DATASHEET Board Level Cooling - 3644 BOARD LEVEL COOLING 3644 3644 is a series of square pin fin board level heat sinks designed to cool BGA and FPGA devices. These heat sinks use pressure sensitive adhesive for mounting. Representative image only. ORDERING INFORMATION Part Number Device Type 364424B00032G 364424B00034G BGA, FPGA BGA, FPGA HEAT SINK DETAILS Property Details Property Details Material Finish Device Attachment Options Thermal Interface Material 364424B00032G Thermal Interface Material 364424B00034G Aluminum Black Anodize Tape T405R Chomerics Tape for Metal Surfaces T410R Chomerics Tape for Plastic Surfaces Heat Sink Width (mm) Heat Sink Length (mm) Heat Sink Height (mm) Heat Sink Mounting Direction 40.13 40.00 11.43 Horizontal, Vertical MECHANICAL & PERFORMANCE Drawing dimensions are shown in mm, (in) USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com