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DeltaBond™ 156
DeltaBond™ 155
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
DELTABOND™156
Ordering Guide - Resin and Hardener
Resin Hardener
Part No. Container Part Number
DeltaBond™ 156 156-K
DELTABOND™155
Mixing Proportions and Working Properties
Parts of hardener per 100 parts of resin by volume 100
*Working Time - at 77°F 90 min
†Initial cure time 77°F 8 hrs
150°F 45 min
250°F 20 min
‡Post-cure time at a temp in °F 4 hrs @ 200°F
‡Alternate room temp. aging time at 77°F 4 days
Working consistency (77°F) paste
Working viscosity (77°F) cps paste
DELTABOND™155
Ordering Guide - Resin and Hardener
Resin Hardener
Part No. Container Part Number
DeltaBond™ 155 155 Kit (3 oz resin, 3 oz hardener) Included in P/N 155
DELTABOND™155
Characteristics
Typical Properties Fully Cured
Thermal conductivity -
W/(m) (°K) 0.836
(Btu) (in.)/(hr) (ft2) (°F) 5.8
Thermal resistivity - (°C) (in.)watt 47
Bond shear strength 77°F 2,600
1 in. overlap - psi 125°F —
etched aluminum to
etched aluminum 212°F —
Heat distortion point - °F 130
Minimum dielectric strength,
v/mil, 0.125 in. sample 400
Max operation Continuous 65
temp - °C Intermittent 100
DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread
thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal expansion comparable to that of
copper and aluminum. This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and
between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves as an electrical
insulator. Its strong bond to a wide variety of substrates resists severe temperature cycling. DeItaBond™ 155 is only
available in kit size. Simply squeeze out equal lengths and mix to uniform color. Shelf life: 1 year.
DeltaBond™ 156 Thermally Conductive Adhesive is a modified acrylic adhesive designed for permanent mounting on
components where heat must be effectively transmitted. Recommended for electromechanical assemblies to bond com-
ponents and dissipate heat, it replaces mechanical fasteners and compressible pads, silicone grease, and epoxies; elimi-
nates air entrapment, and other variables related to epoxy mixing. This soft paste requires no mixing and flows easily to
allow thin bond lines. Primer activated, cure begins upon assembly. DeltaBond™ Activator fixtures at room temperature
in less than 5 minutes. Full strength is developed in 4 to 12 hours and fillets become dry to the touch in 24 hours. It is
not recommended to use this durable adhesive without the use of DeltaBond™ Activator. DeltaBond™ 156 is available in
kit size; order 156-K (25 ml Syringe and Activator Kit). Shelf life: 1 year.
DELTABOND™156
Characteristics
Typical Properties Fully Cured
Test Results ASTM
Temperature Range -65 to 300°F
(-54 to 149°C)
300°F to (177°C)
Intermittent
Tensile Strength, at break 2360 psi D638
Modulus 233,000 psi D638
Elongation, at break 7.75% D638
Outgassing 2.5% TLM E595
0.05% CVCM
Coefficient of Thermal Expansion 7.1 x 10 -4 (cm/cm° C)
Tensile Shear 2500psi D1002
Thermal Conductivity, K 3.47 Btu x in./hr ft2°F
(absolute at 86°F (30°C) (0.50 W/m °C)
DELTABOND™156
Typical Electrical Properties
Test Results ASTM
Dielectric Strength 220 volts/mil D149
Dielectric
Constant, 77°F (25°C)
D150
100 Hz 14.92
1000 Hz 14.26
1MM Hz 12.34
Dissipaton Factor, 77°F (25°C)
D150
100 Hz 0.05
1000 Hz 0.03
1MM Hz 0.06
Volume Resistivity
5.2x1011 (ohms-cm)
D257
Surface Resistivity
8.6 x 1013 (ohms)
D257
Description
Note: The absolute thermal conductivity test was developed specifi cally
for measuring thermal properties of thin film adhesive bonds.
Note: DeltaBond™ Thermally Conductive Adhesive-High Strength
contains a metallic filler which, in certain applications, may have an
effect on electrical properties. Therefore, test each particular appli-
cation to ensure that electrical properties are as required.
Resin Kit Hardener Syringe - 0.85 fl oz - 25 ml - 2 oz
net/0.44 oz fl contents bottle -12ml
Included in kit hardener with brush applicator -
4.2 oz total wt/kt
* Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A—200 gms,
B—200 gms. Larger batch sizes will greatly reduce working time.
† After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to
achieve full physical and electrical properties.
‡ After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same
full properties.
The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk,
conditions of use being beyond our control.
Hardener Type
DeltaBond™155
Model
Number
Model
Number