AP2142/ AP2152
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AP2142/ AP2152
0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
Description
The AP2142 and AP2152 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
• Dual USB Port Power Switches
• Over-Current and Thermal Protection
• 0.8A Accurate Current Limiting
• Reverse Current Blocking
• 115m On-Resistance
• Input Voltage Range: 2.7V – 5.5V
• 0.6ms Typical Rise Time
• Very Low Shutdown Current: 1µA (max)
• Fault Report (FLG) with Blanking Time (7ms typ)
• ESD protection: 4.5KV HBM, 350V MM
• Active High (AP2152) or Active Low (AP2142) enable
• Ambient Temperature Range -40°C to +85°C
• SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
Pin Assignments
SO-8
( Top View )
1
2
3
4
8
7
6
5
FLG1
OUT1
FLG2
OUT2
GND
EN2
EN1
IN
MSOP-8EP
1
2
3
4
8
7
6
5
FLG1
OUT1
FLG2
OUT2
GND
EN2
EN1
IN
( Top View )
Applications
• Consumer Electronics – LCD TV & Monitor, Game Machines
• Communications – Set-Top-Box, GPS, Smartphone
• Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
0.1uF
IN
GND
EN2
OUT1
ON
68uF
Power Supply
2.7V to 5.5V 0.1uF
OFF
FLG1
Load
10k
10k
FLG2
EN1
OUT2
68uF
0.1uF
Load
10uF
AP2152 Enable Active High
AP2142/ AP2152
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AP2142/ AP2152
Available Options
Part Number Channel Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum
Continuous Load Current
AP2142 2 Active Low 0.8A 0.5A
AP2152 2 Active High 0.8A 0.5A
Pin Descriptions
Pin
Name
Pin Number Function
SO-8 MSOP-8EP
GND 1 1 Ground
IN 2 2 Voltage input pin
EN1 3 3 Switch 1 enable input, active low (AP2142) or active high (AP2152)
EN2 4 4 Switch 2 enable input, active low (AP2142) or active high (AP2152)
FLG2 5 5 Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
OUT2 6 6 Switch 2 voltage output pin
OUT1 7 7 Switch 1 voltage output pin
FLG1 8 8 Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed Tab — Exposed Tab Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
Thermal
Sense
Driver
FLG2
OUT2
GND
IN
EN2
UVLO
Current
Limit
Deglitch
Thermal
Sense
Driver
UVLO
Current
Limit
Deglitch
OUT1
FLG1
EN1
GND
Current
Sense
Current
Sense
AP2142, AP2152
AP2142/ AP2152
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AP2142/ AP2152
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Rating Unit
ESD HBM Human Body Model ESD Protection 3 kV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage 6.5 V
VOUT Output Voltage VIN +0.3 V
VEN , VFLG Enable Voltage 6.5 V
ILOAD Maximum Continuous Load Current Internal Limited A
TJ(MAX) Maximum Junction Temperature 150 °C
TST Storage Temperature Range (Note 4) -65 to +150 °C
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Max Units
VIN Input voltage 2.7 5.5 V
IOUT Output Current 0 500 mA
VIL EN Input Logic Low Voltage 0 0.8 V
VIH EN Input Logic High Voltage 2 VIN V
TA Operating Ambient Temperature -40 +85 °C
AP2142/ AP2152
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AP2142/ AP2152
Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.)
Symbol Parameter Test Conditions Min Typ Max Unit
VUVLO Input UVLO RLOAD = 1k 1.6 1.9 2.5 V
ISHDN Input Shutdown Current Disabled, IOUT = 0 0.5 1 µA
IQ Input Quiescent Current, Dual Enabled, IOUT = 0 100 160 µA
ILEAK Input Leakage Current Disabled, OUT grounded 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN 1 µA
RDS(ON) Switch On-Resistance VIN = 5V, IOUT = 0.5A, -40°C TA +85°C MSOP-8EP 115 150 m
SO-8 120 160 m
VIN = 3.3V, IOUT = 0.5A, -40°C TA 85°C 140 180 m
ISHORT Short-Circuit Current Limit Enabled into short circuit, CL = 68µF 0.6 A
ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.8V, CL = 68µF, -40°C TA +85°C 0.6 0.8 1.0 A
ITrig Current Limiting Trigger Threshold VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF 1.0 A
VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V
VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V
ISINK EN Input Leakage VEN = 5V 1 µA
TD(ON) Output Turn-On delay Time CL=1µF, RLOAD = 10 0.05 ms
TR Output Turn-On rise Time CL=1µF, RLOAD = 10 0.6 1.5 ms
TD(OFF) Output Turn-Off delay Time CL=1µF, RLOAD = 10 0.01 ms
TF Output Turn-Off Fall Time CL=1µF, RLOAD = 10 0.05 0.1 ms
RFLG FLG Output FET On-Resistance IFLG =10mA 30 50
TBlank FLG Blanking Time CIN =10µF, CL = 68µF 4 7 15 ms
TSHDN Thermal Shutdown Threshold Enabled, RLOAD = 1k 140 °C
THYS Thermal Shutdown Hysteresis 25 °C
θJA Thermal Resistance Junction-to-
Ambient
SO-8 (Note 5) 110 °C/W
MSOP-8EP (Note 6) 60 °C/W
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50% 50%
TR
10%
90%
TF
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50% 50%
TR
10%
90%
TF
Figure 1 Voltage Waveforms: AP2142 (left), AP2152 (right)
All Enable Plots are for AP2142 Active Low
Channel 1 Turn-On Delay and Rise Time
500µs/div
Channel 1 Turn-Off Delay and Fall Time
500µs/div
Channel 2 Turn-On Delay and Rise Time
500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
Vout 1
2V/div
Ven 1
5V/div
CL = 1µF
TA = +25°C
RL = 10
Vout 1
2V/div
Ven 1
5V/div
CL = 1µF
TA = +25°C
RL = 10
Vout 2
2V/div
Ven 2
5V/div
CL=1µF
TA = +25°C
RL = 10
Vout 2
2V/div
Ven 2
5V/div
CL = 1µF
TA = +25°C
RL = 10
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 1 Turn-On Delay and Rise Time
500µs/div
Channel 1 Turn-Off Delay and Fall Time
500µs/div
Channel 2 Turn-On Delay and Rise Time
500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
500µs/div
Channel 2 Short Circuit Current,
Device Enabled Into Short
500µs/div
Iout 1
200mA/div
Ven 1
5V/div
VIN = 5V
TA = +25°C
CL = 22µF
Iout 2
200mA/div
Ven 2
5V/div
VIN = 5V
TA = +25°C
CL = 22µF
Vout 1
2V/div
Ven 1
5V/div
CL = 100µF
TA = +25°C
RL = 10
Vout 1
2V/div
Ven 1
5V/div
CL = 100µF
TA = +25°C
RL = 10
Vout 2
2V/div
Ven 2
5V/div
CL = 100µF
TA = +25°C
RL = 10
Vout 2
2V/div
Ven 2
5V/div
CL = 100µF
TA = +25°C
RL = 10
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 1 Inrush Current
1ms/div
Channel 2 Inrush Current
1ms/div
Channel 1
1 Ω Load Connected to Enabled Device
2ms/div
Channel 1
2Ω Load Connected to Enabled Device
2ms/div
Channel 2
1 Ω Load Connected to Enabled Device
2ms/div
Channel 2
2Ω Load Connected to Enabled Device
2ms/div
Iout 1
1A/div
Vflag 1
2V/div
VIN = 5V
TA = +25°C
CL = 22µF
Iout 1
1A/div
Vflag 1
2V/div
VIN = 5V
TA = +25°C
CL = 22µF
Iout 2
1A/div
Vflag 2
2V/div
VIN = 5V
TA = +25°C
CL = 22µF
Iout 2
1A/div
Vflag 2
2V/div
VIN = 5V
TA = +25°C
CL = 22µF
Iout 1
200mA/div
Ven 1
5V/div
VIN = 5V
TA = +25°C
RL = 10
CL = 470µF
CL = 220µF
CL = 100µF
Iout 2
200mA/div
Ven 2
5V/div
VIN = 5V
TA = +25°C
RL = 10
CL = 470µF
CL = 220µF
CL = 100µF
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 1
Short Circuit with Blanking Time and Recovery
20ms/div
Channel 2
Short Circuit with Blanking Time and Recovery
20ms/div
Channel 1 Power On
1ms/div
Channel 2 Power On
1ms/div
Channel 1 UVLO Increasing
1ms/div
Channel 1 UVLO Decreasing
10ms/div
Iout
200mA/div
Vin
2V/div
Vin
2V/div
Iout
200mA/div
TA = +25°C
CL = 22µF
RL = 10
TA = +25°C
CL = 22µF
R
L
=
10
Vin
5V/div
Vflag
5V/div
TA=25°C
CL=22uF
RL=10
Iout
200mA/div
Ven
5V/div
Vin
5V/div
Vflag
5V/div
Iout
200mA/div
Ven
5V/div
TA = +25°C
CL = 22µF
RL = 10
Iout
1A/div
Vout
5V/div
VIN = 5V
TA = +25°C
CL = 22µF
Vflag
5V/div
Vflag
5V/div
Iout
1A/div
Vout
5V/div
VIN = 5V
TA = +25°C
CL = 22µF
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Channel 2 UVLO Increasing
1ms/div
Channel 2 UVLO Decreasing
10ms/div
Channel 1 Enabled and Shorted with Channel 2 Disabled
100ms/div
Channel 1 Disabled and Channel 2 Enabled
50ms/div
Iout
200mA/div
Vin
2V/div
Vin
2V/div
Iout
200mA/div
TA = +25°C
CL = 22µF
RL = 10
TA = +25°C
CL = 22µF
RL = 10
Vout 2
5V/div
Iout 2
500mA/div
TA = +25°C
CL = 22µF
Vout 1
5V/div
Vflag 1
5V/div
Vout 1
5V/div
Vout 2
5V/div
TA = +25°C
CL = 22µF
Ven1
5V/div
Ven2
5V/div
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Turn-On Time vs Input Voltage
0
100
200
300
400
500
600
700
800
1.522.533.544.555.56
Input Voltage (V)
Turn-On Time (us)
Turn-Off Time vs Input Voltage
28
28
29
29
30
30
31
31
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-Off Time (us)
Rise Time vs Input Voltage
0
100
200
300
400
500
600
1.522.533.544.555.56
Input Voltage (V)
Rise Time (us)
Fall Time vs Input Voltage
19
20
21
22
23
24
25
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Fall Time (us)
Supply Current, Output Enabled vs Ambient Temperature
30
35
40
45
50
55
60
65
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Supply Current, Output Enabled (uA)
Supply Current, Output Disabled vs Ambient Temperature
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
-45 -25 -5 15 35 55 75 95
Ambient Temperature (°C)
Supply Current, Output Disabled (uA)
Vin=2.7V
Vin=5.0V
Vin=3.3V
Vin=5.5V
Vin=5.0V
Vin=5.5V
Vin=3.3V
Vin=2.7V
CL = 1µF
RL = 10
T
A
= +25°C
CL = 1µF
RL = 10
T
A
=+
25
°
C
CL = 1µF
RL = 10
T
A
=+25°C
CL = 1µF
RL = 10
T
A
=+
25
°
C
AP2142/ AP2152
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AP2142/ AP2152
Typical Performance Characteristics (cont.)
Static Drain-Source On-State Resistance vs Ambient
Temperature
100
110
120
130
140
150
160
170
180
190
200
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Static Drain-Source On-State
Resistance (mΩ)
Short-Circuit Output Current vs Ambient Temperature
630
640
650
660
670
680
690
700
710
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Short-Circuit Output Current (mA)
Undervoltage Lockout vs Ambient Temperature
1.95
1.96
1.97
1.98
1.99
2.00
2.01
2.02
2.03
2.04
2.05
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Undervoltage Lockout (V)
Threshold Trip Current vs Input Voltage
1.10
1.11
1.12
1.13
1.14
1.15
2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
Threshold Trip Current (A)
Current Limit Response vs Peak Current
0
5
10
15
20
25
30
35
40
45
2345678910
Peak Current (A)
Current Limit Response (us)
Vin=2.7V
Vin=3.3V
Vin=5V
Vin=2.7V
Vin=3.3V
Vin=5.0V
Vin=5.5V
UVLO Falling
UVLO Rising
VIN = 5V
TA = +25°C
C
L
= 22
µ
F
TA = +25°C
CL = 22µF
AP2142/ AP2152
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AP2142/ AP2152
Application Information
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2142/AP2152 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2142/AP2152 is capable of delivering current up
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at ILIMIT.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2142/AP2152 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2142/AP2152 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2142/ AP2152
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AP2142/ AP2152
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 2 Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2142/AP2152, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2142/AP2152 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2142/AP2152 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
AP2142/ AP2152
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AP2142/ AP2152
Ordering Information
Part Number Package Code Packaging 13” Tape and Reel
Quantity Part Number Suffix
AP21X2SG-13 S SO-8 2500/Tape & Reel -13
AP21X2MPG-13 MP MSOP-8EP 2500/Tape & Reel -13
Marking Information
(1) SO-8
AP21X X
( Top view )
YY WW X X
Part Number
Logo
WW : Week : 01~52; 52
YY : Year : 08, 09,10~
G : Green
X : Internal Code
8765
1234
4 : Active Low
5 : Active High
2 : 2 Channel
represents 52 and 53 week
(2) MSOP-8EP
AP21X X
( Top view )
Y W X E
Part Number
Logo
Y : Year : 0~9
A~Z : Green
87 65
1234
4 : Active Low
5 : Active High 2 : 2 Channel
a~z : 27~52 week; z represents
W : Week : A~Z : 1~26 week;
52 and 53 week
MSOP-8EP
AP2142/ AP2152
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AP2142/ AP2152
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package type: SO-8
(2) Package type: MSOP-8EP
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
θ 0° 8°
All Dimensions in mm
MSOP-8EP
Dim Min Max Typ
A - 1.10 -
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
Gauge Plane
Seating Plane
Detail ‘A’
Detail ‘A’
E
E1
h
L
D
eb
A2
A1
A
45
°
7
°~
9
°
A3
0.254
1
D
A
A1
A2
E
e
y
x
Seating Plane
Gauge Plane
L
D
8Xb
See Detail C
Detail C
c
a
E1
E3
A3
E2
4X10°
4X10°
0.25
D1
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
16 of 17
www.diodes.com
May 2014
© Diodes Incorporated
AP2142/ AP2152
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
(2) Package type: MSOP-8EP
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Dimensions Value
(in mm)
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
X
C1
C2
Y
G
X C
Y
Y2 Y1
X1
AP2142/ AP2152
Document number: DS31571 Rev. 7 - 2
17 of 17
www.diodes.com
May 2014
© Diodes Incorporated
AP2142/ AP2152
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