Multi Purpose Axial Leaded Glass Schottky Diodes
MADS-002811-00540T, MA4E2811, MA4E2812-54
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and prod uct information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
V2
Features
♦ Glass Hermetically Sealed Packages
♦ Picosecond Switching
♦ Low Leakage Current
♦ Offered in Tape and Reel Packaging
♦ RoHS Compliant
Description and Applications
These Schottky diodes are designed to have pico-
second switching speed and are housed in a her-
metic axial lead glass package. These devices are
designed for use in a variety of applications in-
cluding mixing, detecting, and switching at both
low and high power levels. They can also be
used in commercial switching and control func-
tions particularly in narrow band receivers. They
can also be used in low frequency applications
such as shaping, sampli ng, and as gates.
Absolute Maximum Ratings
TAMB = +25°C (Unless Otherwise Noted) 1
Parameter Absolute Maximum
D.C. Reverse Voltage (See Table)
Operating Temperature -65°C to +200°C
Storage Temperature -65°C to +200°C
Installation Temperature +230°C for 5 Seconds
Power Dissipation Listed Below Will De-Rate
Linearly to 0mW at 135˚C
Case Style 54 250mW
Glass Package Style
1. Operation of this devic e above any one of these
parameters may cause perm anent damage.
Notes
ODS 54
Schottky Chip
Glass Cylinder
Tin Plated Dumet Leads
Part Number Package Standard
Quantity
MA4E2811 ESD Bags Bulk
MADS-002811-00540T Tape and Reel 1500
MA4E2812-54 ESD Bags Bulk
Ordering Information
Multi Purpose Axial Leaded Glass Schottky Diodes
MADS-002811-00540T, MA4E2811, MA4E2812-54
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and prod uct information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
2
V2
* Specifications subject to change without notice.
Part Number Package
Style
Voltage
Breakdown
@ 10uA
Vb (min.)
Forward
Voltage
@ 1mA
Vf (max.)
Forward
Voltage
@ 20mA
Vf ( max.)
Reverse
Leakage
Current
@ 8 V
Ir (max.)
Capacitance
@ 0V,
F=1MHz
Ct ( max.)
MADS-002811-00540T
MA4E2811 54 15 V 410 mV 1.0 V 100 nA 1.2 pF
MA4E2812-54 54 20 V 550 mV - - 1.2 pF
Forward
Voltage
@ 35mA
Vf ( max.)
-
1.0 V
Reverse
Leakage
Current
@ 15 V
Ir (max.)
-
150nA
Diode Specifications *
Package Outline Dimensions
B
A C
D
(2 plcs)
Package
Style
Dimension A Dimension B Dimension C Dimension D (Min.)
Mils mm Mils mm Mils mm Mils mm
54 155 ± 10 3.94 ± .25 71 ± 3 1.8 ± .08 15 ± 1 .38 ± .03 1000 25.4
Assembly Recommendations
• Leads on axial leaded devices must be formed while being held firm. Bending the leads too close to the body
of the part may cause internal damage to the device. Bends <0.060” from body are not recommended.
Appropriate fixturing should be used.
• Devices may be soldered using standard 60/40, Sn/Pb or RoHS compliant solders. Axial leads are tin plated,
50μM, thick to ensure an optimum conn ection.
