This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
34
10
CHIP COILS
for Choke Winding Type LQH31C/LQH32C/LQH43C Series
LQH31C Series
■ Features
The LQH31C series consists of miniature chip inductors
with low DC resistance, high current capacity, and high
impedacne characteristics. It is suitable for use as
choke coils in DC power supply circuits. high rated
current up to 970mA is available.
2.3±0.2
1.8±0.2
1.6±0.2
1.6±0.2
3.2±0.3
0.7min 0.7min 0.7min (in mm)
Part Number Inductance
(µH) Rated Current
(mA) Max. of DC resistance
(ohm) Self Resonance Frequency
(MHz)
LQH31CN100K01 10 ±10% 230 1.69 20 min.
LQH31CN220K01 22 ±10% 160 3.9 14 min.
LQH31CN470K01 47 ±10% 100 10.4 10 min.
LQH31CN101K01 100 ±10% 80 15.6 7 min.
LQH31CNR12M01 0.12 ±20% 970 0.112 250 min.
LQH31CNR22M01 0.22 ±20% 850 0.14 250 min.
LQH31CNR47M01 0.47 ±20% 700 0.21 180 min.
LQH31CN1R0M01 1 ±20% 510 0.364 100 min.
LQH31CN2R2M01 2.2 ±20% 430 0.533 50 min.
LQH31CN4R7M01 4.7 ±20% 340 0.845 31 min.
Min. of Operating Temp. : -25°C to 85°C
■ Impedance-Frequency Characteristics
0.01
0.1
1
10
100
1000
0.01 0.1 1 10 100 1000
Frequency (MHz)
Impedance (kΩ)
100µH10µH
1.0µH
■ Inductance-Current Characteristics
100µH
10µH
1.0µH
100
10
1
5 10 50 100 500
Current (mA)
Inductance (µH)
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
35
10
LQH32C Series
The LQH32C series consists of miniature chip coils with
low DC resistance, high current capacity, and high
impedance characteristics.
These features are made possible by the development of
Murata's innovative automatic winding techniques.
They are excellent for use as choke coils in DC power
supply circuits.
■ Features
1. The low DC resistance means high current and high
inductance.
For inductance ranging from 0.15 micro H to
10 micro H, LQH32C coils have very low DC resistance.
2. The series exhibit low voltage drops and small
variations in inductance with respect to temperature
rise and DC current level. This makes them excellent
for use as power supply line choke coils.
3. The series has excellent solder heat resistance. Both
flow and reflow soldering methods can be employed.
(in mm)
2.5±0.2 2.5±0.2
2.0±0.2
2.5±0.2
3.2±0.3
0.9±0.3 1.3±0.2 0.9±0.3
LQH32C
The LQH32CN_51 series consists of miniature chip coils
with low DC resistance, high current capacity, and high
impedance characteristics.
These features are made possible by the development of
Murata's innovative winding techniques. They are
excellent for use as choke coils in DC power supply
circuits.
■ Features (LQH32CN_51)
1. The series have a wide inductance range of 1.0 micro H
to 100 micro H.
2. The series exhibit low voltage drops and small
variations in inductance with respect to temperature
rise and DC current level. This makes them excellent
for use as power supply line choke coils.
3. The series has excellent solder heat resistance. Both
flow and reflow soldering methods can be employed.
2.5±0.2 2.5±0.2
1.55±0.15
2.5±0.2
3.2±0.3 A : 2.8 max.
A
0.9±0.3 1.3±0.2 0.9±0.3
A
(in mm)
LQH32CN_51
Part Number Inductance
(µH) Rated Current
(mA) Max. of DC resistance
(ohm) Self Resonance Frequency
(MHz)
LQH32CN100K11 10 ±10% 450 0.39 26 min.
LQH32CN100K21 10 ±10% 300 0.572 26 min.
LQH32CN100K51 10 ±10% 450 0.390 26 min.
LQH32CN150K51 15 ±10% 300 0.754 26 min.
LQH32CN220K21 22 ±10% 250 0.923 19 min.
LQH32CN220K51 22 ±10% 250 0.923 19 min.
LQH32CN330K51 33 ±10% 200 1.43 17 min.
LQH32CN470K21 47 ±10% 170 1.69 15 min.
LQH32CN470K51 47 ±10% 170 1.69 15 min.
LQH32CN680K51 68 ±10% 130 2.86 12 min.
LQH32CN101K21 100 ±10% 100 4.55 10 min.
LQH32CN101K51 100 ±10% 100 4.55 10 min.
LQH32CN221K21 220 ±10% 70 10.92 6.8 min.
LQH32CN331K21 330 ±10% 60 13 5.6 min.
LQH32CN391K21 390 ±10% 60 22.1 5 min.
Continued on the following page.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
36
10
Part Number Inductance
(µH) Rated Current
(mA) Max. of DC resistance
(ohm) Self Resonance Frequency
(MHz)
Continued from the preceding page.
LQH32CN471K21 470 ±10% 60 24.7 5 min.
LQH32CN561K21 560 ±10% 60 28.6 5 min.
LQH32CNR15M11 0.15 ±20% 1450 0.036 400 min.
LQH32CNR27M11 0.27 ±20% 1250 0.044 250 min.
LQH32CNR47M11 0.47 ±20% 1100 0.055 150 min.
LQH32CN1R0M11 1 ±20% 1000 0.078 100 min.
LQH32CN1R0M21 1.0 ±20% 1000 0.078 26 min.
LQH32CN1R0M51 1.0 ±20% 1000 0.078 100 min.
LQH32CN2R2M11 2.2 ±20% 790 0.1261 64 min.
LQH32CN2R2M21 2.2 ±20% 600 0.169 64 min.
LQH32CN2R2M51 2.2 ±20% 790 0.126 64 min.
LQH32CN4R7M11 4.7 ±20% 650 0.195 43 min.
LQH32CN4R7M21 4.7 ±20% 450 0.26 43 min.
LQH32CN4R7M51 4.7 ±20% 650 0.195 43 min.
Min. of Operating Temp. : -25°C to 85°C
■ Impedance-Frequency Characteristics
LQH32C
0.01
0.1
1
10
100
1000
0.01 0.1 1 10 100 1000
Frequency (MHz)
Impedance (kΩ)
100µH
10µH
1.0µH
■ Inductance-Current Characteristics
LQH32C
1 10 1000100
1000
100
10
1
0.1
DC Current (mA)
Inductance (µH)
100µH
10µH
1.0µH
■ Impedance-Frequency Characteristics
LQH32CN_51
1 10 100
10
100
1
0.1
0.01
0.001 1000
10uH
1.0uH
Impedance (kΩ)
Frequency(MHz)
100uH
■ Inductance-Current Characteristics
LQH32CN_51
1 10 100
100
1000
10
1
0.1 1000
100uH
10uH
1.0uH
DC Current (mA)
Inductance (µH)
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
37
10
LQH43C Series
The LQH43C series consists of miniature chip inductors
with low DC resistance, high current capacity, and high
impedacne characteristics. It is suitable for use as
choke coils in DC power supply circuits.
■ Features
1. The LQH43C series has an open magnetic structure.
Various inductance range is available.
2. The series exhibits low voltage drops and small
change in inductance with respect to temperature
rise and DC current level. This makes them excellent
to use as power supply line choke coils.
3. The LQH43C has miniature size 4.5mmx3.2mm and
realized low height 2.8mm at max.
4. The series has excellent solder heat resistance.
Both flow and reflow soldering methods can be
employed.
3.6±0.2
4.5±0.3
2.6±0.2
3.2±0.2
3.2±0.2
1.0min 1.0min 1.0min in mm
Part Number Inductance
(µH) Rated Current
(mA) Max. of DC resistance
(ohm) Self Resonance Frequency
(MHz)
LQH43CN100K01 10 ±10% 650 0.24 23
LQH43CN150K01 15 ±10% 570 0.32 20
LQH43CN220K01 22 ±10% 420 0.6 15
LQH43CN330K01 33 ±10% 310 1.0 12
LQH43CN470K01 47 ±10% 280 1.1 10
LQH43CN680K01 68 ±10% 220 1.7 8.4
LQH43CN101K01 100 ±10% 190 2.2 6.8
LQH43CN151K01 150 ±20% 130 3.5 5.5
LQH43CN221K01 220 ±10% 110 4.0 4.5
LQH43CN331K01 330 ±10% 100 6.8 3.6
LQH43CN471K01 470 ±10% 90 8.5 3.0
LQH43CN1R0M01 1.0 ±20% 1080 0.08 100
LQH43CN1R5M01 1.5 ±20% 1000 0.09 85
LQH43CN2R2M01 2.2 ±20% 900 0.11 60
LQH43CN3R3M01 3.3 ±20% 800 0.13 47
LQH43CN4R7M01 4.7 ±20% 750 0.15 35
LQH43CN6R8M01 6.8 ±20% 720 0.20 30
Min. of Operating Temp. : -25°C to 85°C
■ Impedance-Frequency Characteristics
0.01 0.1 1 10010
100
1000
10
1
0.1
0.01 1000
Impedance (kΩ)
Frequency (MHz)
1.0µH
100µH
10µH
■ Inductance-Current Characteristics
1 10 100 100001000
1000
100
10
1
0.1
DC Current (mA)
Inductance (µH)
100µH
10µH
1.0µH
t
N
y
331
q
LQ
u
K
r
M
e
32 1
o!0
L
w
H
i
2
(Global Part Number)
Chip Coils (SMD)
uInductance Tolerance
eDimension (LgW)
Code
0.60g0.30mm
1.00g0.50mm
1.60g0.80mm
2.00g1.25mm
2.00g1.50mm
3.20g1.60mm
3.20g2.50mm
3.50g3.20mm
3.30g3.30mm
4.50g3.20mm
5.70g5.00mm
6.30g6.30mm
Dimension (LgW)
03
15
18
21
2B
31
32
3E
3K
43
55
66
Code
B
C
D
G
H
J
K
M
N
S
±0.1nH
±0.2nH
±0.5nH
±2%
±3%
±5%
±10%
±20%
±30%
±0.3nH
Inductance Tolerance
qProduct ID
LQ Chip Coils
Product ID
wStructure
Code
G
H
M
P
W
Monolithic Type (Air-core Coil)
Winding Type (Ferrite Core)
Monolithic (Ferriet Core)
Film Type
Winding Type (Air-core Coil)
Structure
rApplications and Characteristics
Code
Monolithic Air-core
for Resonant Circuit
for Choke
(Low-current DC Power Supplies)
for Choke (DC Power Supplies)
Film Type
Film Type (Low DC Resistance Type)
High Q Type (UFH-SHF)
High Q Type (VHF-UHF)
for Resonant Circuit
for Resonant Circuit (Coating Type)
for Resonant Circuit
(Magnetically Shielded Type)
for Choke
for Choke (Coating Type)
for Choke (Magnetically Shielded Type)
for High-frequency Resonant Circuit
Applications and Characteristics
H
N
D
F
M
T
A
H
N
M
R
D
C
S
H
Series
LQG
LQM
LQP
LQW
LQH
tCategory
NStandard Type
Code
yInductance
Expressed by three figures. The unit is micro-henry (µH). The first
and second figures are significant digits, and the third figure
expresses the number of zero which follow the two figures. If
there is a decimal point, it is expressed by capital letter "R". In
this case, all figures are significant digits. If inductance is less
than 0.1µH, the inductance code is expressed by combination of
two figures are capital letter "N", and the unit of inductance is
nano-henry (nH).
Capital letter "N" indicates the unit of "nH", and also expresses a
decimal point. In this case, all figure are significant digits.
iFeatures
!0Pakaging
K
L
B
J
D
Plastic Taping (ø330mm Reel)
Plastic Taping (ø180mm Reel)
Bulk
Paper Taping (ø330mm Reel)
Paper Taping (ø180mm Reel)
Code Pakaging
0
1
2
Solder Plating
Sputtering
Sn Plating
Code Electrode
Category
Expressed by a figure from "0" to "2".
0
Ex.)
Standard Type
Code Fetures
oElectrode
2
o Part Numbering The structure of the "Global Part Numbers" that will be adopted from June 2001 and the meaning of each code are described herein.
If you have any questions about details, inquire at your usual Murata sales office or distributor.
()
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Chip coils can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
The volume of solder can cause minor fluctuations in
inductance value. Therefore, carefully control the amount
of solder when soldering the LQG15H/18H, LQP03T and
LQP15M series.
2) Soldering Temperature and Time
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Use solder paste equivalent to H60A for
LQP03T/15M and LQG15H/18H.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
LQG15H
LQG18H
LQM18N
LQM21N/21D/21F
LQM31F
LQP03T
LQP15M
Flow
Reflow
0.5-0.6
0.6-0.8
0.7
1.0
1.2
0.2-0.3
0.5-0.6
Part Number a
1.4-1.5
1.8-2.2
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
0.8-0.9
1.4-1.5
b
0.4
0.6-0.8
0.7
1.2
2.0
0.2-0.3
0.4
c
in mm
260
240
220
200
1800 10 20 30
Time (sec.)
Temperature (°C)
Solder : H60A
260
280
280
240
220
200
1800 20 40 60 80 100
Time (sec.)
Temperature (°C)
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
Solder : H60A
LQG18H
LQM21N/21D/21F
LQM31F
LQM18N
LQM21N/21D/21F
LQP03T/15M
LQG15H, LQM18N
LQM31F
c
a
b
Land Pattern
Solder Resist
Continued on the following page.
Monolithic And Film Type Notice(Soldering and Mounting)
42
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
3) Standard Soldering Conditions
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output : 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time : within 3 second
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
2) Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQG and LQM series have a magnetically shielded
structure. The structure makes their coupling coefficient
smaller than that of conventional chip coils.
Flow Solder
Reflow Solder
Continued from the preceding page.
∗LQG15H/18H,LQP03T/15M : 20sec.max
d
c
Magnetic Coupling
Preheating (in air)
Soldering
Gradual cooling
(in air)
240°C
200
100
0
Temperature (°C)
One minute min. 3sec.max.
Preheating (in air)
Soldering
Gradual cooling
(in air)
230°C
200
100
0
Temperature (°C)
One minute min.10sec.max.*
Land Solder Resist
Continued on the following page.
Monolithic And Film Type Notice(Soldering and Mounting)
43
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown in the right.
Standard thickness of solder paste : 100 to 150µm
5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderabillity.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the following conditions.
Continued from the preceding page.
LQM18N
LQM21N/21D/21F
LQM31F
0.05-0.06
0.15-0.20
0.20-0.25
Typical Application Amount (in:mg)
Part Number
MR-8153RA
0.06-0.07
0.20-0.25
0.25-0.30
NF-3000
0.06-0.07
0.20-0.25
0.25-0.30
UVS-50R-2
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Fig.2
Fig.1
LQP/LQG/LQM
Monolithic And Film Type Notice(Soldering and Mounting)
44
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
in mm
Land Pattern
Solder Resist
LQH31M/31C/31H
LQW31H
LQW2BH
LQW18A
LQW15A
1.5
1.2
0.7-1.0
0.65
Part Number a
4.5
3.0
1.8-2.0
1.2
b
1.75
1.1
0.6-0.7
0.35
c
1.0
0.8
0.6-0.8
0.50
d
a
c
2.5min.
dc
b
If mounted at 2.5 (2.0) mm intervals as indicated in the diagram,
attention should be paid to potential magnetic coupling effects when
using the coil as a resonator.
in mm
Land Pattern
Solder Resist
7.5
1.5
3.0
1.5
1.5 1.5
LQH43M
LQH43N
LQH43C
Continued on the following page.
∗∗ 2.0 min. (LQW15A/18A)
Winding Type Notice(Soldering and Mounting)
45
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
3) Standard Soldering Conditions Flow Solder
Reflow Solder
Continued from the preceding page.
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Chip coils can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
Reflow soldering should be applied for LQW15A/18A.
2) Soldering Temperature and Time
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
Preheating (in air)
Soldering
Gradual cooling
(in air)
240°C
200
100
0
Temperature (°C)
One minute min. 3sec.max.
Preheating (in air)
Soldering
Gradual cooling
(in air)
230°C
200
100
0
Temperature (°C)
One minute min.10sec.max.
Solder : H60A
260
280
240
220
200
1800 10 20 30
Time (sec.)
LQW2BH
LQH31M/31C/31H
LQH43M/43N/43C
LQW31H
Temperature (°C)
Solder : H60A
260
280
240
220
200
1800 10 20 30 40 50 60
Time (sec.)
Temperature (°C)
LQW2BH/31H
LQH31H
LQH43N
LQW18A LQW15A
LQH31M/31C
LQH43M/43C
Continued on the following page.
Winding Type Notice(Soldering and Mounting)
46
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output : 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time : within 3 second
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
2) Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQH series have a magnetically shielded structure.
The structure makes their coupling coefficient smaller
than that of conventional chip coils.
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown in the right.
Standard thickness of solder paste: 200µm to 300µm
(LQW15A/18A : 100 to 150µm)
d
c
Magnetic Coupling
LQH_C/H/M/N
LQW_H LQW_A
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Land Solder Resist
Fig.2
Fig.1
Continued from the preceding page.
Continued on the following page.
Winding Type Notice(Soldering and Mounting)
47
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderabillity.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the following conditions. LQW2BH
LQH31M/31C/31H
LQW31H
LQH43M(N)
LQH43C
0.16-0.18
0.18-0.20
0.45-0.50
Typical Application Amount (in:mg)
Part Number
MR-8153RA
0.20-0.25
0.20-0.25
0.60-0.80
NF-3000
0.21-0.23
0.20-0.25
0.60-0.80
UVS-50R-2
Continued from the preceding page.
Winding Type Notice(Soldering and Mounting)
48
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Chip coils can be flow or reflow soldered.
Please contact Murata regarding other soldering
methods.
Reflow soldering should be applied for LQH3ER/3KS.
2) Soldering Temperature and Time
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
in mm
Allowable Flow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
Land Pattern
Solder Resist
LQH32M_11/32C_11
LQH3ER
LQH32M_21/32C_21/32C_51
LQH3KS
5.5
1.0
2.0
1.0
1.0 1.0
5.5
1.0
2.0
1.0
1.3 1.0
Solder : H60A
260
280
240
220
200
1800 10 20 30
Time (sec.)
Temperature (°C)
Solder : H60A
260
280
240
220
200
1800 10 20 30 40 50 60
Time (sec.)
LQH32M/32C
LQH3ER/3KS
Temperature (°C)
LQH32M/32C
Continued on the following page.
Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)
49
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
3) Standard Soldering Conditions
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output : 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time : within 3 second
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
2) Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQH_R/S series have a magnetically shielded
structure. The structure makes their coupling coefficient
smaller than that of conventional chip coils. In particular,
the LQH3ER series has a very small coupling coefficient.
Flow Solder
Reflow Solder
Continued from the preceding page.
d
c
Magnetic Coupling
Preheating (in air)
Soldering
Gradual cooling
(in air)
240°C
200
100
0
Temperature (°C)
One minute min. 3sec.max.
Preheating (in air)
Soldering
Gradual cooling
(in air)
230°C
200
100
0
Temperature (°C)
One minute min. 10sec.max.
Land Solder Resist
Continued on the following page.
Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)
50
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown in the right.
Standard thickness of solder paste: 200µm to 300µm
5) Amount of Adhesive
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderabillity.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering. Apply the
adhesive in accordance with the following conditions.
Continued from the preceding page.
LQH_C/D/H/M/N LQH_R/S
LQH32M/32C 0.20-0.23
Typical Application Amount (in:mg)
Part Number
MR-8153RA
0.27-0.35
NF-3000
0.27-0.35
UVS-50R-2
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Fig.2
Fig.1
Winding And Mgnetic Shielded Type Notice(Soldering and Mounting)
51
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
1. STANDARD LAND DIMENSIONS
A high Q value is achieved when the PCB electrode land
pattern is designed so that it does not project beyond the
chip coil electrode.
2. STANDARD SOLDERING CONDITIONS
1) Soldering method
Reflow soldering should be applied for LQH55D/66S.
2) Soldering Temperature and Time
Solder whithin the temperature and time combinations
indicated by the slanted lines in the following graphs. If
soldering is repeated, please note that the allowed time
is the accumulated time.
Solder : Use H60A,H63A(JIS Z 3282) or equivalent.
Flux : Use rosin-based flux, but not strongly acidic flux.
(with chlorine content exceeding 0.2wt%)
Do not use water-soluble flux.
in mm
Allowable Reflow Soldering Temperature and Time
Land Pattern
Solder Resist
LQH55D
LQH66S
8.0
3.5
3.0 2.0 3.0
Solder : H60A
260
280
240
220
200
1800 20 40 60 80 100
Time (sec.)
Temperature (°C)
LQH55D
LQH66S
3) Standard Soldering Conditions Reflow Solder
Preheating (in air)
Soldering
Gradual cooling
(in air)
230°C
200
100
0
Temperature (°C)
One minute min. 10sec.max.
Continued on the following page.
4) Reworking with Soldering Iron
Preheating at 150°C for 1 minute is required. Do not
directry touch the ceramic element with the tip of the
soldering iron. The reworking soldering conditions are as
follows.
Soldering iron power output : 30W Max.
Temperature of soldering iron tip : 280°C
Diameter of soldering iron end : 3.0mm Max.
Soldering time : within 3 second
Larege-current Type Notice(Soldering and Mounting)
52
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
3. MOUNTING INSTRUCTIONS
1) Land Pattern Dimensions
Large lands reduce Q of the mounted chip. Also, large
protruding land areas (bordered by lines having
dimensions 'c' and 'd' shown bellow) cause floating and
electrode cracks.
2) Magnetic Coupling
Since some chip coils are constructed like an open
magnetic circuit, narrow spacing between coils may
cause magnetic coupling.
The LQH_S series have a magnetically shielded structure.
The structure makes their coupling coefficient smaller
than that of conventional chip coils.
Continued from the preceding page.
4) Amount of Solder Paste
Excessive solder causes electrode corrosion, while
insufficient solder causes low electrode bonding strength.
Adjust the amount of solder paste so that solder is
applied as shown bellow
Standard thickness of solder paste: 200µm to 300µm
d
c
Magnetic Coupling
3) PCB Warping
Arrange chip coils to minimize stress caused by PCB
warping.
The arrangement shown in Fig.2 is more effective in
preventing stress than that shown in Fig.1.
Land Solder Resist
Fig.2
Fig.1
LQH_D LQH_S
Larege-current Type Notice(Soldering and Mounting)
53
12
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
Notice
54
12
■ Notice (Storage and Operating Conditions)
< OPERATING ENVIRONMENT >
Do not use products in chemical atmosphere such as
chlorine gas, acid or sulfide gas.
< STORAGE REQUIREMENTS >
1. Storage Period
Products should be used within 12 months reckon
from the date of our out-going inspection.
Solderability should be verified if this period is
exceeded. (LQH3ER/3KS series should be used within
6 months.)
2. Storage conditions
a) Store products in a warehouse in compliance with
the following conditions :
Temperature : -10 to 40C.
Humidity : 30 to 70% (relative humidity)
Do not subject products to rapid changes in
temperature and humidity.
Do not store them in chemical atmosphere such as
one containing sulfurous acid gas or alkaline gas.
This will prevent electrode oxidation which causes
poor solderability and possible corrosion of coils.
b) Do not store products in bulk packaging to prevent
collision among coils which causes core chipping
and wire breakage.
c) Store products on pallets to protect from humidity,
dust, etc.
d) Avoid heat shock, vibration, direct sunlight, etc.
■ Notice (Soldering and Mounting)
< CLEANING >
The following conditions should be observed when
cleaning chip coils.
1. Cleaning Temperature : 60C. max. (40C. max. for
CFC alternatives and alcohol cleaning agents)
2. Ultrasonic
Output : 20W/l max.
Duration : 5 minutes max.
Frequency : 28kHz to 40kHz
Care should be taken not to cause resonance of
the PCB and mounted products.
3. Cleaning agent
The following cleaning agents have been tested on
individual components. Evaluation in complete
assembly should be done prior to production.
a) CFC alternatives and alcohol cleaning agents
• Isopropyl alcohol ( IPA )
• HCFC-225
b) Aqueous cleaning agents
• Surface active agent ( Clean Thru 750H )
• High grade alcohol ( Pine Alpha ST-100S )
• Hydrocarbon ( Techno Cleaner 335 )
• Alkaline Saponifier ( Aqua Cleaner 240 -cleaner
should be diluted to 20% using deionized water. )
LQH_R/S series : Aqueous agents should not be used
because they may cause quality deterioration.
LQH series : Surface active agent and high grade
alcohol can be used.
4. Ensure that flux residue is completely removed.
Component should be thoroughly dried after aqueous
agents have been removed with deionized water.
For additional cleaning methods, please contact
Murata.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
Notice
55
12
■ Notice (Handling)
This item is designed to have sufficient strength,
but handle with care not to make it chipped or
broken due to its ceramic structure.
LQW_A series
• Sharp material, such as tweezers, shall not touch
to the winding portion to prevent the breaking of wire.
• Do not give excessive Mechanical shock should not be
applied to the products mounted on the board to prevent
thebreaking of the core.
• In some mounting machines,when picking up
components,support pin pushes up the components
from the bottom of base tape. In this case,please
remove the support pin. The support pin may damage
the components and break wire.
LQH_C/D/H/M/N, LQW_H series
• Sharp material, such as tweezers, shall not touch
to the winding portion to prevent the breaking of wire.
• Do not give excessive Mechanical shock should
not be applied to the products mounted on the
board to prevent thebreaking of the core.
LQP series
• The pattern of the chip coil is covered with the
protection film. But the handling the chip coil
shall be taken care so that the chip coil would
not be damaged with the pick-up nozzle, the sharp
substance and so on.
LQM series
• There is possibility that the inductance value
change due to magnetism. Do not use a magnet or
tweezers with magnetism when chip coil are
handled. ( The tip of the tweezers should be
molded with resin or pottery.)
< HANDLING >
1. Avoid applying excessive stress to products to
prevent damage.
2. Do not touch winding with sharp objects such as
tweezers to prevent wire breakage.
3. Do not apply excessive force to products
mounted on boards to prevent core breakage.
< TRANSPORTATIONS >
Do not apply excessive vibration or mechanical
shock to products.
< RESIN COATING >
When coating products with resin, the relatively
high resin curing stress may change inductance
values.
For exterior coating, select resin carefully so that
electrical and mechanical performance of the product
is not affected.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
Packaging
56
12
(in mm)
Part Number a
LQM21NN (0.1-2.2µH)
LQM21DN (1-10µH)
LQM21FN (1-2.2µH)
LQG18H
LQM18N
LQW18A
1.45
1.05
1.00
b
2.25
1.85
1.80
c
1.1
1.0
1.1
0.95
Paper Tape Minimum QTY. (pcs.)Dimensions (in mm)
4000 10000
φ180mm reel φ330mm reel
1000
-
Bulk
Part Number a
LQM21NN (2.7-4.7µH)
LQM21DN (22-47µH)
LQM21FN (4.7-47µH)
LQM31F
LQH31M/31C/31H, LQW31H
LQW2BH
LQH32M/LQH32C
LQH32CN_51
1.45
1.9
1.9
1.75
2.9
b
2.25
3.5
3.6
2.3
3.6
c
1.3
1.3
2.0
2.1
1.7
Plastic Tape Minimum QTY. (pcs.)Dimensions (in mm)
4000
3000
2000
10000
7500
φ180mm reel φ330mm reel
1000
-
Bulk
a
b
c
Direction of feed
4.0±0.1 4.0±0.1
2.0±0.1
0.2
3.5±0.05
1.75±0.1
8.0±0.3
(2.75)
,,
,,
φ1.5 +0.1
-0 ∗1
LQW2BH
∗1 : 0.3
Minimum Quantity and 8mm Width Taping Dimension
<Plastic> <Paper>
c
Continued on the following page.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
Packaging
57
12
Continued from the preceding page.
a
LQG15H
LQP03T
LQP15M
LQW15A
0.62
0.38
0.70
b
1.12
0.68
1.20
c
1.0
0.8
Dimensions (in mm)
10000
50000
-
1000
-
500
Paper Tape
Minimum Quantity and 8mm Width Taping Dimension
(in mm)
Part Number Minimum QTY. (pcs.)
φ180mm reel φ330mm reel Bulk
Direction of feed
2.0±0.05 4.0±0.1
a
b
c
1.75±0.1
ø1.5+0.1
-0
3.5±0.05
8.0±0.2
2.0±0.05
(in mm)
Part Number a
LQH3ER, LQH3KS
LQH43M(N)
LQH43C
LQH55D
LQH66S
3.9
3.6
5.4
6.7
b
3.7
4.9
6.1
6.7
c
1.9
2.7
5.0
5.6
d
0.3
0.4
Dimensions (in mm) Minimum QTY. (pcs.)
1000
500
350
-
2500
-
1500
-
φ180mm reel φ330mm reel
a
b
c
d
8.0±0.1 2.0±0.1
4.0±0.1
5.5±0.1 1.75±0.1
12.0±0.3
(4.75)
φ1.5+0.1
-0
,,
,,
,
Direction of feed
Minimum Quantity and 12mm Width Plastic Taping Dimension
58
oEKLM12UB (High-frequency Winding Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
3.3
6.8
8.2
10
12
15
18
22
27
33
39
47
T0.5nH
T0.5nH
T0.5nH
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
910
680
630
1320
680
630
690
720
540
570
730
450
LQW2BHN3N3D01
LQW2BHN6N8D01
LQW2BHN8N2D01
LQW2BHN10NJ01
LQW2BHN12NJ01
LQW2BHN15NJ01
LQW2BHN18NJ01
LQW2BHN22NJ01
LQW2BHN27NJ01
LQW2BHN33NJ01
LQW2BHN39NJ01
LQW2BHN47NJ01
Design Kits
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
56
68
82
100
120
150
180
220
270
330
390
470
2.7
3.1
3.3
5.6
6.8
8.6
10
12
15
18.8
21
27
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T10%
T10%
T10%
T10%
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T5%
T10%
T10%
T10%
T10%
T10%
430
460
320
350
320
390
250
240
190
180
170
160
1900
1800
1700
1500
1400
1300
1320
1100
1000
1000
950
900
LQW2BHN56NJ01
LQW2BHN68NJ01
LQW2BHN82NJ01
LQW2BHNR10J01
LQW2BHNR12J01
LQW2BHNR15J01
LQW2BHNR18J01
LQW2BHNR22J01
LQW2BHNR27K01
LQW2BHNR33K01
LQW2BHNR39K01
LQW2BHNR47K01
LQW2BHN2N7D11
LQW2BHN3N1D11
LQW2BHN3N3D11
LQW2BHN5N6D11
LQW2BHN6N8D11
LQW2BHN8N6D11
LQW2BHN10NJ11
LQW2BHN12NK11
LQW2BHN15NK11
LQW2BHN18NK11
LQW2BHN21NK11
LQW2BHN27NK11
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
59
oEKLM13UB (High-frequency Monolithic Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
LQG18HN1N2S00
LQG18HN1N5S00
LQG18HN1N8S00
LQG18HN2N2S00
LQG18HN2N7S00
LQG18HN3N3S00
LQG18HN3N9S00
LQG18HN4N7S00
LQG18HN5N6S00
LQG18HN6N8J00
LQG18HN8N2J00
LQG18HN10NJ00
LQG18HN12NJ00
LQG18HN15NJ00
LQG18HN18NJ00
LQG18HN22NJ00
LQG18HN27NJ00
LQG18HN33NJ00
LQG18HN39NJ00
LQG18HN47NJ00
LQG18HN56NJ00
LQG18HN68NJ00
LQG18HN82NJ00
LQG18HNR10J00
Design Kits
oEKLM14UC (High-frequency Flim Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
T0.1nH
400
390
390
280
280
220
280
220
220
220
220
190
190
170
170
160
160
140
140
130
130
110
110
100
LQP15MN1N0B00
LQP15MN1N1B00
LQP15MN1N2B00
LQP15MN1N3B00
LQP15MN1N5B00
LQP15MN1N6B00
LQP15MN1N8B00
LQP15MN2N0B00
LQP15MN2N2B00
LQP15MN2N4B00
LQP15MN2N7B00
LQP15MN3N0B00
LQP15MN3N3B00
LQP15MN3N6B00
LQP15MN3N9B00
LQP15MN4N3B00
LQP15MN4N7B00
LQP15MN5N1B00
LQP15MN5N6B00
LQP15MN6N2B00
LQP15MN6N8B00
LQP15MN7N5B00
LQP15MN8N2B00
LQP15MN9N1B00
Continued on the following page.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
60
No.
25
26
27
28
29
30
31
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
10
12
15
18
22
27
33
T2%
T2%
T2%
T2%
T2%
T2%
T2%
100
90
90
80
70
70
60
LQP15MN10NG00
LQP15MN12NG00
LQP15MN15NG00
LQP15MN18NG00
LQP15MN22NG00
LQP15MN27NG00
LQP15MN33NG00
oEKLM15UB (High-frequency Monolithic Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T0.3nH
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
LQG15HN1N2S00
LQG15HN1N5S00
LQG15HN1N8S00
LQG15HN2N2S00
LQG15HN2N7S00
LQG15HN3N3S00
LQG15HN3N9S00
LQG15HN4N7S00
LQG15HN5N6S00
LQG15HN6N8J00
LQG15HN8N2J00
LQG15HN10NJ00
LQG15HN12NJ00
LQG15HN15NJ00
LQG15HN18NJ00
LQG15HN22NJ00
LQG15HN27NJ00
Design Kits
Continued on the following page.
18 20 33 T5% 200
LQG15HN33NJ00
oEKLM16UB (High-frequency Winding Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
3.6
3.9
4.3
5.6
6.2
6.8
10
11
12
13
15
16
18
20
22
24
27
30
33
36
T0.2nH
T0.2nH
T0.2nH
T0.2nH
T0.2nH
T0.2nH
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
850
850
850
750
750
750
650
650
600
600
600
550
550
550
500
500
440
420
420
400
LQW18AN3N6C00
LQW18AN3N9C00
LQW18AN4N3C00
LQW18AN5N6C00
LQW18AN6N2C00
LQW18AN6N8C00
LQW18AN10NG00
LQW18AN11NG00
LQW18AN12NG00
LQW18AN13NG00
LQW18AN15NG00
LQW18AN16NG00
LQW18AN18NG00
LQW18AN20NG00
LQW18AN22NG00
LQW18AN24NG00
LQW18AN27NG00
LQW18AN30NG00
LQW18AN33NG00
LQW18AN36NG00
Continued from the preceding page.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
61
No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
39
43
47
51
56
62
68
72
75
82
91
100
110
120
130
150
160
180
200
220
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
T2%
400
380
380
370
360
280
340
270
270
250
230
220
200
180
170
160
150
140
120
120
LQW18AN39NG00
LQW18AN43NG00
LQW18AN47NG00
LQW18AN51NG00
LQW18AN56NG00
LQW18AN62NG00
LQW18AN68NG00
LQW18AN72NG00
LQW18AN75NG00
LQW18AN82NG00
LQW18AN91NG00
LQW18ANR10G00
LQW18ANR11G00
LQW18ANR12G00
LQW18ANR13G00
LQW18ANR15G00
LQW18ANR16G00
LQW18ANR18G00
LQW18ANR20G00
LQW18ANR22G00
Design Kits
Continued from the preceding page.
oEKLM17UB (High-frequency Winding Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2.2
3.6
3.9
4.3
4.7
5.6
6.2
6.8
7.5
8.2
8.7
9.1
9.5
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T0.5nH
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
700
850
850
850
850
750
750
750
750
650
650
650
650
650
650
600
600
600
550
550
550
500
500
440
420
420
400
400
380
380
LQW18AN2N2D00
LQW18AN3N6D00
LQW18AN3N9D00
LQW18AN4N3D00
LQW18AN4N7D00
LQW18AN5N6D00
LQW18AN6N2D00
LQW18AN6N8D00
LQW18AN7N5D00
LQW18AN8N2D00
LQW18AN8N7D00
LQW18AN9N1D00
LQW18AN9N5D00
LQW18AN10NJ00
LQW18AN11NJ00
LQW18AN12NJ00
LQW18AN13NJ00
LQW18AN15NJ00
LQW18AN16NJ00
LQW18AN18NJ00
LQW18AN20NJ00
LQW18AN22NJ00
LQW18AN24NJ00
LQW18AN27NJ00
LQW18AN30NJ00
LQW18AN33NJ00
LQW18AN36NJ00
LQW18AN39NJ00
LQW18AN43NJ00
LQW18AN47NJ00
Continued on the following page.
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
62
No.
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
51
56
62
68
72
75
82
91
100
110
120
130
150
160
180
200
220
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
T5%
370
360
280
340
270
270
250
230
220
200
180
170
160
150
140
120
120
LQW18AN51NJ00
LQW18AN56NJ00
LQW18AN62NJ00
LQW18AN68NJ00
LQW18AN72NJ00
LQW18AN75NJ00
LQW18AN82NJ00
LQW18AN91NJ00
LQW18ANR10J00
LQW18ANR11J00
LQW18ANR12J00
LQW18ANR13J00
LQW18ANR15J00
LQW18ANR16J00
LQW18ANR18J00
LQW18ANR20J00
LQW18ANR22J00
Design Kits
Continued from the preceding page.
oEKLM21UB (for General Use/ for Choke Monolithic Type)
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance (%) Rated Current (mA)
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
1.0
2.2
4.7
10
22
47
1.0
2.2
4.7
10
22
47
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T10
T30
T30
T30
T30
T30
T30
T30
T30
T30
T30
T30
T30
250
250
250
250
250
250
250
200
200
150
150
150
50
50
50
50
30
30
30
30
30
60
40
30
15
13
7
220
150
80
60
13
7
LQM21NNR10K10
LQM21NNR12K10
LQM21NNR15K10
LQM21NNR18K10
LQM21NNR22K10
LQM21NNR27K10
LQM21NNR33K10
LQM21NNR39K10
LQM21NNR47K10
LQM21NNR56K10
LQM21NNR68K10
LQM21NNR82K10
LQM21NN1R0K10
LQM21NN1R2K10
LQM21NN1R5K10
LQM21NN1R8K10
LQM21NN2R2K10
LQM21NN2R7K10
LQM21NN3R3K10
LQM21NN3R9K10
LQM21NN4R7K10
LQM21DN1R0N00
LQM21DN2R2N00
LQM21DN4R7N00
LQM21DN100N00
LQM21DN220N00
LQM21DN470N00
LQM21FN1R0N00
LQM21FN2R2N00
LQM21FN4R7N00
LQM21FN100N00
LQM21FN220N00
LQM21FN470N00
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
63
1. Land Area and Q-F Characteristics
2. Coupling coefficient versus Coil-to-coil Spacing
Information
14
10
12
8
6
4
0
2
10 2 3
Coil-to-coil Spacing (mm)
Coupling Coefficient (%)
4 5 6
1µH
330µH
Coil-to-coil Spacing
100
80
60
40
20
050k10k 100k 500k
Frequency (Hz)
Q
1M 5M
A
B
C
2.5 2.5
2.5 2
1
1
1 1 5.5
1.3
(in mm)
C :
B : Characteristic of chip mounted on land
Characteristic of chip mounted on land
A : Characteristic of coil itself
PCB : Ag-Pb printed land formed on 0.6mm-thick alumina plate
Solder : H60A
Soldering : Reflow soldering
Solder layer : Sections shown by oblique lines in figure
LQH32MN680K21
LQH32M Series
This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9
