DATA SHEE
T
CURRENT SENSOR - LOW TCR
PT series
5%, 2%, 1%
sizes 0402/0603/0805/1206/0815/2010/2512
RoHS compliant & Halogen free
Product specification – Apr 06, 2011 V.1
Chip Resistor Surface Mount
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8
SERIES
PT 0402/0603/0805/1206/0815/2010/2512
ORDERING INFORMATION - GLOBAL PART NUMBER
Part numbers is identified by the series, size, tolerance, packing type,
temperature coefficient, taping reel and resistance value.
SCOPE
This specification describes PT
series current sensor - low TCR
with lead-free terminations made
by thick film process.
APPLICATIONS
Converters
Printer equipment
Server board
Telecom
Consumer
FEATURES
Halogen Free Epoxy
RoHS compliant
- Products with lead free
terminations meet RoHS
requirements
- Pb-glass contained in electrodes,
resistor element and glass are
exempted by RoHS
Reduce environmentally
hazardous wastes
High component and equipment
reliability
None forbidden-materials used
in products/production
Low resistances applied to
current sensing
ORDERING EXAMPLE
The ordering code of a PT0603
chip resistor, value 0.56 X with
±1% tolerance, supplied in 7-inch
tape reel is: PT0603FR-070R56L.
Resistance rule of global part
number
Resistance code rule Example
0RXXX
(25 to 910 mΩ)
0R025 = 25 mΩ
0R1 = 100 mΩ
0R91 = 910 mΩ
Y
YA
AG
GE
EO
O
B
BR
RA
AN
ND
D
o
or
rd
de
er
ri
in
ng
g
c
co
od
de
e
GLOBAL PART NUMBER (PREFERRED)
PT XXXX X X X XX XXXX L
(1) (2) (3) (4) (5) (6) (7)
(1) SIZE
0402 / 0603 / 0805 / 1206 / 0815 / 2010 / 2512
(2) TOLERANCE
F = ±1%
G = ±2%
J = ±5%
(3) PACKAGING TYPE
R = Paper taping reel
K = Embossed taping reel
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Based on spec.
(5) TAPING REEL
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
(6) RESISTANCE VALUE
There are 3~5 digits indicated the resistor value. Letter R is decimal point, no need to
mention the last zero after R.
Detailed coding rules of resistance are shown in the table of “Resistance rule of global
part number”.
(7) DEFAULT CODE
Letter L is system default code for order only (Note)
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SERIES
PT 0402/0603/0805/1206/0815/2010/2512
MARKING
PT0815
E-24 series / Non-E series (R= 25/40/50 mΩ): 4 digits
The “R” is used as a decimal point; the other 3 digits are significant.
PT0805 / PT1206 / PT2010 / PT2512
E-24 series / Non-E series (R= 250/400/500 mΩ): 4 digits
The “R” is used as a decimal point; the other 3 digits are significant.
PT0603
E-24 series / Non-E series (R= 250/400/500 mΩ): 3 digits
The “R” is used as a decimal point; the other 2 digits are significant.
PT0402
No marking
For further marking information, please refer to data sheet “Chip resistors marking”.
Fig. 2 Value = 220 mΩ
YNSC080
20
Fig. 3 Value = 220 mΩ
YNSC006
Fig. 4
ynsc007
Fig. 1 Value = 25 mΩ
YNSC097
025
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SERIES
PT 0402/0603/0805/1206/0815/2010/2512
overcoat
protective glass
resistive layer
inner electrode
termination (Cu/Ni/matte tin)
ceramic substrate
marking layer
inner electrode
YNSC094
Fig. 5 Chip resistor outlines
O
OU
UT
TL
LI
IN
NE
ES
S
CONSTRUCTION
The resistors are constructed out of a high-grade
ceramic body. Internal metal electrodes are added at
each end and connected by a resistive paste. The
composition of the paste is adjusted to give the
approximately required resistance and laser cutting
of this resistive layer that achieves tolerance trims
the value. The resistive layer is covered with a
protective coat and printed with the resistance value.
Finally, the three external terminations (Cu/Ni/matte
tin) are added, as shown in Fig.5.
TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm)
PT0402 1.00 ±0.10 0.50 ±0.05 0.35 ±0.05 0.20 ±0.10 0.25 ±0.10
PT0603 1.60 ±0.10 0.80 ±0.10 0.45 ±0.10 0.25 ±0.15 0.25 ±0.15
PT0805 2.00 ±0.10 1.25 ±0.10 0.55 ±0.10 0.35 ±0.20 0.35 ±0.20
PT1206 3.10 ±0.10 1.60 ±0.10 0.55 ±0.10 0.45 ±0.20 0.45 ±0.20
PT0815 2.00 ±0.10 3.70 ±0.10 0.50 ±0.10 0.35 ±0.20 0.40 ±0.20
PT2010 5.00 ±0.10 2.50 ±0.15 0.55 ±0.10 0.60 ±0.20 0.50 ±0.20
PT2512 6.35 ±0.10 3.20 ±0.15 0.55 ±0.10 0.60 ±0.20 0.50 ±0.20
Table 1
DIMENSIONS
YNSC09
8
PT 0402/0603/0805/1206/
2010/2512
PT0815 Side view for all type
I1
I2
I1
L L
H
W
W
20
025
Fig. 6 Chip resistor dimensions
For dimensions, please refer to Table 1
ELECTRICAL CHARACTERISTICS
Table 2
Type Power Resistance Range Tolerance Temperature Coefficient of Resistance
PT0402 1/16 W
PT0603 1/10 W
±200 ppm/°
C
PT0805 1/8 W ±100 ppm/°
C
PT1206 1/4 W
100 mΩ ≤ R < 1 Ω
100 mΩ
100 mΩ < R < 1 Ω
±100 ppm/°
C
±75 ppm/°
C
PT0815 1/2 W 25 mΩ ≤ R < 50 mΩ±100 ppm/°
C
PT2010 3/4 W
PT2512 1 W 100 mΩ ≤ R < 1 Ω
±1%, ±2%, ±5%
100 mΩ
100 mΩ < R < 1 Ω
±100 ppm/°
C
±75 ppm/°
C
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SERIES
PT 0402/0603/0805/1206/0815/2010/2512
PACKING STYLE AND P
A
CKAGING QUANTITY
PACKING STYLE REEL
DIMENSION
PT0402 PT0603 PT0805 PT1206 PT0815 PT2010 PT2512
Paper taping reel (R) 7" (178 mm) 10,000 5,000 5,000 5,000 --- --- ---
13" (330 mm) 50,000 20,000 20,000 20,000 --- --- ---
Embossed taping reel (K) 7" (178 mm) --- --- --- --- 4,000 4,000 4,000
NOTE
1. For paper/embossed tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”.
Table 3 Packing style and packaging quantity
MLB206_2
70 10055 50
T
amb( C)
o
(%P )
rated
0
0
50
100
155
P
handbook, halfpage
Fig. 7 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb)
FUNCTIONAL DESCRIPTION
O
OP
PE
ER
RA
AT
TI
IN
NG
GT
TE
EM
MP
PE
ER
RA
AT
TU
UR
RE
E
R
RA
AN
NG
GE
E
Range: –55 °C to +155 °C
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
Each type rated power at 70 °C:
PT0402=1/16 W
PT0603=1/10 W
PT0805=1/8 W
PT1206=1/4 W
PT0815=1/2 W
PT2010=3/4 W
PT2512=1 W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V = √(P X R)
Where
V = Continuous rated DC or AC (rms) working
voltage (V)
P = Rated power (W)
R = Resistance value (X)
FOOTPRINT AND SOLDERING PROFILES
Recommended footprint and soldering profiles, please refer to data sheet “Chip resistors mounting”.
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SERIES
PT 0402/0603/0805/1206/0815/2010/2512
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
At +25/+125 °C Temperature
Coefficient of
Resistance (T.C.R.)
MIL-STD-202 Method-304
Formula:
T.C.R= ------------------------- × 106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=+125 °C test temperature
R1=resistance at reference temperature in
ohms
R2=resistance at test temperature in ohms
Refer to table 2
Life/
Endurance
IEC 60115-1 4.25.1
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (1.0%+0.0005 Ω)
High Temperature
Exposure/
Endurance at Upper
Category Temperature
IEC 60068-2-2 1,000 hours at maximum operating
temperature depending on specification,
unpowered
No direct impingement of forced air to the
parts
Tolerances: 155±3 °C
± (1.0%+0.0005 Ω)
Moisture Resistance MIL-STD-202 Method-106 Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
± (0.5%+0.0005 Ω)
Thermal Shock MIL-STD-202 Method-107 -55/+125 °C
Note: Number of cycles required is 300.
Devices unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
± (1.0%+0.0005 Ω)
Table 4 Test condition, procedure and requirements
R2–R1
R1(t2–t1)
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SERIES
PT 0402/0603/0805/1206/0815/2010/2512
TEST TEST METHOD PROCEDURE REQUIREMENTS
Short Time
Overload
IEC60115-1 4.13 2.5 times rated power or maximum
overload voltage whichever is less for 5 sec
at room temperature
± (1.0%+0.0005 Ω)
No visible damage
Board Flex/
Bending
IEC 60068-2-21 Device mounted on PCB test board as
described, only 1 board bending required
Bending for 0402: 5 mm
0603/0805: 3 mm
1206 and above: 2 mm
Holding time: minimum 60±1 seconds
Ohmic value checked during bending
± (1.0%+0.0005 Ω)
No visible damage
Solderability
- Wetting
IPC/JEDECJ-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
IEC 60068-2-58 Condition B, no pre-heat of samples.
Leadfree solder, 260±5 °C, 10±1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (0.5%+0.0005 Ω)
No visible damage
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SERIES
PT 0402/0603/0805/1206/0815/2010/2512
REVISION HISTORY
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any
product change will be announced by PCN.”
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 1 Apr 06, 2011 - - PT0805 dimension improvement for better pick and place performance
Version 0 Mar 18, 2011 - - New datasheet for current sensor - low TCR PT series sizes of
0402/0603/0805/1206/0815/2010/2512, 1%, 2%, 5% with lead-free
terminations
