PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/07102BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30103B2A ACTIVE LCCC FK 20 1 TBD JM38510/30103BEA ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type JM38510/30103BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type M38510/07102BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type M38510/07102BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type M38510/30103B2A ACTIVE LCCC FK 20 1 TBD M38510/30103BEA ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type M38510/30103BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54LS112AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S112J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74LS112AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Pb-Free (RoHS) SN74LS112AN ACTIVE PDIP N 16 SN74LS112AN3 OBSOLETE PDIP N 16 SN74LS112ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS112ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 CU NIPDAU N / A for Pkg Type Call TI Samples (Requires Login) JM38510/07102BEA TBD (3) Call TI CU NIPDAU N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Jan-2012 Status (1) Package Type Package Drawing Pins SN74LS112ANSRG4 ACTIVE SO NS 16 SN74S112AD OBSOLETE SOIC D 16 Package Qty 2000 Eco Plan (2) Green (RoHS & no Sb/Br) TBD 25 Pb-Free (RoHS) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM Call TI Call TI SN74S112AN ACTIVE PDIP N 16 SN74S112AN3 OBSOLETE PDIP N 16 SN74S112ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SNJ54LS112AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS112AJ ACTIVE CDIP J 16 1 TBD SNJ54LS112AW ACTIVE CFP W 16 1 TBD SNJ54S112FK ACTIVE LCCC FK 20 1 TBD SNJ54S112J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S112W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type TBD (3) CU NIPDAU N / A for Pkg Type Call TI Call TI A42 N / A for Pkg Type A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS112A, SN74LS112A : * Catalog: SN74LS112A * Military: SN54LS112A NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LS112ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS112ANSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS112ADR SN74LS112ANSR SOIC D 16 2500 333.2 345.9 28.6 SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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