74VHCU04 — Hex Inverter
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0
February 2008
74VHCU04
Hex Inverter
Features
High Speed: t
PD
=
3.5ns (typ.) at V
CC
=
5V
Low Power Dissipation: I
CC
=
2µA (max.) @ T
A
=
25°C
High Noise Immunity: V
NIH
=
V
NIL
=
28% V
CC
(min.)
Power down protection is provided on all inputs
Low Noise: V
OLP
=
0.8V (max.)
Pin and Function Compatible with 74HCU04
General Description
The VHCU04 is an advanced high speed CMOS Inverter
fabricated with silicon gate CMOS technology. It
achieves the high speed operation similar to equivalent
Bipolar Schottky TTL while maintaining the CMOS low
power dissipation.
Since the internal circuit is composed of a single stage
inverter, it can be used in analog applications such as
crystal oscillators. An input protection circuit ensures that
0V to 7V can be applied to the input pins without regard
to the supply voltage. This device can be used to inter-
face 5V to 3V systems and two supply systems such as
battery backup. This circuit prevents device destruction
due to mismatched supply and input voltages.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number Package Description
74VHCU04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
74VHCU04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHCU04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 2
74VHCU04 — Hex Inverter
Connection Diagram
Pin Description
Logic Symbol
IEEE/IEC
Truth Table
Pin Names Description
A
n
Inputs
O
n
Outputs
AO
LH
HL
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 3
74VHCU04 — Hex Inverter
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Recommended Operating Conditions
(1)
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Note:
1. Unused inputs must be held HIGH or LOW. They may not float.
Symbol Parameter Rating
V
CC
Supply Voltage –0.5V to +7.0V
V
IN
DC Input Voltage –0.5V to +7.0V
V
OUT
DC Output Voltage –0.5V to V
CC
+ 0.5V
I
IK
Input Diode Current –20mA
I
OK
Output Diode Current ±20mA
I
OUT
DC Output Current ±25mA
I
CC
DC V
CC
/ GND Current ±50mA
T
STG
Storage Temperature –65°C to +150°C
T
L
Lead Temperature (Soldering, 10 seconds) 260°C
Symbol Parameter Rating
V
CC
Supply Voltage 2.0V to +5.5V
V
IN
Input Voltage 0V to +5.5V
V
OUT
Output Voltage 0V to V
CC
T
OPR
Operating Temperature –40°C to +85°C
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 4
74VHCU04 — Hex Inverter
DC Electrical Characteristics
Noise Characteristics
Note:
2. Parameter guaranteed by design.
Symbol Parameter V
CC
(V) Conditions
T
A
=
25°C
T
A
=
–40°C to
+85°C
UnitsMin. Typ. Max. Min. Max.
V
IH
HIGH Level Input
Voltage
2.0 1.70 1.70 V
3.0–5.5 0.8 x V
CC
0.8 x V
CC
V
IL
LOW Level Input
Voltage
2.0 0.30 0.30 V
3.0–5.5 0.2 x V
CC
0.2 x V
CC
V
OH
HIGH Level
Output Voltage
2.0 V
IN
=
V
IL
I
OH
=
–50µA 1.8 2.0 1.8 V
3.0 2.7 3.0 2.7
4.5 4.0 4.5 4.0
3.0 V
IN
=
GND I
OH
=
–4mA 2.58 2.48
4.5 I
OH
=
–8mA 3.94 3.80
V
OL
LOW Level
Output Voltage
2.0 V
IN
=
V
IH
I
OL
=
50µA 0.0 0.2 0.2 V
3.0 0.0 0.3 0.3
4.5 0.0 0.5 0.5
3.0 V
IN
=
V
CC
I
OL
=
4mA 0.36 0.44
4.5 I
OL
=
8mA 0.36 0.44
I
IN
Input Leakage
Current
0–5.5 V
IN
=
5.5V or GND ±0.1 ±1.0 µA
I
CC
Quiescent
Supply Current
5.5 V
IN
=
V
CC
or GND 2.0 20.0 µA
Symbol Parameter V
CC
(V) Conditions
T
A
=
25°C
UnitsTyp. Limits
V
OLP(2)
Quiet Output Maximum
Dynamic V
OL
5.0 C
L
=
50pF 0.5 0.8 V
V
OLV(2)
Quiet Output Minimum
Dynamic V
OL
5.0 C
L
=
50pF –0.5 –0.8 V
V
IHD(2)
Minimum HIGH Level
Dynamic Input Voltage
5.0 C
L
=
50pF 4.0 V
V
ILD(2)
Maximum LOW Level
Dynamic Input Voltage
5.0 C
L
=
50pF 1.0 V
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 5
74VHCU04 — Hex Inverter
AC Electrical Characteristics
Note:
3. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating
current consumption without load. Average operating current can be obtained by the equation:
I
CC
(opr.)
=
C
PD
• V
CC
• f
IN
+ I
CC
/ 6 (per gate).
Symbol Parameter V
CC
(V) Conditions
T
A
=
25°C
T
A
=
–40°C
to +85°C
UnitsMin. Typ. Max. Min. Max.
t
PHL
, tPLH Propagation Delay 3.3 ± 0.3 CL = 15pF 5.0 8.9 1.0 10.5 ns
CL = 50pF 7.5 11.4 1.0 13.0
5.0 ± 0.5 CL = 15pF 3.5 5.5 1.0 6.5 ns
CL = 50pF 5.0 7.0 1.0 8.0
CIN Input Capacitance VCC = Open 5 10 10 pF
CPD Power Dissipation
Capacitance
(3) 9pF
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 6
74VHCU04 — Hex Inverter
Physical Dimensions
Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
LAND PATTERN RECOMMENDATION
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AB, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD:
SOIC127P600X145-14M
E) DRAWING CONFORMS TO ASME Y14.5M-1994
F) DRAWING FILE NAME: M14AREV13
PIN ONE
INDICATOR
8°
0°
SEATING PLANE
DETAIL A
SCALE: 20:1
GAGE PLANE
0.25
X45°
1
0.10
C
C
BC A
7
M
14 B
A
8
SEE DETAIL A
5.60
0.65
1.70 1.27
8.75
8.50
7.62
6.00 4.00
3.80
(0.33)
1.27 0.51
0.35
1.75 MAX
1.50
1.25 0.25
0.10 0.25
0.19
(1.04)
0.90
0.50
0.36
R0.10
R0.10
0.50
0.25
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 7
74VHCU04 — Hex Inverter
Physical Dimensions (Continued)
Figure 2. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 8
74VHCU04 — Hex Inverter
Physical Dimensions (Continued)
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
F. DRAWING FILE NAME: MTC14REV6
R0.09 min
12.00°TOP & BOTTO
M
0.43 TYP
1.00
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
R0.09min
E. LANDPATTERN STANDARD: SOP65P640X110-14M
0.65
6.10
1.65
0.45
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
©1993 Fairchild Semiconductor Corporation www.fairchildsemi.com
74VHCU04 Rev. 1.4.0 9
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MicroFET
MicroPak
MillerDrive™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP-SPM
Power220®
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Power-SPM
PowerTrench®
Programmable Active Droop
QFET®
QS
QT Optoelectronics
Quiet Series
RapidConfigure
SMART START
SPM®
STEALTH™
SuperFET
SuperSOT-3
SuperSOT-6
SuperSOT-8
SyncFET™®
The Power Franchise®
TinyBoost
TinyBuck
TinyLogic®
TINYOPTO
TinyPower
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TinyWire
µSerDes
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UniFET
VCX
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HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
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PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
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As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Form
First Production
ative or In Design This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
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This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
the design.
Obsolete Not In Production
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I32
74VHCU04 — Hex Inverter