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05051.R16 4/18 Page 1
05051
SM16LC03 - SM16LC36C
500 WATT MULTI-LINE LOW CAPACITANCE TVS ARRAY
DESCRIPTION
The SM16LCxx and SM16LCxxC Series are low capacitance mul-line transient voltage suppressor arrays that provides
board level protecon for standard TTL and MOS bus line applicaons against the damaging eects of ESD, terary
lightning and switching transients.
This series has a peak pulse power rang of 500 Was for an 8/20µs waveshape. This device series meets the IEC
61000-4-2, IEC 61000-4-4 and IEC 61000-4-5 requirements.
FEATURES
Compable with IEC 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
Compable with IEC 61000-4-4 (EFT): 40A - 5/50ns
Compable with IEC 61000-4-5 (Surge): 12A, 8/20µs - Level 1(Line-
Gnd) & Level 2(Line-Line)
500 Was Peak Pulse Power per Line (tp = 8/20µs)
Unidireconal and Bidireconal Conguraons
ESD Protecon > 25 kilovolts
Available in Mulple Voltages Ranging from 3.3V to 36V
Protects up to 8 Lines
Low Capacitance: 15pF
RoHS Compliant
REACH Compliant
APPLICATIONS
Wireless Communicaon Circuits
RS-422, RS-432 & RS-485
Low Voltage ASICs
Ethernet Interfaces
MECHANICAL CHARACTERISTICS
Molded JEDEC SO-16 Package
Approximate Weight: 0.15 grams
Lead-Free Pure-Tin Plang (Annealed)
Solder Reow Temperature:
Pure-Tin - Sn, 100: 260-270°C
16mm Tape and Reel Per EIA Standard 481
Flammability Rang UL 94V-0
PIN CONFIGURATIONS

1 2 54
16
3 6 7 8
9101112131415
1 2 54
16
3 6 7 8
9101112131415
UNIDIRECTIONAL
BIDIRECTIONAL
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05051.R16 4/18 Page 2
05051
SM16LC03 - SM16LC36C
TYPICAL DEVICE CHARACTERISTICS
MAXIMUM RATINGS 
PARAMETER SYMBOL VALUE UNITS
Operang Temperature TL-55 to 150 °C
Storage Temperature TSTG -55 to 150 °C
Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 500 Was
Forward Voltage @ 50mA, 300µs - Square Wave (See Note 1) VF1.5 Volts
Soldering Temperature for 10 seconds TII 260 °C
NOTES
1. Only applies to unidireconal devices.
ELECTRICAL CHARACTERISTICS PER LINE 
PART
NUMBER
(Note 1)
RATED

VOLTAGE
VWM
VOLTS
MINIMUM

VOLTAGE
mA
V
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
P = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(Fig. 2)
µs
VCPP
MAXIMUM

CURRENT
WM
ID
µA
MAXIMUM
CAPACITANCE
z
C
pF
TEMPERATURE
COEFFICIENT
OF V
qV(BR)

SM16LC03 3.3 4.5 7.0 20.0V @ 35A 125 15 -3
SM16LC03C 3.3 4.5 7.0 20.0V @ 35A 125 15 -3
SM16LC05 5.0 6.0 9.8 24.0V @ 42A 20 15 3
SM16LC05C 5.0 6.0 9.8 24.0V @ 42A 20 15 3
SM16LC08 8.0 8.5 13.4 26.0V @ 30A 10 15 9
SM16LC08C 8.0 8.5 13.4 26.0V @ 30A 10 15 9
SM16LC12 12.0 13.3 19.0 33.0V @ 21A 2 15 16
SM16LC12C 12.0 13.3 19.0 33.0V @ 21A 2 15 16
SM16LC15 15.0 16.7 25.5 39.0V @ 15A 2 15 17
SM16LC15C 15.0 16.7 25.5 39.0V @ 15A 2 15 17
SM16LC24 24.0 26.7 40.0 57.0V @ 10A 2 15 26
SM16LC24C 24.0 26.7 40.0 57.0V @ 10A 2 15 26
SM16LC36 36.0 40.0 53.0 72.0V @ 7A 2 15 36
SM16LC36C 36.0 40.0 53.0 72.0V @ 7A 2 15 36
NOTES
1. Part numbers with a “C” sux are bidireconal devices, i.e., SM16LC05C.
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05051.R16 4/18 Page 3
05051
SM16LC03 - SM16LC36C
TYPICAL DEVICE CHARACTERISTICS
FIGURE 1

td
500W, 8/20µs Waveform

PPP




Peak Pulse Power
8/20µs
Average Power
FIGURE 3
POWER DERATING CURVE
TA - Ambient Temperature - °C






% Of Rated Power
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
tf
e-t
Peak Value IPP
td = t/(IPP/2)
FIGURE 2
PULSE WAVE FORM
t - Time - µs

IPP - Peak Pulse Current - % of IPP






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05051.R16 4/18 Page 4
05051
SM16LC03 - SM16LC36C
TYPICAL DEVICE CHARACTERISTICS
FIGURE 4


5 Volts per Division




FIGURE 5

FIGURE 5



 
 
 
 
 
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05051.R16 4/18 Page 5
05051
SM16LC03 - SM16LC36C
SPICE MODEL
FIGURE 1
SPICE MODEL

PARAMETER UNIT  LCRD
BV V See Table 2 200
IBV µA 10.01
Cjo pF See Table 2 5
ISA See Table 2 1E-13
Vj V 0.6 0.6
M- 0.33 0.33
N - 1 1
RSOhms See Table 2 0.31
TT s1E-8 1E-9
EG eV 1.11 1.11

PART NUMBER BV Cjop IS Rs
SM16LC03 4.5 438 1E-11 0.21
SM16LC05 6.0 284 1E-11 0.14
SM16LC08 8.5 146 1E-11 0.28
SM16LC12 13.3 123 1E-13 0.40
SM16LC15 16.7 102 1E-13 0.52
SM16LC24 26.7 61 1E-13 1.54
SM16LC03C 4.5 438 1E-11 0.21
SM16LC05C 6.0 284 1E-11 0.14
SM16LC08C 8.5 146 1E-11 0.28
SM16LC12C 13.3 123 1E-13 0.40
SM16LC15C 16.7 102 1E-13 0.52
SM16LC24C 26.7 61 1E-13 1.54
ABD - Avalanche Breakdown Diode (TVS)
LCRD: Low Capacitance Recer Diode
Lg - Lead Inductance
ABD
Lg
0.8nH
UNIDIRECTIONAL BIDIRECTIONAL
LCRD
LCRD
I/O
ABD
Lg
0.8nH
LCRD
LCRD
I/O
ABD
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05051.R16 4/18 
05051
SM16LC03 - SM16LC36C
APPLICATION INFORMATION

Circuit connecvity is as follows:
Line 1 connected to Pin 9.
Line 2 connected to Pin 10.
Line 3 connected to Pin 11.
Line 4 connected to Pin 12.
Line 5 connected to Pin 13.
Line 6 connected to Pin 14.
Line 7 connected to Pin 15.
Line 8 connected to Pin 16.
Pins 1 - 8 connected to ground.
CIRCUIT BOARD RECOMMENDATIONS
Circuit board layout is crical for electromagnec compability protecon. The following guidelines are recommended:
The protecon device should be placed near the input terminals or connectors, the device will divert the transient current
immediately before it can be coupled into the nearby traces.
The path length between the TVS device and the protected line should be minimized.
All conducve loops including power and ground loops should be minimized.
The transient current return path to ground should be kept as short as possible to reduce parasic inductance.
Ground planes should be used whenever possible. For mullayer PCBs, use ground vias.
1 2 54
16
3 6 7 8
9101112131415
Line 3
Line 4
Line 5
Line 6
Line 7
Line 8
Line 2
Line 1
D
D
R
R
Transceiver
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05051.R16 4/18 
05051
SM16LC03 - SM16LC36C
SO-16 PACKAGE INFORMATION
OUTLINE DIMENSIONS
DIM MILLIMETERS INCHES
MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G1.27 BSC 0.05 BSC
J0.18 0.25 0.007 0.009
K0.10 0.25 0.004 0.008
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
NOTES
1. -T- = Seang plane and datum surface.
2. Dimensions “A” and “B” are datum.
3. Dimensions “A” and “B” do not include mold protrusion.
4. Maximum mold protrusion is 0.015” (0.380mm) per side.
5. Dimensioning and tolerances per ANSI Y14.5M, 1982.
6. Dimensions are exclusive of mold ash and metal burrs.
PAD LAYOUT DIMENSIONS
DIM MILLIMETERS INCHES
MIN MAX MIN MAX
A 1.14 1.40 0.045 0.055
B 0.64 0.89 0.025 0.035
C6.22 - 0.245 -
D 3.94 4.17 0.155 0.165
E 1.02 1.27 0.040 0.050
NOTES
1. Controlling dimension: inches.
-A-
16 9
8
1
-B- P
8 PL
0.010” (0.25mm) M
MB
+
GDC
K
-T-
16 PL
0.010” (0.25mm) MS
B
+S
AT
R X 45°
J
0° - 10°
F
A
B
C
D
E
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05051.R16 4/18 
05051
SM16LC03 - SM16LC36C
TAPE AND REEL
ORDERING INFORMATION
BASE PART NUMBER
(xx = Voltage) LEADFREE SUFFIX TAPE SUFFIX  REEL SIZE TUBE QTY
SM16LCxx/SM16LCxxC -LF -T7 1,000 7” 48
SM16LCxx/SM16LCxxC -LF -T13 2,500 13” 48
This device is only available in a Lead-Free conguraon.
SPECIFICATIONS
REEL DIA. TAPE
WIDTH    D E F W  P2 P tmax
178mm (7”) 16mm 6.50 ± 0.10 10.30 ± 0.10 2.10 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 16.00 ± 0.30 4.00 ± 0.12 2.00 ± 0.10 8.00 ± 0.10 0.25
NOTES
1. Dimensions are in millimeters.
2. Surface mount product is taped and reeled in accordance with EIA-481.
3. Sux - T7 = 7” Reel - 1,000 pieces per 16mm tape.
4. Sux - T13 = 13” Reel - 2,500 pieces per 16mm tape.
5. Bulk product shipped in tubes of 48 pieces per tube.
6. Marking on Part - part number, date code, logo and pin one dened by dot on top of package.
User Direcon of Feed
t
K0
A0 P
D
P0
P2 E
B0
F
W
10 Pitches Cumulave
Tolerance on tape ± 0.2
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05051
SM16LC03 - SM16LC36C
COMPANY INFORMATION
COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteriscs described herein without noce.
DESIGN CHANGES: ProTek reserves the right to disconnue product lines without noce and that the nal judgement concerning selecon and specicaons is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selecon or specicaons of such products. ProTek makes no warranty, representaon or guarantee regarding the suitability of
its products for any parcular purpose, nor does ProTek assume any liability arising out of the applicaon or use of any product or circuit and specically disclaims any and all liability without limitaon special,
consequenal or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without wrien consent from the factory.
CONTACT US
Corporate Headquarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
By Telephone
General: 602-431-8101
Sales: & Markeng: 602-414-5109
Customer Service: 602-414-5114
Product Technical Support: 602-414-5107
By Fax
General: 602-431-2288
By E-mail:
Asia Sales: asiasales@protekdevices.com
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U.S. Sales: ussales@protekdevices.com
Distributor Sales: distysales@protekdevices.com
Customer Service: service@protekdevices.com
Technical Support: support@protekdevices.com

8 Ubi Road 2, #06-19
Zervex
Singapore - 408538
Tel: +65-67488312
Fax: +65-67488313
Web
www.protekdevices.com
COMPANY PROFILE
In business more than 20 years, ProTek Devices™ is a privately held semiconductor company. The company oers a product line of overvoltage pro-
tecon and overcurrent protecon components. These include transient voltage suppressor array (TVS arrays) avalanche breakdown diode, steering
diode TVS array and electronics SMD chip fuses. These components deliver circuit protecon in electronic systems from numerous overvoltage and
overcurrent events. They include lightning; electrostac discharge (ESD); nuclear electromagnec pulses (NEMP); inducve switching; and elec-
tromagnec interference (EMI) / radio frequency interference (RFI). ProTek Devices also oers LED wafer die for ESD protecon and related high
frequency products.