Product Brief X-GOLDTM113 Ultra-low cost GSM/GPRS Single-Chip Solution for Music Phones Main Features THE Infineon X-GOLD 113 is the first Single-Chip in 65nm CMOS technology that integrates Baseband, RF Transceiver, Power Management Unit and FM Radio. After the successful market introduction of the 2nd generation Single-Chip X-GOLDTM101 (formerly E-GOLDvoice), the X-GOLDTM113 now takes the next step towards bringing new features into the Ultra-low cost segment and is thereby setting a new industry standard in System-on-Chip (SoC). TM -- Direct conversion receiver -- Fully integrated digital controlled XO -- Fully digital RF-Synthesizer including -transmitter Integration of FM Radio and high performance ARM11 Processor enables the introduction of new features, such as FM Radio Broadcasting, and Music & Video Player into the low-cost market. Due to the Single-Chip integration this functionality can be realized in a very small PCB area giving the handset manufacturer highest design flexibility. Radio Integrated FM Radio -- FM Stereo RDS Receiver -- FM Radio recording Connectivity -- QVGA 262K colors display -- Direct (U)SIM 1.8/3V -- USB2.0 FS; HS with external PHY X-GOLDTM113 is enabled by the Ultra-low cost XMMTM1130 Music Phone Platform. -- Memory Card Interface Power Management Unit and Mixed Signal -- Class-D Audio Amplifier -- Stereo headset without coupling C -- DC/DC converter for white LEDs X-GOLD 113 -- USB charging TM Monolithic integration of GSM Baseband, RF Transceiver, Mixed Signal, Power Management, SRAM and FM Radio in 65nm CMOS Highest integration in 8 x 8mm eWLB-207 lead-free package Optimized for lowest system cost with 0.5mm pitch 4-layer PCB Multimedia -- Audio Playback: AAC/AAC+/ eAAC+, MP3 support -- Video Playback: MPEG4/H.263 -- Audio Record: NB-AMR, SB-ADPCM Main Features Baseband -- ARM1176 MCU @208MHz -- GSM/GPRS Modem -- Speech codecs: FR/HR/EFR/NB-AMR -- Security such as RSA/SHA-1 accelerator and secure boot -- Cipher units A51/2/3, GEA-1/2/3 -- SAIC, TTY -- E-Fuses www.infineon.com/wireless -- Ringtone: SP-MIDI, SB-ADPCM, AMR, MP3 support Product Brief X-GOLDTM113 Ultra-low cost GSM/GPRS Single-Chip Solution for Music Phones Block Diagram Sub Display b/w or color JPEG LED (incl. white/blue) var. Interfaces: JTAG, I2C, I2S, SPI, ASC, ADCs, ... Display I/F (par./ser.) Stereo Headset X-GOLDTM113 Vibrator M LiIon / LiPoly Batteries PMU (Battery Charger, Power Supply) ARM 1176 DSP TEAKlite(R) Uni-/Bi-Polar Earpiece Audio High-Power Loudspeaker SAW RF (GSM, GPRS) Secure ROM, eFuse Timer, Interrupt SIM SD/ MMC USIM SD/MMC USB 2.0 Baseband RF Power Management Unit Mixed Signal SRAM DC/DC converters FM Radio Analog Microphones Memories (RAM/ROM/Cache) TxM X-GOLDTM113 Integrates Main Display QVGA 262k FM Radio 1 Keypad 2 3 4 5 6 7 8 9 # 0 * External Memory IF External Memory IF TEAKlite(R) is a registered trademark of ParthusCeva, Inc. XMMTM1130 Music Phone Platform Platform Features Modem Area 5cm, < 50 components 4-layer PCB FM stereo RDS receiver including recording Stereo Headset, 700mW mono speaker USB 2.0 Infineon Software Solution -- Infineon User Interface -- Infineon Multimedia Framework -- Multimedia Player -- GSM Release 99 Scalability -- Tri-/Quad-band -- Bluetooth How to reach us: http://www.infineon.com Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this Product Brief shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Published by Infineon Technologies AG Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Order Number: B153-H9151-G1-X-7600 NB08-1329