APT30DF60HJ
APT30DF60HJ – Rev 1 October 2012
www.microsemi.com 1-5
Absolute maximum ratings
Symbol Parameter Max ratings Unit
VR Maximum DC reverse Voltage
VRRM Maximum Peak Repetitive Reverse Voltage 600 V
TC = 25°C 60
IF(AV) Maximum Average Forward
Current Duty cycle = 50% TC = 80°C 30
IFSM Non-Repetitive Forward Surge Current 8.3ms TJ = 45°C 320
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
VRRM = 600V
IF = 30A @ Tc = 80°C
Application
Switch mode power supplies rectifier
Induction heating
Welding equipment
High speed rectifiers
Features
Ultra fast recovery times
Soft recovery characteristics
High blocking voltage
High current
Low leakage current
Very low stray inductance
High level of integration
ISOTOP® Package (SOT-227)
Benefits
Outstanding performance at high frequency operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
ISOTOP®Fast Diode
Full Bridge Power Module
~
~
-
+
APT30DF60HJ
APT30DF60HJ – Rev 1 October 2012
www.microsemi.com 2-5
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
IF = 30A 1.8 2.2
IF = 60A 2.2
VF Diode Forward Voltage
IF = 30A Tj = 125°C 1.5
V
Tj = 25°C 250
IRM Maximum Reverse Leakage Current VR = 600V Tj = 125°C 500 µA
CT Junction Capacitance VR = 200V 36 pF
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Tj = 25°C 25
trr Reverse Recovery Time Tj = 125°C 160 ns
Tj = 25°C 35
Qrr Reverse Recovery Charge Tj = 125°C 480 nC
Tj = 25°C 3
IRRM Reverse Recovery Current
IF = 30A
VR = 400V
di/dt = 200A/µs
Tj = 125°C 6 A
trr Reverse Recovery Time 85 ns
Qrr Reverse Recovery Charge 920 nC
IRRM Reverse Recovery Current
IF = 30A
VR = 400V
di/dt=1000A/µs
Tj = 125°C
20 A
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
RthJC Junction to Case Thermal resistance 1.2
RthJA Junction to Ambient 20 °C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 2500 V
TJ,TSTG Storage Temperature Range -55 175
TL Max Lead Temp for Soldering:0.063” from case for 10 sec 300 °C
Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) 1.5 N.m
Wt Package Weight 29.2 g
APT30DF60HJ
APT30DF60HJ – Rev 1 October 2012
www.microsemi.com 3-5
Typical Performance Curve
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0.00001 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
T
J
=25°C
T
J
=125°C
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
F
, Anode to Cathode Voltage (V)
I
F
, Forward Current (A)
Forward Current vs Forward Voltage
I
RRM
vs. Current Rate of Charge
15 A
30 A
60 A
0
5
10
15
20
25
30
0 200 400 600 800 1000 1200
-diF/dt (A/µs)
I
RRM
, Reverse Recovery Current (A)
T
J
=125°C
V
R
=400V
Trr vs. Current Rate of Charge
15 A
30 A
60 A
50
75
100
125
150
175
0 200 400 600 800 1000 1200
-di
F
/dt (A/µs)
t
rr
, Reverse Recovery Time (ns)
T
J
=125°C
V
R
=400V
Q
RR
vs. Current Rate Charge
15 A
30 A
60 A
0.0
0.5
1.0
1.5
0 200 400 600 800 1000 1200
-diF/dt (A/µs)
Q
RR
, Reverse Recovery Charge (µC)
T
J
=125°C
V
R
=400V
Capacitance vs. Reverse Voltage
0
25
50
75
100
125
150
175
200
1 10 100 1000
V
R
, Reverse Voltage (V)
C, Capacitance (pF)
APT30DF60HJ
APT30DF60HJ – Rev 1 October 2012
www.microsemi.com 4-5
SOT-227 (ISOTOP®) Package Outline
31.5 (1.240)
31.7 (1.248)
Dimensions in Millimeters and (Inches)
7.8 (.307)
8.2 (.322)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
14.9 (.587)
15.1 (.594)
11.8 (.463)
12.2 (.480)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
0.75 (.030)
0.85 (.033)
12.6 (.496)
12.8 (.504)
25.2 (0.992)
25.4 (1.000)
1.95 (.077)
2.14 (.084)
r = 4.0 (.157)
(2 places) 4.0 (.157)
4.2 (.165)
(2 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
3.3 (.129)
3.6 (.143)
3.30 (.130)
4.57 (.180)
ISOTOP® is a registered trademark of ST Microelectronics NV
APT30DF60HJ
APT30DF60HJ – Rev 1 October 2012
www.microsemi.com 5-5
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