PCF8591T - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1998 Jul 02

File under Integrated Circuits, IC12

2001 Dec 13

INTEGRATED CIRCUITS

PCF8591

8-bit A/D and D/A converter

2001 Dec 13 2

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

CONTENTS

1 FEATURES

2 APPLICATIONS

3 GENERAL DESCRIPTION

4 ORDERING INFORMATION

5 BLOCK DIAGRAM

6 PINNING

7 FUNCTIONAL DESCRIPTION

7.1 Addressing

7.2 Control byte

7.3 D/A conversion

7.4 A/D conversion

7.5 Reference voltage

7.6 Oscillator

8 CHARACTERISTICS OF THE I2C-BUS

8.1 Bit transfer

8.2 Start and stop conditions

8.3 System configuration

8.4 Acknowledge

8.5 I2C-bus protocol

9 LIMITING VALUES

10 HANDLING

11 DC CHARACTERISTICS

12 D/A CHARACTERISTICS

13 A/D CHARACTERISTICS

14 AC CHARACTERISTICS

15 APPLICATION INFORMATION

16 PACKAGE OUTLINES

17 SOLDERING

17.1 Introduction

17.2 DIP

17.2.1 Soldering by dipping or by wave

17.2.2 Repairing soldered joints

17.3 SO

17.3.1 Reflow soldering

17.3.2 Wave soldering

17.3.3 Repairing soldered joints

18 DEFINITIONS

19 LIFE SUPPORT APPLICATIONS

20 PURCHASE OF PHILIPS I2C COMPONENTS

2001 Dec 13 3

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

1 FEATURES

•Single power supply

•Operating supply voltage 2.5 V to 6 V

•Low standby current

•Serial input/output via I2C-bus

•Address by 3 hardware address pins

•Sampling rate given by I2C-bus speed

•4 analog inputs programmable as single-ended or

differential inputs

•Auto-incremented channel selection

•Analog voltage range from VSS to VDD

•On-chip track and hold circuit

•8-bit successive approximation A/D conversion

•Multiplying DAC with one analog output.

2 APPLICATIONS

•Closed loop control systems

•Low power converter for remote data acquisition

•Battery operated equipment

•Acquisition of analog values in automotive, audio and

TV applications.

3 GENERAL DESCRIPTION

The PCF8591 is a single-chip, single-supply low power

8-bit CMOS data acquisition device with four analog

inputs, one analog output and a serial I2C-bus interface.

Three address pins A0, A1 and A2 are used for

programming the hardware address, allowing the use of

up to eight devices connected to the I2C-bus without

additionalhardware.Address,controlanddatatoandfrom

the device are transferred serially via the two-line

bidirectional I2C-bus.

The functions of the device include analog input

multiplexing, on-chip track and hold function, 8-bit

analog-to-digital conversion and an 8-bit digital-to-analog

conversion. The maximum conversion rate is given by the

maximum speed of the I2C-bus.

4 ORDERING INFORMATION

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

PCF8591P DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

PCF8591T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

2001 Dec 13 4

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

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5 BLOCK DIAGRAM

Fig.1 Block diagram.

2001 Dec 13 5

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

6 PINNING

SYMBOL PIN DESCRIPTION

AINO 1

analog inputs

(A/D converter)

AIN1 2

AIN2 3

AIN3 4

A0 5 hardware addressA1 6

A2 7

VSS 8 negative supply voltage

SDA 9 I2C-bus data input/output

SCL 10 I2C-bus clock input

OSC 11 oscillator input/output

EXT 12 external/internal switch for oscillator

input

AGND 13 analog ground

VREF 14 voltage reference input

AOUT 15 analog output (D/A converter)

VDD 16 positive supply voltage Fig.2 Pinning diagram.

2001 Dec 13 6

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

7 FUNCTIONAL DESCRIPTION

7.1 Addressing

EachPCF8591deviceinanI2C-bussystemisactivatedby

sending a valid address to the device. The address

consists of a fixed part and a programmable part.

The programmable part must be set according to the

address pins A0, A1 and A2. The address always has to

be sent as the first byte after the start condition in the

I2C-bus protocol. The last bit of the address byte is the

read/write-bit which sets the direction of the following data

transfer (see Figs 3, 15 and 16).

Fig.3 Address byte.

7.2 Control byte

The second byte sent to a PCF8591 device will be stored

in its control register and is required to control the device

function.

Theuppernibbleof the controlregisterisused for enabling

the analog output, and for programming the analog inputs

as single-ended or differential inputs. The lower nibble

selects one of the analog input channels defined by the

upper nibble (see Fig.4). If the auto-increment flag is set

the channel number is incremented automatically after

each A/D conversion.

If the auto-increment mode is desired in applications

where the internal oscillator is used, the analog output

enable flag in the control byte (bit 6) should be set. This

allows the internal oscillator to run continuously, thereby

preventing conversion errors resulting from oscillator

start-updelay. The analogoutput enable flagmay be reset

at other times to reduce quiescent power consumption.

The selection of a non-existing input channel results in the

highest available channel number being allocated.

Therefore, if the auto-increment flag is set, the next

selected channel will be always channel 0. The most

significant bits of both nibbles are reserved for future

functions and have to be set to 0. After a Power-on reset

condition all bits of the control register are reset to 0.

TheD/Aconverterandtheoscillatoraredisabledforpower

saving.Theanalogoutputisswitchedtoahigh-impedance

state.

2001 Dec 13 7

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

Fig.4 Control byte.

2001 Dec 13 8

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

7.3 D/A conversion

The third byte sent to a PCF8591 device is stored in the

DAC data register and is converted to the corresponding

analog voltage using the on-chip D/A converter. This D/A

converter consists of a resistor divider chain connected to

the external reference voltage with 256 taps and selection

switches. The tap-decoder switches one of these taps to

the DAC output line (see Fig.5).

The analog output voltage is buffered by an auto-zeroed

unity gain amplifier. This buffer amplifier may be switched

on or off by setting the analog output enable flag of the

control register. In the active state the output voltage is

held until a further data byte is sent.

The on-chip D/A converter is also used for successive

approximation A/D conversion. In order to release the

DAC for an A/D conversion cycle the unity gain amplifier is

equippedwithatrack and holdcircuit.Thiscircuit holds the

output voltage while executing the A/D conversion.

The output voltage supplied to the analog output AOUT is

given by the formula shown in Fig.6. The waveforms of a

D/A conversion sequence are shown in Fig.7.

Fig.5 DAC resistor divider chain.

2001 Dec 13 9

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

Fig.6 DAC data and DC conversion characteristics.

Fig.7 D/A conversion sequence.

2001 Dec 13 10

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

7.4 A/D conversion

The A/D converter makes use of the successive

approximation conversion technique. The on-chip D/A

converter and a high-gain comparator are used

temporarily during an A/D conversion cycle.

An A/D conversion cycle is always started after sending a

valid read mode address to a PCF8591 device. The A/D

conversion cycle is triggered at the trailing edge of the

acknowledge clock pulse and is executed while

transmitting the result of the previous conversion (see

Fig.8).

Once a conversion cycle is triggered an input voltage

sample of the selected channel is stored on the chip and is

convertedtothecorresponding8-bitbinarycode. Samples

picked up from differential inputs are converted to an 8-bit

two’s complement code (see Figs 9 and 10).

The conversion result is stored in the ADC data register

and awaits transmission. If the auto-increment flag is set

the next channel is selected.

The first byte transmitted in a read cycle contains the

conversion result code of the previous read cycle. After a

Power-on reset condition the first byte read is a

hexadecimal 80. The protocol of an I2C-bus read cycle is

shown in Chapter 8, Figs 15 and 16.

The maximum A/D conversion rate is given by the actual

speed of the I2C-bus.

Fig.8 A/D conversion sequence.

2001 Dec 13 11

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

Fig.9 A/D conversion characteristics of single-ended inputs.

Fig.10 A/D conversion characteristics of differential inputs.

2001 Dec 13 12

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

7.5 Reference voltage

For the D/A and A/D conversion either a stable external

voltage reference or the supply voltage has to be applied

to the resistor divider chain (pins VREF and AGND).

The AGND pin has to be connected to the system analog

ground and may have a DC off-set with reference to VSS.

A low frequency may be applied to the VREF and AGND

pins. This allows the use of the D/A converter as a

one-quadrant multiplier; see Chapter 15 and Fig.6.

The A/D converter may also be used as a one or two

quadrant analog divider. The analog input voltage is

dividedby thereference voltage.The resultis convertedto

a binary code. In this application the user has to keep the

reference voltage stable during the conversion cycle.

7.6 Oscillator

An on-chip oscillator generates the clock signal required

for the A/D conversion cycle and for refreshing the

auto-zeroedbuffer amplifier. When using thisoscillator the

EXT pin has to be connected to VSS. At the OSC pin the

oscillator frequency is available.

If the EXT pin is connected to VDD the oscillator output

OSC is switched to a high-impedance state allowing the

user to feed an external clock signal to OSC.

2001 Dec 13 13

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

8 CHARACTERISTICS OF THE I2C-BUS

The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data

line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data

transfer may be initiated only when the bus is not busy.

8.1 Bit transfer

One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period

of the clock pulse as changes in the data line at this time will be interpreted as a control signal.

Fig.11 Bit transfer.

handbook, full pagewidth

MBC621

data line

stable;

data valid

change

of data

allowed

SDA

SCL

8.2 Start and stop conditions

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the

clock is HIGH, is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH, is

defined as the stop condition (P).

Fig.12 Definition of START and STOP condition.

handbook, full pagewidth

MBC622

SDA

SCL P

STOP condition

SDA

SCL

START condition

8.3 System conﬁguration

A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls

the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’.

2001 Dec 13 14

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

MBA605

MASTER

TRANSMITTER /

RECEIVER SLAVE

TRANSMITTER /

RECEIVER MASTER

TRANSMITTER MASTER

TRANSMITTER /

RECEIVER

SDA

SCL

Fig.13 System configuration.

8.4 Acknowledge

The number of data bytes transferred between the start and stop conditions from transmitter to receiver is not limited.

Each data byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by

the transmitter whereas the master also generates an extra acknowledge related clock pulse. A slave receiver which is

addressed must generate an acknowledge after the reception of each byte. Also a master must generate an

acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that

acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW

during the HIGH period of the acknowledge related clock pulse. A master receiver must signal an end of data to the

transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the

transmitter must leave the data line HIGH to enable the master to generate a stop condition.

Fig.14 Acknowledgement on the I2C-bus.

handbook, full pagewidth

MBC602

START

condition

9821

clock pulse for

acknowledgement

not acknowledge

acknowledge

DATA OUTPUT

BY TRANSMITTER

DATA OUTPUT

BY RECEIVER

SCL FROM

MASTER

2001 Dec 13 15

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

8.5 I2C-bus protocol

After a start condition a valid hardware address has to be sent to a PCF8591 device. The read/write bit defines the

direction of the following single or multiple byte data transfer. For the format and the timing of the start condition (S), the

stop condition (P) and the acknowledge bit (A) refer to the I2C-bus characteristics. In the write mode a data transfer is

terminated by sending either a stop condition or the start condition of the next data transfer.

Fig.15 Bus protocol for write mode, D/A conversion.

Fig.16 Bus protocol for read mode, A/D conversion.

2001 Dec 13 16

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

9 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

10 HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is

desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under

“Handling MOS Devices”

SYMBOL PARAMETER MIN. MAX. UNIT

VDD supply voltage (pin 16) −0.5 +8.0 V

VIinput voltage (any input) −0.5 VDD + 0.5 V

IIDC input current −±10 mA

IODC output current −±20 mA

IDD, ISS VDD or VSS current −±50 mA

Ptot total power dissipation per package −300 mW

POpower dissipation per output −100 mW

Tamb operating ambient temperature −40 +85 °C

Tstg storage temperature −65 +150 °C

2001 Dec 13 17

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

11 DC CHARACTERISTICS

VDD = 2.5 V to 6 V; VSS =0V; T

amb =−40 °Cto+85 °C unless otherwise speciﬁed.

Notes

1. The power on reset circuit resets the I2C-bus logic when VDD is less than VPOR.

2. A further extension of the range is possible, if the following conditions are fulfilled:

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VDD supply voltage (operating) 2.5 −6.0 V

IDD supply current

standby VI=V

SS or VDD; no load −115µA

operating, AOUT off fSCL = 100 kHz −125 250 µA

operating, AOUT active fSCL = 100 kHz −0.45 1.0 mA

VPOR Power-on reset level note 1 0.8 −2.0 V

Digital inputs/output: SCL, SDA, A0, A1, A2

VIL LOW level input voltage 0 −0.3 ×VDD V

VIH HIGH level input voltage 0.7 ×VDD −VDD V

ILleakage current

A0, A1, A2 VI=V

SS to VDD −250 −+250 nA

SCL, SDA VI=V

SS to VDD −1−+1 µA

Ciinput capacitance −−5pF

OL LOW level SDA output current VOL = 0.4 V 3.0 −−mA

Reference voltage inputs

VREF reference voltage VREF >V

AGND; note 2 VSS + 1.6 −VDD V

VAGND analog ground voltage VREF >V

AGND; note 2 VSS −VDD −0.8 V

ILI input leakage current −250 −+250 nA

RREF input resistance pins VREF and AGND −100 −kΩ

Oscillator: OSC, EXT

ILI input leakage current −−250 nA

fOSC oscillator frequency 0.75 −1.25 MHz

VREF VAGND

-------------------------------------- 0.8V≥VDD VREF VAGND

--------------------------------------

–0.4V≥,

2001 Dec 13 18

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

12 D/A CHARACTERISTICS

VDD = 5.0 V; VSS =0V;V

REF = 5.0 V; VAGND =0V;R

L=10kΩ;C

L= 100 pF; Tamb =−40 °C to +85 °C unless otherwise

speciﬁed.

13 A/D CHARACTERISTICS

VDD = 5.0 V; VSS =0V; V

REF = 5.0 V; VAGND =0V; R

S=10kΩ; Tamb =−40 °C to +85 °C unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Analog output

VOA output voltage no resistive load VSS −VDD V

RL=10kΩV

SS −0.9 ×VDD V

ILO output leakage current AOUT disabled −−250 nA

Accuracy

OSeoffset error Tamb =25°C−−50 mV

Lelinearity error −−±1.5 LSB

Gegain error no resistive load −−1%

DAC settling time to 1⁄2LSB full scale step −−90 µs

fDAC conversion rate −−11.1 kHz

SNRR supply noise rejection ratio f = 100 Hz;

VDDN = 0.1 ×VPP

−40 −dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Analog inputs

VIA analog input voltage VSS −VDD V

ILIA analog input leakage current −−100 nA

CIA analog input capacitance −10 −pF

CID differential input capacitance −10 −pF

VIS single-ended voltage measuring range VAGND −VREF V

VID differential voltage measuring range;

VFS =V

REF −VAGND

−V

Accuracy

OSeoffset error Tamb =25°C−−20 mV

Lelinearity error −−±1.5 LSB

Gegain error −−1%

GSesmall-signal gain error ∆Vi= 16 LSB −−5%

CMRR common-mode rejection

ratio −60 −dB

SNRR supply noise rejection ratio f = 100 Hz;

VDDN = 0.1 ×VPP

−40 −dB

tADC conversion time −−90 µs

fADC sampling/conversion rate −−11.1 kHz

VFS

–2

------------- +VFS

--------------

2001 Dec 13 19

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

(b) External oscillator.

Fig.17 Operating supply current as a function of supply voltage (analog output disabled).

(a) Internal oscillator; Tamb = +27 °C.

(a) Output impedance near negative power rail; Tamb = +27 °C. (b) Output impedance near positive power rail; Tamb = +27 °C.

Fig.18 Output impedance of analog output buffer (near power rails).

The x-axis represents the hex input-code equivalent of the output voltage.

2001 Dec 13 20

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

14 AC CHARACTERISTICS

All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and

VIH with an input voltage swing of VSS to VDD.

Note

1. A detailed description of the I2C-bus specification, with applications, is given in brochure

“The I

C-bus and how to

use it”

. This brochure may be ordered using the code 9398 393 40011.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

I2C-bus timing (see Fig.19; note 1)

fSCL SCL clock frequency −−100 kHz

tSP tolerable spike width on bus −−100 ns

tBUF bus free time 4.7 −−µs

SU;STA START condition set-up time 4.7 −−µs

HD;STA START condition hold time 4.0 −−µs

LOW SCL LOW time 4.7 −−µs

HIGH SCL HIGH time 4.0 −−µs

rSCL and SDA rise time −−1.0 µs

tfSCL and SDA fall time −−0.3 µs

tSU;DAT data set-up time 250 −−ns

tHD;DAT data hold time 0 −−ns

tVD;DAT SCL LOW-to-data out valid −−3.4 µs

tSU;STO STOP condition set-up time 4.0 −−µs

Fig.19 I2C-bus timing diagram; rise and fall times refer to VIL and VIH.

handbook, full pagewidth

PROTOCOL

SCL

SDA

MBD820

BIT 0

LSB

(R/W)

tHD;STA tSU;DAT tHD;DAT tVD;DAT tSU;STO

tBUF

tSU;STA tLOW tHIGH 1 / fSCL

START

CONDITION

(S)

BIT 7

MSB

(A7)

BIT 6

(A6) ACKNOWLEDGE

(A) STOP

CONDITION

(P)

2001 Dec 13 21

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

15 APPLICATION INFORMATION

Inputs must be connected to VSS or VDD when not in use. Analog inputs may also be connected to AGND or VREF.

In order to prevent excessive ground and supply noise and to minimize cross-talk of the digital to analog signal paths the

user has to design the printed-circuit board layout very carefully. Supply lines common to a PCF8591 device and noisy

digital circuits and ground loops should be avoided. Decoupling capacitors (>10 µF) are recommended for power supply

and reference voltage inputs.

Fig.20 Application diagram.

2001 Dec 13 22

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

16 PACKAGE OUTLINES

UNIT A

max. 1 2 b1cEe M

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1 95-01-19

99-12-27

min. A

max. bmax.

1.40

1.14

0.055

0.045

0.53

0.38 0.32

0.23 21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15 0.021

0.015 0.013

0.009 0.010.100.0200.19

050G09 MO-001 SC-503-16

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D(1)

DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

2001 Dec 13 23

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 10.5

10.1 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.41

0.40 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

97-05-22

99-12-27

2001 Dec 13 24

Philips Semiconductors Product speciﬁcation

8-bit A/D and D/A converter PCF8591

17 SOLDERING

17.1 Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

Thistextgivesa very briefinsighttoa complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

17.2 DIP

17.2.1 SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

17.2.2 REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between300 and 400 °C, contact may be up to 5 seconds.

17.3 SO

17.3.1 REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

tothe printed-circuit boardby screenprinting, stencillingor

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

17.3.2 WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

•The longitudinal axis of the package footprint must be

parallel to the solder flow.

•Thepackagefootprintmustincorporatesolderthievesat

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

17.3.3 REPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

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18 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS(1) PRODUCT

STATUS(2) DEFINITIONS

Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data Qualiﬁcation This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Changes will be

communicated according to the Customer Product/Process Change

Notiﬁcation (CPCN) procedure SNW-SQ-650A.

19 DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseor at anyotherconditions above thosegiven in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarrantythatsuchapplicationswillbe

suitable for the specified use without further testing or

modification.

20 DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingorsellingtheseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

theuseofanyofthese products, conveys nolicenceortitle

under any patent, copyright, or mask work right to these

products,andmakes norepresentations or warrantiesthat

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

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21 PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the

components in the I2C system provided the system conforms to the I2C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

2001 Dec 13 27

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NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Philips Semiconductors – a worldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands 403512/05/pp28 Date of release: 2001 Dec 13 Document order number: 9397 750 09201