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Features Applications
Feature of the device: Small package
with high efficiency
Typical color temperature: 3050 K.
Typical viewing angle: 140°
Typical light flux output: 140 lm @700mA.
ESD protection.
Soldering methods: SMT
Grouping parameter: Luminous Flux,
Forward Voltage and Chromaticity.
Optical efficiency: 52 lm/W.
Moisture Sensitivity Level: 3
Color rendering Index: 75 (typ.)
Thermal resistance
(Junction to Heat sink): 15 °C /W
The product itself will remain within RoHS
compliant.
Design and effect illumination
Interior automotive lighting
(e.g. dashboard backlighting)
Room lighting (e.g. luminaries, spotlights)
Reading light (aircraft, car, bus)
Signal and symbol luminaries
Marker lights (e.g. steps, exit ways, etc.)
Architectural illumination
Materials
Items Description
Housing black body Heat resistant polymer
Encapsulating Resin Silicone resin
Electrodes Au plating copper alloy
Die attach Silver paste
Chip InGaN
EHP
-
A
X08EL
/
LM
01
H
P
03
/
2832/Y/
N11
High Power LED – 3 W
Data Sheet
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Dimensions
Notes.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ± 0.25mm.
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Maximum Ratings (TSoldering =25ºC)
Parameter Symbol Rating Unit
DC Operating Current IF750 mA
Pulsed Forward Current(1) IPF 1000 mA
ESD Sensitivity ESD 2000 V
Junction Temperature Tj125 °C
Operating Temperature Top. -40 ~ +85 °C
Storage Temperature Tstge. -40 ~ +100 °C
Junction To Heat-Sink Thermal Resistance Rth 15 °C /W
Electro-Optical Characteristics (TSoldering =25ºC)
Parameter Bin Symbol Min Typ. Max Unit Condition
Luminous
Flux (2)
---- Фv130 140 ---- lm
V2 3.25 ---- 3.55
V3 3.55 ---- 3.85
V4 3.85 ---- 4.15
Forward
Voltage(3)
V5
VF
4.15 ---- 4.45
V
Color
Temperature ---- CCT 2850 3050 3250 K
Color Rendering
Index(4)
---- CRI ---- 75 ---- ----
IF=700mA
Note.
1. tp ≦100μs, Duty cycle = 0.25
2. Luminous Flux measurement tolerance: ±10%.
3. Forward Voltage measurement tolerance: ±0.1V.
4. Color Rendering Index measurement tolerance: ± 5
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Luminous Flux Bin Table
Group Bin Min Typ. Max
1 1.5 ---- 3
2 3 ---- 4
3 4 ---- 5
4 5 ---- 6
E
5 6 ---- 8
1 8 ---- 10
2 10 ---- 13
3 13 ---- 17
4 17 ---- 20
F
5 20 ---- 23
1 23 ---- 27
2 27 ---- 33
3 33 ---- 39
4 39 ---- 45
J
5 45 ---- 52
1 52 ---- 60
2 60 ---- 70
31 70 ---- 75
32 75 ---- 80
33 80 ---- 85
41 85 ---- 90
42 90 ---- 95
43 95 ---- 100
51 100 ---- 110
52 110 ---- 120
K
53 120 ---- 130
Group Bin Min Typ. Max
11 130 ---- 140
12 140 ---- 150
13 150 ---- 160
21 160 ---- 180
22 180 ---- 200
31 200 ---- 225
32 225 ---- 250
41 250 ---- 275
42 275 ---- 300
51 300 ---- 350
N
52 350 ---- 400
1 400 ---- 500
2 500 ---- 600
3 600 ---- 750
4 750 ---- 1000
R
5 1000 ---- 1300
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White Binning Structure
Warm White
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50
0.32
0.36
0.40
0.44
0.48
2670K
2850K
3050K
3250K
3500K
3800K
4100K
4500K
M7
M6
M5
N7
N6
N5
P7
P6
P4
Q7
Q6
Q5
R7
R6
R5
S7
S6
S5
T7
T6
T5
M4
N4
P5
Q4
R4
S4
T4
CIE-Y
CIE-X
Note. The highlighted portion represents the allotted CCT sub-bins for this specific part number
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Warm -White Bin Coordinates
2628 Bin CIE X CIE Y Bin CIE X CIE Y
0.471 0.451 0.461 0.461
0.487 0.454 0.477 0.477
0.477 0.437 0.467 0.467
M4
0.461 0.433
M5
0.453 0.453
Reference Range: 2670~2850K Reference Range: 2670~2850K
Bin CIE X CIE Y Bin CIE X CIE Y
0.453 0.416 0.444 0.399
0.467 0.420 0.458 0.403
0.458 0.403 0.449 0.388
M6
0.444 0.399
M7
0.436 0.384
Reference Range: 2670~2850K Reference Range: 2670~2850K
2830 Bin CIE X CIE Y Bin CIE X CIE Y
0.454 0.446 0.446 0.429
0.471 0.451 0.461 0.433
0.461 0.433 0.453 0.416
N4
0.446 0.429
N5
0.438 0.412
Reference Range:2850~3050K Reference Range:2850~3050K
Bin CIE X CIE Y Bin CIE X CIE Y
0.438 0.412 0.429 0.394
0.453 0.416 0.444 0.399
0.444 0.399 0.436 0.384
N6
0.429 0.394
N7
0.422 0.379
Reference Range:2850~3050K Reference Range:2850~3050K
3032 Bin CIE X CIE Y Bin CIE X CIE Y
0.438 0.440 0.431 0.423
0.454 0.446 0.446 0.429
0.446 0.429 0.438 0.412
P4
0.431 0.423
P5
0.424 0.406
Reference Range: 3050~3250K Reference Range: 3050~3250K
Bin CIE X CIE Y Bin CIE X CIE Y
0.424 0.406 0.416 0.389
0.438 0.412 0.429 0.394
0.429 0.394 0.422 0.379
P6
0.416 0.389
P7
0.410 0.374
Reference Range: 3050~3250K Reference Range: 3050~3250K
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3235 Bin CIE X CIE Y Bin CIE X CIE Y
0.421 0.433 0.415 0.416
0.438 0.440 0.431 0.423
0.431 0.423 0.424 0.406
Q4
0.415 0.416
Q5
0.409 0.400
Reference Range: 3250~3500K Reference Range: 3250~3500K
Bin CIE X CIE Y Bin CIE X CIE Y
0.409 0.400 0.402 0.382
0.424 0.406 0.416 0.389
0.416 0.389 0.410 0.374
Q6
0.402 0.382
Q7
0.397 0.367
Reference Range: 3250~3500K Reference Range: 3250~3500K
3538 Bin CIE X CIE Y Bin CIE X CIE Y
0.402 0.423 0.396 0.404
0.421 0.433 0.415 0.416
0.415 0.416 0.409 0.400
R4
0.396 0.404
R5
0.392 0.391
Reference Range: 3500~3800K Reference Range: 3500~3800K
Bin CIE X CIE Y Bin CIE X CIE Y
0.392 0.391 0.387 0.374
0.409 0.400 0.402 0.382
0.402 0.382 0.397 0.367
R6
0.387 0.374
R7
0.383 0.360
Reference Range: 3500~3800K Reference Range: 3500~3800K
3841 Bin CIE X CIE Y Bin CIE X CIE Y
0.386 0.413 0.381 0.394
0.402 0.423 0.396 0.404
0.396 0.404 0.392 0.391
S4
0.381 0.394
S5
0.378 0.382
Reference Range: 3800~4100K Reference Range: 3800~4100K
Bin CIE X CIE Y Bin CIE X CIE Y
0.378 0.382 0.374 0.366
0.392 0.391 0.387 0.374
0.387 0.374 0.383 0.360
S6
0.374 0.366
S7
0.371 0.352
Reference Range: 3800~4100K Reference Range: 3800~4100K
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4145 Bin CIE X CIE Y Bin CIE X CIE Y
0.367 0.400 0.364 0.383
0.386 0.413 0.381 0.394
0.381 0.394 0.378 0.382
T4
0.364 0.383
T5
0.362 0.372
Reference Range: 4100~4500K Reference Range: 4100~4500K
Bin CIE X CIE Y Bin CIE X CIE Y
0.362 0.372 0.359 0.356
0.378 0.382 0.374 0.366
0.374 0.366 0.371 0.352
T6
0.359 0.356
T7
0.357 0.343
Reference Range: 4100~4500K Reference Range: 4100~4500K
Note.
1. X, Y color coordinates measurement tolerance: ±0.01.
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Relative Spectral Distribution,
IF=700mA, T Soldering =25ºC
Forward Voltage vs
.
Forward Current,
T Soldering =25ºC
Relative Luminous Intensity vs
.
Forward
Current, T Soldering =25ºC
Forward Current Derating Curve,
Derating based on T
j
MAX
=125
°C
0 20 40 60 80 100
100
200
300
400
500
600
700
800
Forward Current (mA)
Soldering Temperature (oC)
Typical Electro-Optical Characteristics Curves
400 500 600 700 800
0.0
0.2
0.4
0.6
0.8
1.0
Relative Luminous Intenstiy
Wavelength(nm)
0 200 400 600 800 1000
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
Forward Voltage (V)
Forward Current (mA)
0 200 400 600 800 1000
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Relative Luminous Intensity
Forward Current (mA)
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-80 -60 -40 -20 0 20 40 60 80
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Relative Luminous Intensity
Degree (2)
Typical Representative Spatial Radiation Pattern
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. Viewing angle tolerance is ± 10∘.
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Label explanation
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Rank of Luminous Flux
HUE: Color Rank
REF: Rank of Forward Voltage
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Tube Packing Specifications
1. Tube 2. Inner Carton
3. Outside Carton
Packing Quantity
1. 50 Pcs / Per Tube
2. 20 Tubes / Inner Carton
3. 12 Inner Cartons / Outside Carton
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Reliability Data
Stress Test Stress Condition Stress Duration
Reflow Tsol=260℃, 10sec, 6min 3 times
Thermal Shock
H：＋100℃20min.
∫ 10sec.
L：－ 10℃ 20min.
300 Cycles
Temperature Cycle
H：＋85℃ 30min.
∫ 5min.
L：－ 40℃ 30min.
300 Cycles
High Temperature/Humidity
Operation Ta=85℃ , RH=60%, IF=500mA 1000hours
Room Temperature Operation
Life Ta=25℃, IF=700mA 1000hours
High Temperature Operation
Life #1 Ta=55℃, IF=600mA 1000hours
High Temperature Operation
Life #2 Ta=85℃, IF=500mA 1000hours
Low Temperature Operation
Life Ta=-40℃, IF=700mA 1000hours
Failure Criteria:
1. LEDs are open or shorted
2. lm: luminous flux attenuate difference(1000hrs)>50%
3. VF: forward voltage difference(1000hrs)>20%
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Precautions For Use
Over-current-proof
Although the EHP-AX08 series has a conductive ESD protection mechanism, customer
must not use the device in reverse and should apply resistors for extra protection. Otherwise,
slight voltage shifts may cause significant current change resulting in burn out failure.
1. Storage
i. Do not open the packaging bag before the devices are ready to use.
ii. Before the package is opened, LEDs should be stored at temperatures less than 30℃
and humidity less than 50%.
iii. LEDs may be stored for 6 months. When the storage time has reached more than 6
months, LEDs should be stored in a sealed container filled with the Nitrogen gas.
iv. After the package is opened, LEDs should be stored at temperatures less than 30℃
and humidity less than 30%.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. Before using LEDs, baking treatment should be implemented based on the following
conditions: pre-curing at 60±5℃ for 24 hours.
2. Thermal Management
i. For maintaining the high flux output and achieving maximum reliability, EHP-AX08
series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other
kinds of heat sink with proper thermal connection to dissipate approximately 3W of
thermal energy at 700mA operation.
ii. Heat dissipation or thermal conduction design is strongly recommended on PCB or
MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2.
iii. Sufficient thermal management must be implemented. Please refer to the graph
“Forward Current Derating Curve “ on Page 9. The soldering temperature must be kept
under 60℃at the driving current 700mA.Otherwise, the junction temperature of die
may exceed over the limit at high current driving conditions and the LEDs’ lifetime may
be decrease dramatically.
iv. Special thermal designs are also recommended to take in outer heat sink design, such
as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal
conductive adhesive, etc.
v. Sufficient thermal management must be conducted, or the die junction temperature will
be over the limit under large electronic driving and LED lifetime will decrease critically.
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3. Proper Handling
To avoid contamination of materials, damage of internal components, and shortening
of LED lifetime, do not subject LEDs to conditions as those listed below.
Bare Hand
weezers
When handling the product, do not apply
direct pressure on the resin.
Do not touch the resin to avoid scratching
or other damage.
Pick and Place Nozzle for Surface
Mount Assembly.
During Module Assembly
Avoid directly contacting the lens with
downward force of more than 500g.
Do not stack the modules together, it
could damage the resin or scratch the
lens.
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During Module Assembly
Sealing process with water-proof silicone
is not suitable for EHP-AX08 Products.
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4. Soldering Iron
i. For Reflow Process
a. EHP-AX08 series are suitable for SMT process.
b. Curing of glue in oven according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
ii. For Manual Soldering Process
a. For prototype builds or small series production runs it is possible to place and solder the
LED by hand.
b. Dispense thermal conductive glue or grease on the substrates and follow its curing
specifications. Gently press LED housing to closely connect LED and substrate.
c. It is recommended to hand solder the leads with a solder tip temperature of 280°C for
less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of
two seconds or more.
d. Take caution and be aware that damaged products are often a result of improper hand
soldering technique.
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Revision History
Page Subjects(major change in previous version) Date of change
14 Change Proper Handling 2010/08/12
Prepared date: 12-Aug-2010 Device No.: DHE-0001186
Created by: Iris Yeh Rev.: 2
For product information and a complete list of distributors, please go to our
web site：www.everlight.com
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Electronics Co., Ltd. in the Taiwan and other countries. Data subject to
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