SHARP | SPEC No.[ BL165191__| ISSUE: Jun. 10 . 2004 To; 9P EC TIFICATION S$ Product Type VOLTAGE REFERENCE IC FOR LCD IR3E3146 Model No. (IR3E3146) 2X This specifications contains 2 2 pages including the cover and appendix. If you have any objections, please contact us before issuing purchasing order. CUSTOMERS ACCEPTANCE DATE: BY: PRESENTED BY: OR. Ku flaw > H. Fujita 7 DEPT. GENERAL. MANAGER REVIEWED BY: PREPARED BY: Usyomagiolc ML. Dnamtoqe PRODUCT DEVELOPMENT DEPT. I ANALOG IC DIVISION INTEGRATED CIRCUITS GROUP SHARP CORPORATION FRZKNo. BIOSO02A4SHARP IR3E31 46 @ Handle this document carefully for it contains material protected by internation al copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. @ When using the products covered herein, please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting form failure to strictly adhere to the se conditions and precautions. (1) The products covered herein are designed and manufactured for the following application areas. When using the products covered herein for the equipment listed in paragraph (2), even for the following application areas, be sure to observe the precautions given in Paragraph (2). Never use the products for the equipment listed in Paragraph (3). * Office electronics Instrumentation and measuring equipment *Machine tools * Audiovisual equipment *Home appliances -Communication equipment other than for trunk lines (2) These contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. *Control and safety devices for airplanes, trains, automobiles, and other transportation equipment *Mainframe computers traffic control systems *Gas leak detectors and automatic cutoff devices Rescue and security equipment Other safety devices and safety equipment, etc. (3) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, or accuracy - Aerospace equipment *Communications equipment for trunk lines Control equipment for the nuclear power industry * Medical equipment related to life support, etc. (4) Please direct all queries and comments regarding the interpretation of the above three Paragraphs to a sales representative of the company. @ Please direct all queries regarding the products covered herein to a sales representative of the company. #RtNo. BHO5007A4SHARP IR3E3146 CONTENTS 1. General Description 2 ~ ~ 2. Terminal Name 2 2 3. Terminal Connection 2 2 ~~ ~ ~ 4. Block Diagram OO eS SS SC > 5. Input/Output Circuit Type 9 ~ 6. Precautions ee SO SS SS 7. Absolute Maximum Ratings = 8. Electrical Characteristics } ~ 9. Package and Packing Specificat- SHARP IR3E3146 1. General Description The Sharp IR3E3106 is an IC that generates gamma correction reference voltage for TFT LCD color monitors. Features: *Low power consumption. ImW(TYP) Contains a regulator of high accuracy. 4.1V+2.5% Output sink/source current. lmA(MAX) Not designed or rated as radiation hardened. Package material: Plastic Chip material and wafer substrate type: P type silicon Number of pins and package type: 20-pin QFN Process(Structure): Bipolar Applications TFT LCD color monitorsSHARP TR3E3146 2.Terminal Name Pin No. Term. Name SW 3.Terminal connection tion Input_terminal for switchin al, Produce SW with the litude of O~5V. Reference volt output terminal for TFT LCD. No connection terminal. ce _ vo 9 Oo ion . @ _ @ JUUUE a CC _ TOP VIEW | iB View Cs sy CJ 7 19 OOD 4mmSHARP IR3E3146 4. Block Diagram GND voc VDD (\_f\ i \_ VOLTAGE poaennnnns REFERENCE | iO 4 vi pee ; 5 COMSHARP IR3E3146 5. Input/Output Circuit Type (Vec=5.0V) No. Symbol Voltage Circuit type Discription 1 SW O~5V VCC Input terminal for switching signal. LOW : input voltage S0.8V > (>) . 7) HIGH: input voltage = 2.0V ) /\ GND 2 COM OV or 5V VCC Produce SW signal with the amplitude of 0~5V. GND 3 vO 3.72V VCC Reference voltage output or 0.52V terminal for TFT LCD. 5 Vi1 3.12V or 1.12V 12 V3 1.22V or 3.32V 13 V4 0.52V or 4.02V GND 11 V2 2.10V VCC Reference voltage output or 2.30V terminal for TFT LCD. GND 16 VDD 4.10V VCC Reference voltage output terminal. Connect a capacitor between a GND. GND 8 GND OV GND terminal. 14 VCC 5V Power supply terminal.SHARP IR3E3146 6. Precautions DGND terminal Make sure that Pin 8 is connected to GND, and do not open it. ii)Decoupling capacitor Place the decoupling capacitor connected to Pin 14,16 to the IC pin as near as possible. 7. Absolute Maximum Ratings (Ta=25C) Parameter Symbol Condition Rating Unit Supply voltage VCC 7.0 V Power dissipation PD TaS25C 350 mW Derating ratio Ta>25C 2.8 mW/C Operating temperature Topr -25~75 CC range Srorage temperature Tstg -55~150 cC range Recommended operating conditions Parameter Symbol Condition Rating Unit Operating supply VCC 4.6~5.0~5.5 V voltage rangeSHARP IR3E3146 7 8. Electrical Characteristics Unless otherwise specified: VCC=5V, Ta=25C, (SW)=5V Limits Num Parameter Symbol Conditions MIN | TYP MAX | Unit | Current dissipation ICC (SW) =SG1 1.8 3.0 | mA 2, Reference voltage VDD VDD terminal output voltage 4.00 4.10 4.20; V 3} Output line AVLI Output regulation of VO-~~V9 at 4 10; mV regulation VCC=4.5V~5.5V,(SW)=0V and 5V 4) Output load AVLD1]| (SW)=0V [sink current=ImA +5 +15| mV regulation and 5V(#L) | source current=I1mA -5 -15| mV 5] Output voltage VAO (SW)=5V 3.60 3.72 3.84 | V VAI (SW)=5V 3.02; 3.12} 3.22] V VA2 (SW)=5V 2.02 2.10 2.18 | V VA3 (SW)=5V L16/ 1.22) 1.28| V VA4 (SW)=5V 0.48 | 0.52] 0.56] V VBO (SW)=0V 0.48 | 0.52| 0.56| V VB1 (SW)=0V L07| 1.12] L17| V VB2 (SW)=0V 2.22 2.30 2.38 | V VB3 (SW)=0V 3.21 3.32 3.43 | V VB4 (SW)=0V 3.89 | 4.02| 4.15] V 6; COM output voltage VCOMH i (SW)=5V 4.9 Vv VCOML| (SW)=O0V 0.1/ V 7. SW input H voltage | VIH 2.0 V 8| SW input L voltage = [VIL 0.8| V 9| SW input H current [ITH (SW)=5V -0.1 0.0 0.1] wA 10| SWinput L current | IIL (SW)=0V -1.0 -0.4 uA 11; Output rising time tLH 3.0 6.0} ws 12) Output falling time tHL 3.0 6.0; ws 13| COM output rising time |tLHC | 1000pF load. 3.0 6.0| us 14, COM output falling time |tHLC | 1000pF load. 3.0 6.0| us (*1) Output regulation of VO~V4. (SG1) 5V M 64s 64 u s OVSHARP IROESIAG 8 Test Circuit 4.7uF Te, LILLY Cc) 19 18 17 16 (sw) O_C_ 11 15 +O) (VCC) LO 2 14 n 1000pF O 3 TOP VIEW 13 -}O 3 10 uF O 4 12 |) C 5 11 --O TheeSHARP IR3E3146 9 9 Package and packing specification [Applicability] This specification applies to IC package of the LEAD-FREE delivered as a standard specification. 1. Storage Conditions. 1-1.Storage conditions required before opening the dry packing. + Normal temperature : 5~40C * Normal humidity : 80%( Relative humidity) max. Humidity" means "Relative humidity" 1-2.Storage conditions required after opening the dry packing. In order to prevent moisture absorption after opening, ensure the following storage conditions apply: (1) Storage conditions for one-time soldering. (Convection reflow, IR/Convection reflow. ') + Temperature : 5~25C * Humidity : 60% max. * Period : 96 hours max. after opening. (2) Storage conditions for two-time soldering. (Convection reflow, IR/Convection reflow. ') a. Storage conditions following opening and prior to performing the 1st reflow. * Temperature : 5~25C * Humidity : 60% max. * Period : 96 hours max. after opening. b. Storage conditions following completion of the 1st reflow and prior to performing the 2nd reflow. Temperature : 5~25C * Humidity : 60% max. * Period : 96 hours max. after completion of the Ist reflow. "!: Air or nitrogen environment. 1-3. Temporary storage after opening. To re-store the devices before soldering, do so only once and use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using heat-sealing. The storage period, temperature and humidity must be as follows : (1) Storage temperature and humidity. 31 : External atmosphere temperature and humidity of the dry packing. First opening ~< x1 > Re-sealing Y Reopening X2 > Mounting 0 0 0 0 1 Temperature :5~40C 525 *%1 5~40T 5~25C Humidity : 80% max. ! 60% max. + 80% max. 60%. max. (2) Storage period. + X1+X2 : Refer to Section 1-2(1) and (2)a , depending on the mounting method. -Y : Two weeks max. 20040527SHARP IR3E3146 10 2. Baking Condition. (1) Situations requiring baking before mounting. * Storage conditions exceed the limits specified in Section 1-2 or 1-3. * Humidity indicator in the desiccant was already red (pink) when opened. ( Also for re-opening. ) (2) Recommended baking conditions. - Baking temperature and period : 120+ 10,//-0C for 2~3 hours. * The above baking conditions do not apply since the embossed carrier tape are not heat-resistant . Replace the devices on heat-resistant carrier . (3) Storage after baking. * After baking, store the devices in the environment specified in Section 1-2 and mount immediately. 3. Surface mount conditions. The following soldering condition are recommended to ensure device quality. 3-1.Soldering. (1) Convection reflow or IR/Convection. (one-time soldering or two-time soldering in air or nitrogen environment) - Temperature and period : A) Peak temperature. 250C max. B) Heating temperature. 40 to 60 seconds as 220C C) Preheat temperature. It is 150 to 200C, and is 12030 seconds D) Temperature increase rate. It is 1 to 3C/seconds * Measuring point : IC package surface. > Temperature profile : IC package surface temperature 20040527SHARP IR3E3146 aH 4. Condition for removal of residual flax. (1) Ultrasonic washing power : 25 watts / liter max. (2) Washing time : Total 1 minute max. (3) Solvent temperature : 15~40C 5. Package outline specification. Refer to the attached drawing. (Plastic body dimensions do include burr of resin.) The contents of LEAD-FREE TYPE application of the specifications. (*2) 6. Markings. 6-1.Marking details. (The information on the package should be given as follows.) (1) Productname : 35314 (2) Company name : SHARP (3) Date code (Example) Y M W LH, Denotes the production week. Denotes the production month. (1+ 2+ ~ +8+9-0*N-:D) Denotes the production year. (Last two digits of the year.) 6-2.Marking layout. The layout is shown in the attached drawing. (However, this layout does not specify the size of the marking character and marking position.) *2 The contents of LEAD-FREE TYPE application of the specifications. LEAD FINISH or LEAD-FREE TYPE BALL TYPE (Ni/Pd/Au) DATE CODE They are those with an underline under YMW The word of LEAD FREE is printed on the packing Printed label 20040527SHARP IR3E3146 12 (Note)It is those with an underline printing in a date code because of a LEAD-FREE type. 4.0+0.1 TOP VIEW UJ 3E314 _ Ly SHARP z F xf YMW q L| @ o ZA Hipin Index Te) 2 Oo 5 Sunn 5 is PO.5 =p. 0515) 54 2.0 O.32MIN. 0.42 Zz => N BOTTOM VIEW 3 ~ oO #15 #1 i DIMENSIONAL TOLERANCE UNLESS OTHERWISE SPECIFIED +0. 10 HQFNO20-P-0404-AA2268 LEAD FINISH LEAD MATERIAL LEAD TYPE Ni/Pd/Au PLATING Cu NAME HQFN020-P-0404 NOTE : Plastic body dimensions do include burr of resin. DRAWING NO. | AA2268 UNIT + mm 20040527SHARP IR3E3146 13 7.Packing specifications (Embossed carrier tape specifications) This standard applies to the embossed carrier tape specifications for ICs supplied by SHARP CORPORATION. SHARPs embossed carrier tape specifications are generally based on those described in JIS C 0806 (Japanese Industrial Standard) and EIA481A. 7-1.Tape structure The embossed carrier tape is made of conductive plastic. The embossed portions of the carrier tape are filled with IC packages and a top covering tape is used to enclose them. 7-2.Taping reel and embossed carrier tape size For the taping reel and embossed carrier tape sizes, refer to the attached drawing. 7-3.IC package enclosure direction in embossed carrier tape The IC package enclosure direction in the embossed portion relative to the direction in which the tape is pulled is indicated by an index mark on the package (indicating the No. 1 pin) shown in the attached drawing. 7-4.Missing IC packages in embossed carrier tape The number of missing IC packages in the embossed carrier tape per reel should not exceed Hither 1 or 0.1 % of the total contained on the tape per reel, whichever is larger. There should never be more than two consecutive missing IC packages. 7-5. Tape joints There is no joint in an embossed carrier tape. 7-6.Peeling strength of the top covering tape Peeling strength must meet the following conditions. (1) Peeling angle at 165~180 . (2) Peeling speed at 300mm min . (3) Peeling strength at 0.2~0.7N (20~70gf) . Top covering tape 165 ~180 Peeling direction tine - We II wy Fy YY Ne a / i ae, i = Sf, tw *. = + Drawing direction Embossed carrier tape ee 20040527SHARP IR3E3146 14 7-7. Packing (1) The top covering tape (leader side) at the leading edge of the embossed carrier tape, and the trailing edge of the embossed carrier tape, should both be held in place with paper adhesive tape at least 30 mm in length. (2) The leading and trailing edges of the embossed carrier tape should be left empty (with embossed portions not filled with IC packages) in the attached drawing. (3) The number of IC packages enclosed in the embossed carrier tape per reel should generally comply with the list given below. Number of IC Packages/ Number of IC Packages/ Number of IC Packages/ Reel Inner carton Outer carton 2500 devices / Reel 2500 devices / Inner carton 12500 devices / Outer carton 7-8.Indications The following should be indicated on the taping reel and the packing carton. - Part Number (Product Name) + Storage Quantity - Packed date - Manufactures Name ( SHARP ) Note : The IC taping direction is indicated by" EL" suffixed to the part number . EL : Equivalent to" L" of the JIS C 0806 standard.. 7-9.Protection during transportation The IC packages should have no deformation and deterioration of their electrical Characteristics resulting from transportation. 8.Precautions for use. (1) Opening must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment. (2) The devices should be mounted the devices within one year of the date of delivery. 20040527SHARP IR3E3146 15 EMBOSS TAPING TYPE CEL ) | IC TAPING DIRECTION | THE DRAWING DIRECTION OF TAPE [LEADER SIDE AND END SIDE OF TAPE | ADHESIVE TAPECPAPER) EMPTY EMBOSS ADHESIVE TAPECPAPER) 30 mm MIN. FILLED EMBOSSCWITH IC PACKAGE) 30 mm NIN. , . ) wn MIN. : roccod/cobob/foocooffoooccc} 3 - END SIDE - : ; ' i 1 STA j ain } '" (LEADER. SIDE. ' ; RIER TAPE , CARRIER TAPE ' 8 Gmm MIN. | 500mm MIN. 1 a ' "TOP COVER TAPE 200mm MIN. Li} igz NAME Emboss taping type (EL) NOTE wn DRAWING NO. + CV522 | UNIT mm 2004052716 IR3E3146 SHARP 4 2020.1 We n~_| (6p Section A~A 4.20+0.1 \ - A | 6.3020.05 (1.1) et be 170401 Section B-B Note 1) The radius (R) is 0.3mm max 2) Cumulative tolercnce of 10 pitches of the sprocket hole is +0.2r-m as NOTE EC20-0404VQNSS mm HUE UNIT CV883 DRAWING NO. 20040527SHARP TR3E3146 17 +3 -0 100+1 33041 | P1004) _ 33041 SIZE Y SIZE Y 8mm a5 32mm 33.5 lemnm 13.5 44mm 43.5 16mm 17.5 36mm 37.5 24mm 25.9 Bf | 8% NAME _' Reel for embossed carrier tape] NOTE BL | DRAWING NO. 1 CV755 | UNIT * mm 20040527SHARP IR3E3146 18 Cushion pad Embossed carrier tape with reel Inner carton label Laminated aluminum bag Cushion pad Inner carton L W H Inner carton - Outer dimensions : : 345 x 345 & 55 AER! as NAME ' Packing specifications (1) | NOTE Bip | DRAWING NO, : CV428 UNIT mm 20040527SHARP TR3E3146 19 Inner carton \ Inner carton label BDBDBCGQUWW' Qs ERY NY YQ SDM Adhesive tape ( H taping ) JS Outer carton label Outer carton LLL LL Inner carton Outer dimensions : 345 345 X 55 Quter carton Outer dimensions : 365 & 315 Xx 385 L W H es Ha O ROB, ARE RRS LT EBHVIET, NOTE There is a possibility different from this specification] ARs NAME Packing specifications (2) ME | DRAWING NO. | BJ426 | UNIT + mm when the number of shipments is fractions. 20040527SHARP TR3E3146 (Note) The <LEAD-FREE> display shows a lead-free article. Inner carton label IR3E3146 |e eh) Ovary Quantity PD lot Company code Part No. (SHARP) 2500 7 (3N)1 1R3E3146 < LEAD-FREE > Quantity (3N) 2 2500 XXXXXXXXXXXX 103120 ee ly! R3E3146/EL/ AAT i VYYY. MM. DD TYPE: A Packed ae SHARP MADE IN JAPAN EIAd C-3 <RMK> XXXXXXXXXXXXXXXXX Packed dave | The country of origin | Assembly management No. | (It displays, when the country lof origin is Japan.) Outer carton label Part No. The country of origin (It displays, when the country lof origin is Japan. ) < LEAD-FREE > (SHARP) (Q) QUANTITY : 12500 MADE IN JAPAN Product nand XXXXXXXXXXXX =| (4S) PKG ID: IR3E3146/EL/ cin / YYYY. MM. DD (P) CUST PROD ID : IR3E3146 wT iii | SHARP Packed date (Former) ElAJ B Standard conforming 20040527