TLV62084ADSGT - TEXAS INSTRUMENTS

October, 2013 − Rev. 0 1Publication Order Number:

MBR830MFS/D

MBR830MFS, NRVB830MFS

SWITCHMODE

Power Rectifiers

These state−of−the−art devices have the following features:

Features

•Low Power Loss / High Efficiency

•New Package Provides Capability of Inspection and Probe After

Board Mounting

•Guardring for Stress Protection

•Low Forward Voltage

•150°C Operating Junction Temperature

•Wettable Flacks Option Available

•NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These are Pb−Free and Halide−Free Devices

Mechanical Characteristics:

•Case: Epoxy, Molded

•Lead Finish: 100% Matte Sn (Tin)

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

•Device Meets MSL 1 Requirements

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

VR30

Average Rectified Forward Current

(Rated VR, TC = 143°C) IF(AV) 8.0 A

Peak Repetitive Forward Current,

(Rated VR, Square Wave,

20 kHz, TC = 143°C)

IFRM 16 A

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load

Conditions Halfwave, Single

Phase, 60 Hz)

IFSM 150 A

Storage Temperature Range Tstg −65 to +150 °C

Operating Junction Temperature TJ−40 to +150 °C

Unclamped Inductive Switching

Energy (10 mH Inductor,

Non−repetitive)

EAS 100 mJ

ESD Rating (Human Body Model) 3B

ESD Rating (Machine Model) M4

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

NOTE: The heat generated must be less than the thermal conductivity from

Junction−to−Ambient: dPD/dTJ < 1/RJA.

SCHOTTKY BARRIER

RECTIFIERS

8 AMPERES

30 VOLTS

http://onsemi.com

1,2,3 5,6

SO−8 FLAT LEAD

CASE 488AA

STYLE 2

MARKING

DIAGRAM

B830

AYWZZ

Not Used

B830 = Specific Device Code

A = Assembly Location

Y = Year

W = Work Week

ZZ = Lot Traceability

Device Package Shipping†

ORDERING INFORMATION

MBR830MFST1G SO−8 FL

(Pb−Free) 1500 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MBR830MFST3G SO−8 FL

(Pb−Free) 5000 /

Tape & Reel

NRVB830MFST1G SO−8 FL

(Pb−Free) 1500 /

Tape & Reel

NRVB830MFST3G SO−8 FL

(Pb−Free) 5000 /

Tape & Reel

MBR830MFS, NRVB830MFS

http://onsemi.com

THERMAL CHARACTERISTICS

Characteristic Symbol Typ Max Unit

Thermal Resistance, Junction−to−Case, Steady State

(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) RθJC − 2.0 °C/W

ELECTRICAL CHARACTERISTICS

Instantaneous Forward Voltage (Note 1)

(iF = 8 Amps, TJ = 125°C)

(iF = 8 Amps, TJ = 25°C)

vF0.44

0.50 0.57

0.70

Instantaneous Reverse Current (Note 1)

(Rated dc Voltage, TJ = 125°C)

(Rated dc Voltage, TJ = 25°C)

iR15

0.020 50

0.200

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.

TYPICAL CHARACTERISTICS

0.1

1.0

100

0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.901.0

0.1

100

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8

Figure 1. Typical Instantaneous Forward

Characteristics Figure 2. Maximum Instantaneous Forward

Characteristics

VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)

Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics

VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)

151050

1.E−10 30151050

iF, INSTANTANEOUS FORWARD

CURRENT (A)

iF, INSTANTANEOUS FORWARD

CURRENT (A)

IR, INSTANTANEOUS REVERSE CURRENT (A)

125°C

150°C

25°C−40°C

125°C

150°C

25°C−40°C

1.E−09

1.E−08

1.E−07

1.E−06

1.E−05

1.E−04

1.E−03

1.E−02

1.E−01

1.E+00

IR, INSTANTANEOUS REVERSE CURRENT (A)

TA = 150°C

TA = 125°C

TA = 25°C

TA = −40°C

TA = 150°C

TA = 125°C

TA = 25°C

TA = −40°C

1.E−09

1.E−08

1.E−07

1.E−06

1.E−05

1.E−04

1.E−03

1.E−02

1.E−01

1.E+00

302520 2520

MBR830MFS, NRVB830MFS

http://onsemi.com

TYPICAL CHARACTERISTICS

0.001

0.01

0.1

100

0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000

60 80 100 120 140 160

100

1000

10000

0 5 10 15 20 25 30

Figure 5. Typical Junction Capacitance Figure 6. Current Derating TO−220AB

VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C)

Figure 7. Forward Power Dissipation

IF(AV), AVERAGE FORW ARD CURRENT (A)

43210

Figure 8. Thermal Response

PULSE TIME (sec)

C, JUNCTION CAPACITANCE (pF)

IF(AV), AVERAGE FORW ARD

CURRENT (A)

PF(AV), AVERAGE FORWARD

POWER DISSIPATION (W)

R(t) (°C/W)

TJ = 25°CRqJC = 2.0°C/W

Square Wave

TJ = 150°C

Square Wave

IPK/IAV = 20

IPK/IAV = 10

IPK/IAV = 5

Single Pulse

50% Duty Cycle

20%

10%

Assumes 25°C ambient and soldered to

a 600 mm2 − oz copper pad on PCB

MBR830MFS, NRVB830MFS

http://onsemi.com

PACKAGE DIMENSIONS

DFN6 5x6, 1.27P

(SO8 FL)

CASE 488AA

ISSUE H

M3.00 3.40

q0 −−−

3.80

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION D1 AND E1 DO NOT INCLUDE

MOLD FLASH PROTRUSIONS OR GATE

BURRS.

1234

TOP VIEW

SIDE VIEW

BOTTOM VIEW

E1 q

0.20 C

2 X

DIM MIN NOM

MILLIMETERS

A0.90 1.00

A1 0.00 −−−

b0.33 0.41

c0.23 0.28

D5.15 BSC

D1 4.70 4.90

D2 3.80 4.00

E6.15 BSC

E1 5.70 5.90

E2 3.45 3.65

e1.27 BSC

G0.51 0.61

K1.20 1.35

L0.51 0.61

L1 0.05 0.17

0.10 C

DETAIL A

e/2

A0.10 B

0.05 cL

DETAIL A

3 X

4 X

SEATING

PLANE

MAX

1.10

0.05

0.51

0.33

5.10

4.20

6.10

3.85

0.71

1.50

0.71

0.20

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.270

0.750

1.000

0.905

0.475

4.530

1.530

4.560

0.495

3.200

1.330

0.965

3X 4X

PIN 5

(EXPOSED PAD)

STYLE 2:

PIN 1. ANODE

2. ANODE

3. ANODE

4. NO CONNECT

5. CATHODE

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UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBR830MFS/D

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