowed for the number of devices in cascade is given in Table 22.

Table 21. Addressing cascaded PCF8576D

Cluster Bit SA0 Pin A2 Pin A1 Pin A0 Device

100000

0011

0102

0113

1004

1015

1106

1117

210008

0019

01010

01111

10012

10113

11014

11115

Product data sheet Rev. 15 — 12 February 2015 37 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

The PCF8576D can be cascaded with the PCF8562. This allows optimal drive selection

for a given number of pixels to display. Figure 21 and Figure 22 show the timing of the

synchronization signals.

Table 22. SYNC contact resistance

Number of devices Maximum contact resist ance

26 k

3 to 5 2.2 k

6 to 10 1.2 k

10 to 16 700 

Fig 23. Cascaded PCF8576D configuration

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Product data sheet Rev. 15 — 12 February 2015 38 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

15. Test information

The following quality information corresponds with the product type: PCF8576DT/S400/2

15.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated

circuits, and is suitable for use in automotive applications.

Fig 24. Synchronization of the cascade for the various PCF8576D drive mod es

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Product data sheet Rev. 15 — 12 February 2015 39 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

16. Package outline

Fig 25. Packag e outline SOT364-1 (TSSOP56) of PCF8576DT

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Product data sheet Rev. 15 — 12 February 2015 40 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

17. Bare die outline

Fig 26. Bare die outline PCF8576DU/DA (for dimensions see Table 23)

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Product data sheet Rev. 15 — 12 February 2015 41 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

Fig 27. Bare die ou tline PCF8576DU/2DA (for dimen sion s see Table 24)

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Product data sheet Rev. 15 — 12 February 2015 42 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

[1] Dimension not drawn to scale.

[2] Pad size.

[3] Passivation opening.

[1] Dimension not drawn to scale.

Table 23. Dimensions of PCF8576DU/DA

Original dimensions are in mm.

Unit (mm) A D E e[1] P1[2] P2[3] P3[2] P4[3]

max--------

nom 0.38 2.2 2.0 - 0.09 0.08 0.066 0.056

min - - - 0.072 - - - -

Table 24. Dimensions of PCF8576DU/2DA

Original dimensions are in mm.

Unit (mm) A A1A2b D E e[1] L

max-0.012------

nom 0.40 0.015 0.381 0.052 2.2 2.0 - 0.077

min - 0.018 - - - - 0.072 -

Table 25. Bonding pad location for PCF8576DU/x

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 3, Figure 26 and Figure 27).

Symbol Pad X (m) Y (m) Description

SDA 1 34.38 876.6 I2C-bus serial data input/output

SCL 2 109.53 876.6 I2C-bus serial clock input

SCL 3 181.53 876.6

SYNC 4 365.58 876.6 cascade synchronization input/output

CLK 5 469.08 876.6 external clock input/output

VDD 6 577.08 876.6 supply voltage

OSC 7 740.88 876.6 internal oscillator enable input

A0 8 835.83 876.6 subaddress inputs

A1 9 1005.48 630.9

A2 10 1005.48 513.9

SA0 11 1005.48 396.9 I2C-bus address input; bit 0

VSS 12 1005.48 221.4 ground supply voltage

VLCD 13 1005.48 10.71 LCD supply voltage

BP0 14 1005.48 156.51 LCD backplane outputs

BP2 15 1005.48 232.74

BP1 16 1005.48 308.97

BP3 17 1005.48 385.2

S0 18 1005.48 493.2 LCD segment ou tputs

S1 19 1005.48 565.2

S2 20 1005.48 637.2

S3 21 1005.48 709.2

Product data sheet Rev. 15 — 12 February 2015 43 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

S4 22 347.22 876.6 LCD segment outputs

S5 23 263.97 876.6

S6 24 180.72 876.6

S7 25 97.47 876.6

S8 26 14.22 876.6

S9 27 69.03 876.6

S10 28 152.28 876.6

S11 29 235.53 876.6

S12 30 318.78 876.6

S13 31 402.03 876.6

S14 32 485.28 876.6

S15 33 568.53 876.6

S16 34 651.78 876.6

S17 35 735.03 876.6

S18 36 1005.5 625.59

S19 37 1005.5 541.62

S20 38 1005.5 458.19

S21 39 1005.5 374.76

S22 40 1005.5 291.33

S23 41 1005.5 207.9

S24 42 1005.5 124.47

S25 43 1005.5 41.04

S26 44 1005.5 42.39

S27 45 1005.5 125.8

S28 46 1005.5 209.3

S29 47 1005.5 292.7

S30 48 1005.5 376.1

S31 49 1005.5 459.5

S32 50 1005.5 543

S33 51 1005.5 625.6

S34 52 735.03 876.6

S35 53 663.03 876.6

S36 54591.03 876.6

S37 55 519.03 876.6

S38 56 447.03 876.6

S39 57 375.03 876.6

SDA 58 196.38 876.6 I2C-bus serial data input/output

SDA 59 106.38 876.6

Table 25. Bonding pad location for PCF8576DU/x …continued

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip (see Figure 3, Figure 26 and Figure 27).

Symbol Pad X (m) Y (m) Description

Product data sheet Rev. 15 — 12 February 2015 44 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

18. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that

all normal precautions are taken as described in JESD625-A, IEC61340-5 or equivalent

standards.

Table 26. Alignment marks

All x/y coordinates represent the position of the center of each alignment mark with respect to the

center (x/y = 0) of the chip (see Figure 3, Figure 26 and Figure 27).

Symbol Location Dimension

X (m) Y (m) Diameter (m)

C1 930.42 870.3 72

C2 829.98 870.3 72

Product data sheet Rev. 15 — 12 February 2015 45 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

19. Packing information

19.1 Tray information

Fig 28. Tray detail s

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Product data sheet Rev. 15 — 12 February 2015 46 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

19.2 Tape and reel information

For tape and reel packing information , please see Ref. 13 “SOT364-1_118” on page 53 .

Table 27 . Descriptio n of tray details

Tray details are shown in Figure 28.

Tray details

Dimensions

ABCDEFGHJKLMNUnit

3.6 3.6 2.36 2.11 50.8 45.72 39.6 5.6 5.6 39.6 3.96 2.18 2.49 mm

Number of pockets

x direction y direction

12 12

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Product data sheet Rev. 15 — 12 February 2015 47 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

20. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

20.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on on e printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

20.2 Wave and reflow soldering

W ave soldering is a joining te chnology in which the joints are m ade by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solde r lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads ha ving a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering ve rsus SnPb soldering

20.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 15 — 12 February 2015 48 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

20.4 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 30) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting th e process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) an d cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on p ackage thickness and volume and is classified in accordance with

Table 28 and 29

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 30.

Table 28. SnPb eutec t ic process (from J-STD-020D)

Package thickness (mm) Packag e reflow temperature (C)

Volume (mm3)

< 350  350

< 2.5 235 220

 2.5 220 220

Table 29. Le ad-free process (from J-ST D-020D)

Package thickness (mm) Packag e reflow temperature (C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 15 — 12 February 2015 49 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

For further informa tion on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

MSL: Moisture Sensitivity Level

Fig 30. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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Product data sheet Rev. 15 — 12 February 2015 50 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

21. Appendix

21.1 LCD segment driver selection

Table 30. Selec tion of LCD segment drivers

Type name Number of elements at MUX VDD (V) VLCD (V) ffr (Hz) VLCD (V)

charge

pump

VLCD (V)

temperature

compensat.

Tamb (C) Interface Package AEC-

Q100

1:1 1:2 1:3 1:4 1:6 1:8 1:9

PCA8553DTT 40 80 120 160 - - - 1.8 to 5.5 1.8 to 5.5 32 to 256[1] NN 40 to 105 I2C / SPI TSSOP56 Y

PCA8546ATT - - - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300[1] NN 40 to 95 I2C TSSOP56 Y

PCA8546BTT - - - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300[1] NN 40 to 95 SPI TSSOP56 Y

PCA8547AHT 44 88 - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 95 I2CTQFP64Y

PCA8547BHT 44 88 - 176 - - - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 95 SPI TQFP64 Y

PCF85134HL 60 120 180 240 - - - 1.8 to 5.5 2.5 to 6.5 82 N N 40 to 85 I2CLQFP80N

PCA85134H 60 120 180 240 - - - 1.8 to 5.5 2.5 to 8 82 N N 40 to 95 I2CLQFP80Y

PCA8543AHL 60 120 - 240 - - - 2.5 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 105 I2CLQFP80Y

PCF8545ATT - - - 176 252 320 - 1.8 to 5.5 2.5 to 5.5 60 to 300[1] NN 40 to 85 I2C TSSOP56 N

PCF8545BTT - - - 176 252 320 - 1.8 to 5.5 2.5 to 5.5 60 to 300[1] NN 40 to 85 SPI TSSOP56 N

PCF8536AT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300[1] NN 40 to 85 I2C TSSOP56 N

PCF8536BT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300[1] NN 40 to 85 SPI TSSOP56 N

PCA8536AT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300[1] NN 40 to 95 I2C TSSOP56 Y

PCA8536BT - - - 176 252 320 - 1.8 to 5.5 2.5 to 9 60 to 300[1] NN 40 to 95 SPI TSSOP56 Y

PCF8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 85 I2CTQFP64N

PCF8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 85 SPI TQFP64 N

PCA8537AH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 95 I2CTQFP64Y

PCA8537BH 44 88 - 176 276 352 - 1.8 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 95 SPI TQFP64 Y

PCA9620H 60 120 - 240 320 480 - 2.5 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 105 I2CLQFP80Y

PCA9620U 60 120 - 240 320 480 - 2.5 to 5.5 2.5 to 9 60 to 300[1] YY 40 to 105 I2C Bare die Y

PCF8576DU 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 77 N N 40 to 85 I2C Bare die N

PCF8576EUG 40 80 120 160 - - - 1.8 to 5.5 2.5 to 6.5 77 N N 40 to 85 I2C Bare die N

PCA8576FUG 40 80 120 160 - - - 1.8 to 5.5 2.5 to 8 200 N N 40 to 105 I2C Bare die Y

PCF85133U 80 160 240 320 - - - 1.8 to 5.5 2.5 to 6.5 82, 110[2] NN 40 to 85 I2C Bare die N

PCA85133U 80 160 240 320 - - - 1.8 to 5.5 2.5 to 8 82, 110[2] NN 40 to 95 I2C B are die Y

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xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx

Product data sheet Rev. 15 — 12 February 2015 51 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

[1] Software programmable.

[2] Hardware selectable.

PCA85233UG 80 160 240 320 - - - 1.8 to 5.5 2.5 to 8 150, 220[2] NN 40 to 105 I2C Bare die Y

PCF85132U 160 320 480 640 - - - 1.8 to 5.5 1.8 to 8 60 to 90[1] NN 40 to 85 I2C Bare die N

PCA8530DUG 102 204 - 408 - - - 2.5 to 5.5 4 to 12 45 to 300[1] YY 40 to 105 I2C / SPI Bare die Y

PCA85132U 160 320 480 640 - - - 1.8 to 5.5 1.8 to 8 60 to 90[1] NN 40 to 95 I2C Bare die Y

PCA85232U 160 320 480 640 - - - 1.8 to 5.5 1.8 to 8 117 to 176[1] NN 40 to 95 I2C Bare die Y

PCF8538UG 102 204 - 408 612 816 918 2.5 to 5.5 4 to 12 45 to 300[1] YY 40 to 85 I2C / SPI Bare die N

PCA8538UG 102 204 - 408 612 816 918 2.5 to 5.5 4 to 12 45 to 300[1] YY 40 to 105 I2C / SPI Bare die Y

Table 30. Selec tion of LCD segment drivers …co n tinue d

Type name Number of elements at MUX VDD (V) VLCD (V) ffr (Hz) VLCD (V)

charge

pump

VLCD (V)

temperature

compensat.

Tamb (C) Interface Package AEC-

Q100

1:1 1:2 1:3 1:4 1:6 1:8 1:9

Product data sheet Rev. 15 — 12 February 2015 52 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

22. Abbreviations

Table 31. Abbreviations

Acronym Description

CDM Charged-Device Model

CMOS Complementary Metal-Oxide Semiconductor

HBM Human Body Model

ITO Indium T in Oxide

LCD Liquid Crystal Display

LSB Least Significant Bit

MM Machine Model

MSB Most Significant Bit

MSL Moisture Sensitivity Level

PCB Printed Ci rcu i t Boa rd

RAM Random Access Memory

RMS Root Mean Square

SCL Serial CLock line

SDA Serial DAta line

SMD Surface Mount Device

Product data sheet Rev. 15 — 12 February 2015 53 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

23. References

[1] AN10170 — Design guidelines for COG modules with NXP monochrome LCD

drivers

[2] AN10365 — Surface mount reflow soldering description

[3] AN10706 — Handling bare die

[4] AN10853 — ESD and EMC sensitivity of IC

[5] IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[6] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[7] IPC/JEDEC J-STD-020D — Moisture/R eflow Sensitiv ity Classific ation for

Nonhermetic Solid State Surface Mount Devices

[8] JESD 22 -A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[9] JESD 22 -A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[10] JESD 22 -C10 1 — Field-Induced Charged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components

[11] JESD78 — IC Latch-Up Test

[12] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[13] SOT364-1_118 — TSSOP56; Reel pack; SMD, 13", packing information

[14] UM10204 — I2C-bus specification and user manual

[15] UM10569 — Store and transport requirements

Product data sheet Rev. 15 — 12 February 2015 54 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

24. Revision history

Table 32. Revision history

Document ID Release date Dat a sheet status Change notice Supersedes

PCF8576D v.15 20150212 Product data sheet - PCF8576D v.14

Modifications: •The format of this data sheet has been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Changed IDD(LCD) values in Table 19

•Changed Section 14.1 and Section 19.2

•Added Section 21.1

•Fixed typos

PCF8576D v.14 20130610 Product data sheet - PCF8576D v.13

PCF8576D v.13 20120510 Product data sheet - PCF8576D v.12

PCF8576D v.12 20120413 Product data sheet - PCF8576D v.11

PCF8576D v.11 20110 627 Product data sheet PCF8576D v.10

PCF8576D v.10 20110214 Product data sheet - PCF8576D_9

PCF8576D_9 20090825 Product data sheet - PCF8576D_8

PCF8576D_8 20090319 Product data sheet - PCF8576D_7

PCF8576D_7 20081218 Product data sheet - PCF8576D_6

PCF8576D_6 20081202 Product data sheet - PCF8576D_5

PCF8576D_5 20041222 Product specification - PCF8576D_4

PCF8576D_4 20041008 Product specification - PCF8576D_3

PCF8576D_3 20040617 Product specification - PCF8576D_2

PCF8576D_2 20030623 Product specification - PCF8576D_1

PCF8576D_1 20030401 Objective specification - -

Product data sheet Rev. 15 — 12 February 2015 55 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

25. Legal information

25.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

25.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict wit h the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

25.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for t he customer’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo mer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specificati on for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 15 — 12 February 2015 56 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifica tions, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive appl ications beyond NXP Semiconductors’

standard warrant y and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Bare die — All die are tested on compliance with their related tech nical

specifications as stated in this data sheet up to the point of wafer sawing and

are handled in accordance with the NXP Semiconductors storage and

transportation conditions. If there are data sheet limits not guaranteed, these

will be separately indicated in the data sheet. There are no post-packing tests

performed on individual die or wafers.

NXP Semiconductors has no control of third party procedures in the sawing,

handling, packing or assembly of the die. Accordingly, NXP Semiconductors

assumes no liability for device functionality or performance of the die or

systems after third party sawing, handling, packing or assembly of the die. It

is the responsibility of the customer to test and qua lify their application in

which the die is used.

All die sales are conditione d upon and sub ject to the custo mer enter ing into a

written die sale agreement with NXP Semiconductors through its legal

department.

25.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

I2C-bus — logo is a trademark of NXP Semi conductors N.V.

26. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 15 — 12 February 2015 57 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

27. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 2. Ordering options. . . . . . . . . . . . . . . . . . . . . . . . .2

Table 3. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2

Table 4. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6

Table 5. Selection of possible display configuratio ns. . . .7

Table 6. Biasing characteristics . . . . . . . . . . . . . . . . . . . .9

Table 7. Standard RAM filling in 1:3 multipl ex drive

mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 8. Entire RAM filling by rewriting in 1:3 multiplex

drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

Table 9. Blinking frequencies . . . . . . . . . . . . . . . . . . . . .23

Table 10. Definition of PCF8576D commands . . . . . . . .23

Table 11. C bit description . . . . . . . . . . . . . . . . . . . . . . . .23

Table 12. Mode-set command bit description . . . . . . . . .24

Table 13. Load-data-pointer command bit description . . .24

Table 14. Device-select command bit description . . . . . .24

Table 15. Ban k-select command bit description . . . . . . .25

Table 16. Blink-select command bit description . . . . . . . .25

Table 17. I2C slave address byte . . . . . . . . . . . . . . . . . . .28

Table 18. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .32

Table 19. Static characteristics . . . . . . . . . . . . . . . . . . . .33

Table 20. Dynamic characteristics . . . . . . . . . . . . . . . . . .34

Table 21. Addressing cascaded PCF8576D . . . . . . . . . .36

Table 22. SYNC contact resistance . . . . . . . . . . . . . . . . .37

Table 23. Dimensions of PCF8576DU/DA . . . . . . . . . . . .4 2

Table 24. Dimensions of PCF8576DU/2DA . . . . . . . . . . .42

Table 25. Bonding pad location for PCF8576DU/x . . . . .42

Table 26. Alignment marks. . . . . . . . . . . . . . . . . . . . . . . .44

Table 27. Description of tray details . . . . . . . . . . . . . . . . .46

Table 28. SnPb eutectic process (from J-STD-020D) . . .48

Table 29. Le ad-free process (from J-STD-020D) . . . . . .48

Table 30. Selection of LCD segment drivers . . . . . . . . . .50

Table 31. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .52

Table 32. Revision history . . . . . . . . . . . . . . . . . . . . . . . .54

Product data sheet Rev. 15 — 12 February 2015 58 of 59

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

28. Figures

Fig 1. Block diagram of PCF8576D . . . . . . . . . . . . . . . . .3

Fig 2. Pinning diagram for PCF8576DT (TSSOP56). . . .4

Fig 3. Pinning diagram for PCF8576DU (bare die) . . . . .5

Fig 4. Example of displays suitable for PCF8576D . . . . .7

Fig 5. Typical system configuration . . . . . . . . . . . . . . . . .8

Fig 6. Electro-optical characteristic: relative

transmission curve of the liquid . . . . . . . . . . . . . .11

Fig 7. Static drive mode waveforms. . . . . . . . . . . . . . . .12

Fig 8. Waveforms for the 1:2 multiplex drive mode

with 1⁄2 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Fig 9. Waveforms for the 1:2 multiplex drive mode

with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Fig 10. Waveforms for the 1:3 multi plex drive mode

with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Fig 11. Waveforms for the 1:4 multiplex drive mode

with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Fig 12. Display RAM bit map . . . . . . . . . . . . . . . . . . . . . .18

Fig 13. Relationship between LCD layo ut, drive mode,

display RAM filling order and display data

transmitte d over the I2C-bus . . . . . . . . . . . . . . . .19

Fig 14. Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Fig 15. Definition of START and STOP conditions. . . . . .26

Fig 16. System configuration . . . . . . . . . . . . . . . . . . . . . .27

Fig 17. Acknowledgement of the I2C-bus . . . . . . . . . . . .27

Fig 18. I2C-bus protocol. . . . . . . . . . . . . . . . . . . . . . . . . .29

Fig 19. Format of command byte. . . . . . . . . . . . . . . . . . .29

Fig 20. Device protection circuits. . . . . . . . . . . . . . . . . . .30

Fig 21. Driver timing waveforms . . . . . . . . . . . . . . . . . . .35

Fig 22. I2C-bus timing waveforms . . . . . . . . . . . . . . . . . .35

Fig 23. Cascaded PCF8576D configuration . . . . . . . . . .37

Fig 24. Synchronization of the cascade for the various

PCF8576D drive modes . . . . . . . . . . . . . . . . . . .38

Fig 25. Package outline SOT364-1 (TSSOP56) of

PCF8576DT. . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Fig 26. Bare die outline PCF8576DU/DA (for dimensions

see Table 23). . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Fig 27. Bare die outline PCF8576DU/2DA (for dimensions

see Table 24). . . . . . . . . . . . . . . . . . . . . . . . . . . .41

Fig 28. Tray details . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Fig 29. Tray alignment. . . . . . . . . . . . . . . . . . . . . . . . . . .46

Fig 30. Temperature profiles for large and small

components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

NXP Semiconductors PCF8576D

40 × 4 universal LCD driver for low multiplex rates

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 12 February 2015

Document identifier: PCF8576D

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

29. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

3.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

7 Functional description . . . . . . . . . . . . . . . . . . . 7

7.1 Power-On Reset (POR) . . . . . . . . . . . . . . . . . . 8

7.2 LCD bias generator . . . . . . . . . . . . . . . . . . . . . 8

7.3 LCD voltage select or . . . . . . . . . . . . . . . . . . . . 8

7.3.1 Electro-optical performance . . . . . . . . . . . . . . 10

7.4 LCD drive mode waveforms. . . . . . . . . . . . . . 12

7.4.1 Static drive mode . . . . . . . . . . . . . . . . . . . . . . 12

7.4.2 1:2 Multiplex drive mode. . . . . . . . . . . . . . . . . 13

7.4.3 1:3 Multiplex drive mode. . . . . . . . . . . . . . . . . 15

7.4.4 1:4 Multiplex drive mode. . . . . . . . . . . . . . . . . 16

7.5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.5.1 Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.5.2 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.6 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.7 Display register. . . . . . . . . . . . . . . . . . . . . . . . 17

7.8 Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 17

7.9 Backplane outputs . . . . . . . . . . . . . . . . . . . . . 17

7.10 Display RAM. . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.10.1 Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.10.2 Subaddress counter . . . . . . . . . . . . . . . . . . . . 20

7.10.3 RAM writing in 1:3 multiplex drive mode. . . . . 21

7.10.4 Writing over the RAM address boundary . . . . 21

7.10.5 Output bank selector . . . . . . . . . . . . . . . . . . . 22

7.10.6 Input bank selector. . . . . . . . . . . . . . . . . . . . . 22

7.11 Blinking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7.12 Command decoder. . . . . . . . . . . . . . . . . . . . . 23

7.13 Display controller . . . . . . . . . . . . . . . . . . . . . . 25

8 Characteristics of the I2C-bus . . . . . . . . . . . . 26

8.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

8.2 START and STOP conditions . . . . . . . . . . . . . 26

8.3 System configuration . . . . . . . . . . . . . . . . . . . 26

8.4 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 27

8.5 I2C-bus controller . . . . . . . . . . . . . . . . . . . . . . 28

8.6 Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

8.7 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 28

9 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 30

10 Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

11 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 32

12 Static characteristics . . . . . . . . . . . . . . . . . . . 33

13 Dynamic characteristics. . . . . . . . . . . . . . . . . 34

14 Application information . . . . . . . . . . . . . . . . . 35

14.1 Cascaded operation. . . . . . . . . . . . . . . . . . . . 35

15 Test information . . . . . . . . . . . . . . . . . . . . . . . 38

15.1 Quality information. . . . . . . . . . . . . . . . . . . . . 38

16 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 39

17 Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 40

18 Handling information . . . . . . . . . . . . . . . . . . . 44

19 Packing information . . . . . . . . . . . . . . . . . . . . 45

19.1 Tray information. . . . . . . . . . . . . . . . . . . . . . . 45

19.2 Tape and reel information . . . . . . . . . . . . . . . 46

20 Soldering of SMD pa ckages. . . . . . . . . . . . . . 47

20.1 Introduction to soldering . . . . . . . . . . . . . . . . . 47

20.2 Wave and reflow soldering. . . . . . . . . . . . . . . 47

20.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 47

20.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 48

21 Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

21.1 LCD segment driver selection . . . . . . . . . . . . 50

22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 52

23 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

24 Revision history . . . . . . . . . . . . . . . . . . . . . . . 54

25 Legal information . . . . . . . . . . . . . . . . . . . . . . 55

25.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 55

25.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

25.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 55

25.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 56

26 Contact information . . . . . . . . . . . . . . . . . . . . 56

27 Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

28 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

29 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59