10 GHz to 26 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet HMC260ALC3B
Rev. 0 Document Feedback
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FEATURES
Passive; no dc bias required
Conversion loss
8 dB typical for 10 GHz to 18 GHz
9 dB typical for 18 GHz to 26 GHz
LO to RF isolation: 40 dB
Input IP3: 19 dBm typical for 18 GHz to 26 GHz
Wide IF bandwidth: dc to 8 GHz
RoHS compliant, 12-terminal, 3 mm × 3 mm, ceramic
LCC package: 9 mm2
APPLICATIONS
Point to point radios
Point to multipoint radios and very small aperture terminals
(VSATs)
Test equipment and sensors
Military end use
FUNCTIONAL BLOCK DIAGRAM
13884-001
1
GND
7
GND
PACKAGE
BASE
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
2
LO
3
GND
56
HMC260ALC3B
GND
IF
GND
Figure 1.
GENERAL DESCRIPTION
The HMC260ALC3B is a general-purpose, double balanced,
monolithic microwave integrated circuit (MMIC) mixer housed in
a leadless, Pb-free, RoHS compliant LCC package. The device
can be used as an upconverter or downconverter in the 10 GHz to
26 GHz frequency range. The HMC260ALC3B mixer requires no
external components or matching circuitry.
The HMC260ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF)
suppression due to optimized balun structures. The mixer
operates with LO amplitude levels between 9 dBm and 15 dBm.
The HMC260ALC3B eliminates the need for wire bonding,
allowing the use of surface-mount manufacturing techniques.
HMC260ALC3B Data Sheet
Rev. 0 | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance ...................................................... 6
Upconverter Performance ............................................................8
Isolation and Return Loss ............................................................9
IF Bandwidth—Downconverter ............................................... 11
IF Bandwidth—Upconverter .................................................... 12
Spurious and Harmonics Performance ................................... 13
Theory of Operation ...................................................................... 14
Applications Information .............................................................. 15
Typical Application Circuit ....................................................... 15
Evaluation PCB Information .................................................... 15
Outline Dimensions ....................................................................... 16
Ordering Guide .......................................................................... 16
REVISION HISTORY
1/2018—Revision 0: Initial Version
Data Sheet HMC260ALC3B
Rev. 0 | Page 3 of 16
SPECIFICATIONS
Ambient temperature (TA) = 25°C, IF = 1000 MHz, LO = 13 dBm, upper sideband. All measurements performed as a downconverter on the
evaluation printed circuit board (PCB), unless otherwise noted.
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE
RF 10 26 GHz
LO Input 10 26 GHz
IF dc 8 GHz
LO AMPLITUDE 9 13 15 dBm
10 GHz TO 18 GHz PERFORMANCE
Downconverter
Conversion Loss 8 10 dB
Single Sideband Noise Figure SSB NF 8 dB
Input Third-Order Intercept IIP3 13 18 dBm
Input 1 dB Compression Point IP1dB 9.5 dBm
Input Second-Order Intercept IIP2 43 dBm
Upconverter IFIN IFIN = 1000 MHz
Conversion Loss 7 dB
Input Third-Order Intercept IIP3 18 dBm
Input 1 dB Compression Point IP1dB 7 dBm
Isolation
RF to IF 14 21 dB
LO to RF 40 dB
LO to IF 25 35 dB
18 GHz TO 26 GHz PERFORMANCE
Downconverter
Conversion Loss 9 12 dB
Single Sideband Noise Figure SSB NF 10 dB
Input Third-Order Intercept IIP3 18 23 dBm
Input 1 dB Compression Point IP1dB 13 dBm
Input Second-Order Intercept IIP2 46 dBm
Upconverter IFIN IFIN = 1000 MHz
Conversion Loss 8 dB
Input Third-Order Intercept IIP3 19 dBm
Input 1 dB Compression Point IP1dB 8.5 dBm
Isolation
RF to IF 25 35 dB
LO to RF 40 dB
LO to IF 30 43 dB
HMC260ALC3B Data Sheet
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 27 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Peak Reflow Temperature 260°C
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 5 mW/°C Above 85°C)
260 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model 500 V
Field Induced Charged Device Model 1000 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θJC is the junction to
case thermal resistance.
Table 3. Thermal Resistance
Package Type θJA θ
JC Unit
E-12-41 120 200 °C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Data Sheet HMC260ALC3B
Rev. 0 | Page 5 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
GND
7
GND
PACKAGE
BASE
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
13884-002
2
LO
3
GND
5
IF
6
GND
HMC260ALC3B
TOP VI EW
(Not to Scale)
NOTES
1. NIC = NOT INT E RNALLY CONNECTED. THES E
PIN S CAN B E CONNECTED TO RF/ DC GRO UND.
PERFOR M AN CE IS NOT AFFECTED.
2
. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNE CTED TO RF/DC G ROUND.
Figure 2.
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. These pins and package bottoms connect to RF/dc ground.
2 LO Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
5 IF
Intermediate Frequency Port. This pin is dc-coupled. For applications, not requiring operation to dc, dc
block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction
and possible die failure may result. See Figure 5 for the interface schematic.
8 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10 to 12 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Device performance is not affected.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
G
ND
13884-003
Figure 3. GND Interface Schematic
LO
13884-004
Figure 4. LO Interface Schematic
IF
13884-005
Figure 5. IF Interface Schematic
RF
13884-006
Figure 6. RF Interface Schematic
HMC260ALC3B Data Sheet
Rev. 0 | Page 6 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter performance at IF = 1000 MHz, upper sideband (low-side LO).
0
–20
9.5
26.5
CONVERSI ON GAIN (dB)
RF FREQUENCY ( GHz)
–15
–10
–5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
TA = +85°C
TA = +25°C
TA = –40° C
13884-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
30
0
INPUT IP3 (dBm)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
5
10
15
20
25
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-008
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
20
15
10
5
0
NOISE F IG URE (d B)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-009
Figure 9. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
–20
9.5
26.5
CONVERSI ON G AIN (dB)
RF FREQUENCY ( GHz)
–15
–10
–5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-010
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
0
INPUT IP3 (dBm)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
5
10
15
20
25
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-011
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
5
0
NOISE F IG URE (d B)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-012
Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels, TA = 25°C
Data Sheet HMC260ALC3B
Rev. 0 | Page 7 of 16
Downconverter P1dB and IP2
IF = 1000 MHz, upper sideband (low-side LO).
20
15
10
5
0
INPUT P1dB (dBm)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40° C
13884-013
Figure 13. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
60
0
INPUT IP2 (dBm)
10
20
30
40
50
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-014
Figure 14. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
20
15
10
5
0
INPUT P1dB (dBm)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-015
Figure 15. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
0
INPUT IP2 (dBm)
10
20
30
40
50
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-016
Figure 16. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
HMC260ALC3B Data Sheet
Rev. 0 | Page 8 of 16
UPCONVERTER PERFORMANCE
Upconverter performance at input intermediate frequency (IFIN) = 1000 MHz, upper sideband (low-side LO).
0
–20
9.5
26.5
CONVERSION GAIN (dB)
RF
OUT
FREQUENCY (GHz)
–15
–10
–5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-017
Figure 17. Conversion Gain vs. RF Output (RFOUT) Frequency at Various
Temperatures, LO = 13 dBm
30
0
INPUT IP3 (dBm)
9.5
26.5
RF
OUT
FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
5
10
15
20
25
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-018
Figure 18. Input IP3 vs. RFOUT Frequency at Various Temperatures,
LO = 13 dBm
20
15
10
5
0
INPUT P1dB (dBm)
9.5
26.5
RF
OUT
FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-019
Figure 19. Input P1dB vs. RFOUT Frequency at Various Temperatures,
LO = 13 dBm
0
–20
9.5
26.5
CONVERSION GAIN (dB)
RF
OUT
FREQUENCY (GHz)
–15
–10
–5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-020
Figure 20. Conversion Gain vs. RFOUT Frequency at Various LO Power Levels,
TA = 25°C
26.5
30
0
INPUT IP3 (dBm)
9.5
26.5
RF
OUT
FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
5
10
15
20
25
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-021
Figure 21. Input IP3 vs. RFOUT Frequency at Various LO Power Levels,
TA = 25°C
20
15
10
5
0
INPUT P1dB (dBm)
9.5
26.5
RF
OUT
FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-022
Figure 22. Input P1dB vs. RFOUT Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC260ALC3B
Rev. 0 | Page 9 of 16
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 1000 MHz, upper sideband.
60
0
LO TO RF ISOLATI ON (dB)
10
20
30
40
50
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-023
Figure 23. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
60
0
LO TO IF ISOLATION (dB)
10
20
30
40
50
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-024
Figure 24. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
50
0
RF TO IF ISOLATION (dB)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
10
20
30
40
13884-025
Figure 25. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
60
0
LO TO RF ISOLATI ON (dB)
10
20
30
40
50
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-026
Figure 26. LO to RF Isolation vs. RF Frequency at Various LO Power levels,
TA = 25°C
60
0
LO TO IF ISOLATION (dB)
10
20
30
40
50
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-027
Figure 27. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
50
0
RF TO IF ISOLATION (dB)
9.5
26.5
RF FREQUENCY ( GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
10
20
30
40
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-028
Figure 28. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
LO = 17 GHz, TA = 25°C
HMC260ALC3B Data Sheet
Rev. 0 | Page 10 of 16
0
–3012 28
LO RETURN LOSS ( dB)
LO F REQUE NCY (GHz)
–20
–10
13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
13884-029
Figure 29. LO Return Loss vs. LO Frequency, TA = 25°C, LO = 13 dBm
0
–50
RF R E TURN L OSS (d B )
10
28
RF FREQUENCY ( GHz)
–40
–30
–20
–10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-030
Figure 30. RF Return Loss vs. RF Frequency at Various LO Powers, TA = 25°C
0
–200.1 10.1
IF RETURN LOSS ( dB)
IF FREQUE NCY (GHz)
–15
–10
–5
1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 9.1
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-031
Figure 31. IF Return Loss vs. IF Frequency at Various LO Powers, LO = 17 GHz,
TA = 25°C
Data Sheet HMC260ALC3B
Rev. 0 | Page 11 of 16
IF BANDWIDTH—DOWNCONVERTER
Upper sideband, RF = 20 GHz.
0
–200.1 8.1
CONVERSION GAIN (dB)
IF F RE QUENCY ( GHz)
–15
–10
–5
1.1 2.1 3.1 4.1 5.1 6.1 7.1
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-032
Figure 32. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
40
00.1 8.1
INPUT IP3 (dBm)
IF F RE QUENCY ( GHz)
5
10
15
20
25
30
35
1.1 2.1 3.1 4.1 5.1 6.1 7.1
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-033
Figure 33. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
0
–200.1 8.1
CONVERSION GAIN (dB)
IF F R E Q UENC Y (G Hz )
–15
–10
–5
1.1 2.1 3.1 4.1 5.1 6.1 7.1
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-034
Figure 34. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
40
0
0.1 8.1
INPUT IP3 (dBm)
IF F R E Q UENC Y (G Hz )
5
10
15
20
25
30
35
1.1 2.1 3.1 4.1 5.1 6.1 7.1
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-035
Figure 35. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
HMC260ALC3B Data Sheet
Rev. 0 | Page 12 of 16
IF BANDWIDTH—UPCONVERTER
Upper sideband, RFOUT = 20 GHz.
0
–200.1 8.1
CONVERSION GAIN (dB)
IF
IN
FREQUENCY (GHz)
–15
–10
–5
1.1 2.1 3.1 4.1 5.1 6.1 7.1
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-036
Figure 36. Conversion Gain vs. IFIN Frequency at Various Temperatures,
LO = 13 dBm
40
00.1 8.1
INPUT I P3 (dBm)
IF
IN
FRE QUENCY (G H z )
5
10
15
20
25
30
35
1.1 2.1 3.1 4.1 5.1 6.1 7.1
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-037
Figure 37. Input IP3 vs. IFIN Frequency at Various Temperatures,
LO = 13 dBm
0
–200.1 8.1
CONVERSION GAIN (dB)
IF
IN
FREQUENCY (GHz)
–15
–10
–5
1.1 2.1 3.1 4.1 5.1 6.1 7.1
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-038
Figure 38. Conversion Gain vs. IFIN Frequency at Various LO Power Levels,
TA = 25°C
40
0
0.1 8.1
INPUT IP3 (dBm)
IF
IN
FREQUENCY (GHz)
5
10
15
20
25
30
35
1.1 2.1 3.1 4.1 5.1 6.1 7.1
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-039
Figure 39. Input IP3 vs. IFIN Frequency at Various LO Power Levels,
TA = 25°C
Data Sheet HMC260ALC3B
Rev. 0 | Page 13 of 16
SPURIOUS AND HARMONICS PERFORMANCE
Mixer spurious products are measured in dBc from either the
RF pin or IF pin output power level. N/A means not applicable.
Downconverter M × N Spurious Outputs
Spur values are (M × RF) − (N × LO).
RF = 18 GHz at −10 dBm, LO = 17 GHz at 13 dBm.
N × LO
0 1 2 3 4
M × RF
0 N/A 7 19 N/A N/A
1 23 0 34 42 N/A
2 67 71 66 71 68
3 N/A 63 72 84 73
4 N/A N/A 64 74 77
Upconverter M × N Spurious Outputs
Spur values are (M × IFIN) + (N × LO).
IFIN = 1000 MHz at −10 dBm, LO = 17 GHz at 13 dBm.
N × LO
0 1 2 3 4
M × IFIN
−5 81 77 73 N/A N/A
−4 83 78 71 N/A N/A
−3 73 64 72 N/A N/A
−2 55 42 66 N/A N/A
−1 18 0 28 N/A N/A
0 0 9.5 17 N/A N/A
1 18 0 40 N/A N/A
2 55 45 67 N/A N/A
3 74 66 64 N/A N/A
4 81 74 66 N/A N/A
5 80 74 68 N/A N/A
HMC260ALC3B Data Sheet
Rev. 0 | Page 14 of 16
THEORY OF OPERATION
The HMC260ALC3B is a general-purpose, double balanced
mixer that can be used as an upconverter or a downconverter
from 10 GHz to 26 GHz.
When used a downconverter, the HMC260ALC3B downconverts
RF between 10 GHz and 26 GHz to IF between dc and 8 GHz.
When used as an upconverter, the mixer upconverts IF between dc
and 8 GHz to RF between 10 GHz and 26 GHz.
The mixer performs well with LO drives of 9 dBm or greater,
and it provides LO to RF and LO to IF suppression due to opti-
mized balun structures. The ceramic LCC package eliminates the
need for wire bonding and is compatible with high volume,
surface-mount manufacturing techniques.
Data Sheet HMC260ALC3B
Rev. 0 | Page 15 of 16
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 40 shows the typical application circuit for the
HMC260ALC3B. The HMC260ALC3B is a passive device and
does not require any external components. The LO ad RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external series
capacitor of a value chosen to pass the necessary IF frequency
range is recommended. When IF operation to dc is required, do
not exceed the IF source and sink current rating specified in the
Absolute Maximum Ratings section.
13884-041
GND
GND
RF
GND
NIC
NIC
NIC
GND
LO
LO RF
IF
GND
IF
GND
HMC260ALC3B
1
7
8
9
101112
4
2
3
56
Figure 40. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board. Ensure
that signal lines have 50 Ω impedance. Connect the package
ground leads and the exposed pad directly to the ground plane
(see Figure 41). Use a sufficient number of via holes to connect
the top and bottom ground planes. The evaluation circuit board
shown in Figure 41 is available from Analog Devices, Inc., upon
request.
Table 5. Bill of Materials
Item Description
J1, J2 PCB mount SRI 2.92 mm connectors
J3 PCB mount Johnson SMA connector
U1 HMC260ALC3B
PCB1 117611 evaluation board on Rogers 4350
1 117611 is the raw bare PCB identifier. Reference 109728 when ordering the
complete evaluation PCB.
13884-040
J1
J3
IF
LO RF
117611–1
U1
J2
260A
Figure 41. Evaluation PCB Top Layer
HMC260ALC3B Data Sheet
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
03-02-2017-A
P
KG-004837
0.50
BSC
0.32
BSC
BOT TOM VIEW
TOP VIEW
SIDE VIEW
0.08
BSC
1
4
6
7
9
10 12
3
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIG URATI ON AND
FUNCTION DES CRIPTI ONS
SECT ION OF T H IS DATA SHEET.
0.36
0.30
0.24
PIN 1
EXPOSED
PAD
PIN 1
INDICATOR
3.05
2.90 SQ
2.75
2.10 BS C
1.00 REF
1.60
1.50 S Q
1.40
0.90
0.80
0.70
SEATING
PLANE
Figure 42. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range MSL Rating2 Package Description Package Option
HMC260ALC3B −40°C to +85°C MSL3 12-Terminal LCC E-12-4
HMC260ALC3BTR −40°C to +85°C MSL3 12-Terminal LCC E-12-4
HMC260ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal LCC E-12-4
EV1HMC260ALC3B Evaluation PCB
1 All models are RoHS compliant devices.
2 The peak reflow temperature is 260°C. See Table 2 in the Absolute Maximum Ratings section.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13884-0-1/18(0)
