Absolute Maximum Ratings* TA = 25OC unless otherwise noted
Sym Parameter Value Units
Tstg Storage Temperature -55 to +150 OC
TJOperating Junction Temperature -55 to +125 OC
Wiv
Working Inverse Voltage 30 V
PFForward Power Dissipation @ TA = 25OC200 mW
Derate above 25OC 2.0 Mw/OC
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
MMBD301
Electrical Characteristics TA = 25OC unless otherwise noted
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
BVBreakdown Voltage 30 VIR= 10 uA
IRReverse Leakage 200 nA VR= 25 V
VFForward Voltage 450 mV IF= 1.0 mA
600 mV IF= 10 mA
CTCapacitance 1.5 pF VR= 15 V
f = 1.0 MHz
4TF
3
1 2
Schottky Barrier Diode
Sourced from Process GD
PACKAGE
SOT-23
TO-236AB (Low)
© 2001 Fairchild Semiconductor Corporation
3
12 NC
PACKAGE
SOT-23
TO236AB
CONNECTION DIAGRAM
MMBD301, Rev A1
SOT-23
TO-236AB (LOW PROFILE)
22-August-1994
0.098 (2.489)
0.083 (2.108) 0.055 (1.397)
0.047 (1.194)
0.024 (0.810)
0.018 (0.457)
3 CHARACTERS MAX
LOW PROFILE 0.0040 (0.102)
(49) 0.0005 (0.013)
0.120 (3.048)
0.110 (2.794)
0.040 (1.016)
0.035 (0.889) 0.080 (2.032)
0.070 (1.778)
0.019 (0.483)
0.015 (0.381)
0.0059 (0.150)
0.0035 (0.089)
2
3
1
LOW PROFILE 0.041 (1.041)
(49) 0.035 (0.889)
0.035” TYPICAL
(0.889) 0.060” +/- 0.005”
(1.524 +/- 0.127)
0.120” MINIMUM
(3.048)
0.030” +/- 0.005”
(0.762 +/- 0.127)
RECOMMENDED SOLDER PADS
FOR
SOT-23
0.037” +/- 0.005”
(0.950 +/- 0.127 )
0.099” +/- 0.005”
(2.524 +/- 0.127 )
0.039” +/- 0.005”
(1.000 +/- 0.127)
RECOMMENDED SOLDER PADS
FOR
U.S. & European SOT-23
&
Japanese SC-59
0.031” +/- 0.005”
(0.800 +/- 0.127)
0.060” +/- 0.005”
(1.524 +/- 0.127)
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OPTOPLANAR™
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PowerTrench
QFET™
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SILENT SWITCHER
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FASTr™
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