DATASHEET
BoardLevelCooling3644
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
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MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING‐3644
3644isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Theseheatsinksusepressuresensitiveadhesivefor
mounting.Representativeimageonly.
ORDERINGINFORMATION
PartNumberDeviceType
364424B00032GBGA,FPGA
364424B00034GBGA,FPGA
HEATSINKDETAILS
PropertyDetails
MaterialAluminum
FinishBlackAnodize
DeviceAttachmentOptionsTape
ThermalInterfaceMaterial
364424B00032G
T405RChomericsTapefor
MetalSurfaces
ThermalInterfaceMaterial
364424B00034G
T410RChomericsTapeforPlastic
Surfaces
PropertyDetails
HeatSinkWidth(mm)40.13
HeatSinkLength(mm)40.00
HeatSinkHeight(mm)11.43
HeatSinkMountingDirectionHorizontal,Vertical