SGNE04 0402 [01005 inch]*
SGNE06 0603 [0201 inch]
* Dimensions Code JIS[EIA]
Chip Protectors
ForESDprotection
SGNE series
October 2015
Voltage Protection Devices
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Voltage Protection Devices
REMINDERS FOR USING THESE PRODUCTS
Before using these products, be sure to request the delivery specifications.
SAFETY REMINDERS
Please pay sufficient attention to the warnings for safe designing when using these products.
Please note the following precautions in order to avoid problems with chip protectors such as characteristic degradation and element
destruction.
Please store these products in an environment with a temperature of 5 to 40°C and humidity level of 20 to 70%RH, and use them
within six months.
Poor storage conditions may lead to the deterioration of the solderability of the terminal electrodes, so please be careful to avoid
contact with humidity, dew condensation, dust, toxic gas (hydrogen, hydrogen sulfide, sulfurous acid, chlorine, ammonia, etc.), direct
sunlight, and so on.
Please do not use products that have been dropped or detached when mounting.
Please solder with the reflow soldering method, and not the flow (dip) soldering method.
Please note the following precautions to avoid problems with chip protectors such as characteristic degradation and element
destruction, which ultimately lead to the generation of heat and smoke with the elements.
Do not use in locations where the temperatures exceed the operating temperature range such as under direct sunlight or near
sources of heat.
Do not use in locations where there are high levels of humidity such as under direct exposure to weather and areas where steam is
released.
Do not use in locations such as dusty areas, high-saline environments, places where the atmosphere is contaminated with corrosive
gas, etc.
Avoid powerful vibrations, impact (such as by dropping), pressure, etc. that may lead to splitting in the products.
Do not use with a voltage that exceeds the maximum allowable circuit voltage.
When resin coating (including modular) a varistor, do not use a resin that will cause deterioration of the varistor. Be sure never to use
resin that generates hydrogen as palladium is used for the inner electrode.
Avoid attachment near combustible materials.
Please contact our sales offices when considering the use of the products listed on this catalog for applications, whose performance
and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage
to society, person or property ('specific uses' such as automobiles, airplanes, medical instruments, nuclear devices, etc.) as well as
when considering the use for applications that exceed the range and conditions of this catalog.
Please also contact us when using these products for automotive applications.
Please note that we are not responsible for any damages or losses incurred resulting from the use of these products that exceeds the
range and conditions of this catalog or specific uses.
Please take appropriate measures such as acquiring protective circuits and devices that meet the uses, applications, and conditions of
the instruments and keeping backup circuits.
REMINDERS
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• All specifications are subject to change without notice.
Voltage Protection Devices
Chip Protectors
ESD Protection
FEATURES
Multilayer chip protector is the ESD protection solution which is using a semiconductor ceramic.
It is the possible replacement of TVS Diode for ESD protectrion.
Chip size is available with EIA01005(0402mm), EIA0201(0603mm).
Rather than the present products of TDK, it has the outstanding ESD absorption feature.
Excellent ESD protection characteristic. (Based on IEC61000-4-2, Contact-8kV)
APPLICATION
ESD protection such as signal line, audio line
Filter for EMI protection
Smart phone, tablet PC, portable music player, note PC, etc
PART NUMBER CONSTRUCTION
Overview of the SGNE Series
SGNE 04 C 080 M T 150 N 25
Series name
L×W
Dimensions
(mm)
Structure
Breakdown
voltage
(V)
Varistor voltage
tolerance
(%)
Packaging style Capacitance
(pF)
Capacitance
tolerance
(%)
ESD Clamp voltage
Average voltage
(IEC61000-4-2, 8kV)
04 0.4×0.2 080 8 M ±20 T Taping 150 15 N ±30
06 0.6×0.3 270 27 6R8 6.8 G ±2pF
Product compatible with RoHS directive
Compatible with lead-free solders
RoHS Directive Compliant Product: See the following for more details related to RoHS Directive compliant products. http://product.tdk.com/en/environment/rohs/
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Voltage Protection Devices
Overview of the SGNE Series
TDK ESD Protection Device Map
Multilayer chip protector is a ESD protection component which has excellent ESD absorption characteristic and the low capacitance.
This SGNE series is suitable for the applications which require the low clamping voltage and the low capacitance.
1 10 100 1000 2000 3000
10
100
80
70
60
50
40
30
20
300
200
0.6 0.8 2 3 4 5 6 7 8 20 30 40 50
6070
200 300 400 600
High ESD
absorption capability
TVS Diode's
area
Low
Capacitance
NEW!
ML Varistor
AVR "M“ series
ML Varistor
AVR "L“ series
ML Chip
Protectors
∗ Average 30 to 100ns
Capacitance (pF)
ESD Clamping Voltage∗ at 8kV-ESD
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Voltage Protection Devices
Overview of the SGNE Series
RECOMMENDED REFLOW PROFILE
Preheating Soldering Peak
Temp. Time Temp. Time Temp. Time
T1 T2 t1 T3 t2 T4 t3
150°C 180°C 120s max. 230°C 40s max. 260°C max. 5s
Natural
cooling
t3
t1
Preheating
t2
Soldering
T3 T3
T4
T2
T1
t: Time
Peak
T: Temperature
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Voltage Protection Devices
SGNE series
SGNE04/SGNE06 Types
SHAPE & DIMENSIONS
RECOMMENDED LAND PATTERN CIRCUITS DIAGRAM
Dimensionsinmm
EIA LWTB
01005 0.4±0.02 0.2±0.02 0.2±0.02 0.07min.
0201 0.6±0.03 0.3±0.03 0.3±0.03 0.1min.
L
WT
B
Dimensionsinmm
EIA abc
01005 0.20 0.15 to 0.20 0.18 to 0.20
0201 0.25 to 0.35 0.20 to 0.30 0.25 to 0.35
c
a bb
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Voltage Protection Devices
SGNE series SGNE04/SGNE06 Types
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS SPECIFICATION TABLE
・Short bar residual inductance =0nH
Part No.
Maximum
continuous voltage
Vdc(V)
max.
Breakdown voltage
V(V)
[1mA]
Capacitance
C(pF)
[1MHz]
Leakage current
Vdc(μA)
max.
ESD Clamp voltage
Average Voltage
(V)
[IEC61000-4-2, 8kV]
max.
EIA01005(0402mm)
SGNE04C080MT150N25 4.3 8( 6.4 to 9.6) 15 (10.5 to 19.5) 20 25
EIA0201(0603mm)
SGNE06C080MT150N25 4.3 8( 6.4 to 9.6) 15 (10.5 to 19.5) 20 25
SGNE06C270MT6R8G60 15 27 (21.6 to 32.4) 6.8 ( 4.8 to 8.8) 20 60
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Voltage Protection Devices
SGNE series SGNE04/SGNE06 Types
ELECTRICAL CHARACTERISTICS
SGNE 0603mm Case Size
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
・Short bar residual inductance =0nH
CAPACITANCE vs. FREQUENCY CHARACTERISTICS
SGNE 15pF Type
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
・Short bar residual inductance =0nH
CAPACITANCE vs. FREQUENCY CHARACTERISTICS
1 10 100 1000 10000
Frequency(MHz)
Impeadance(Ω)
1000
10000
100
10
1
0.1
15pF
6.8pF
1 10 100 1000 10000
Frequency(MHz)
Capacitance(pF)
100
1000
10
1
15pF
6.8pF
1 10 100 1000 10000
Frequency(MHz)
Impeadance(Ω)
1000
10000
100
10
1
0.1 1 10 100 1000 10000
Frequency(MHz)
Capacitance(pF)
100
1000
10
1
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Voltage Protection Devices
SGNE series SGNE04/SGNE06 Types
ESD CLAMP CHARACTERISTICS
SGNE06C270MT6R8G60 SGNE06C080MT150N25
SGNE04C080MT150N25
Voltage (V)
Time
(
nano-seconds
)
–100 0 100 200 300 400
–400
0
400
800
1200
1600
Without Varistor
15pF Type
6.8pF Type
Part No.
ESD Clamping
Voltage(V, at 8kV)
Vpeak Vave
Without ESD Device 1561 395
SGNE06C080MT150N25 59 22
SGNE06C270MT6R8G60 99 51
SGNE04C080MT150N25 56 21
30 100 (ns)
(Voltage)
Vave
Vpeak
Based on IEC61000-4-2
150pF, 330Ω,
Contact, 8kV
–20
0
20
40
60
80
100
120
140
Voltage (V)
Time
(
nano-seconds
)
–100 0 100 200 300 400
Vpeak=99V, Vave=51V
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Voltage Protection Devices
SGNE series
Packaging Style
REEL DIMENSIONS
TAPE DIMENSIONS
Dimensions in mm
Type A B P1 K
SGNE0402 0.26±0.04 0.46±0.04 2.0±0.05 0.4max.
SGNE0603 0.38±0.05 0.68±0.05 2.0±0.05 0.45max.
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
Dimensions in mm
1.0
ø60min.
14.4max.
8.4 +2.0
–0.0
4.0±0.12.0±0.05
B
A P1
8.0±0.3
1.75±0.1
3.5±0.05
K
1.5 +0.1
0
Dimensions in mm
160min. Taping 200min.
300min.
Drawing direction