1
FEATURES
DBV PACKAGE
(TOP VIEW)
1
2
3
5
4
IN−
VCC−/GND
IN+
VCC
OUT
DESCRIPTION/ORDERING INFORMATION
TL331
www.ti.com
......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008
SINGLE DIFFERENTIAL COMPARATOR
•Single Supply or Dual Supplies•Wide Range of Supply Voltage . . . 2 V to 36 V•Low Supply-Current Drain Independent ofSupply Voltage . . . 0.4 mA Typ•Low Input Bias Current . . . 25 nA Typ•Low Input Offset Voltage . . . 2 mV Typ•Common-Mode Input Voltage Range IncludesGround
•Differential Input Voltage Range Equal toMaximum-Rated Supply Voltage . . . ± 36 V•Low Output Saturation Voltage•Output Compatible With TTL, MOS, and CMOS
This device consists of a single voltage comparator that is designed to operate from a single power supply over awide range of voltages. Operation from dual supplies also is possible if the difference between the two suppliesis 2 V to 36 V and V
CC
is at least 1.5 V more positive than the input common-mode voltage. Current drain isindependent of the supply voltage. The output can be connected to other open-collector outputs to achievewired-AND relationships.
ORDERING INFORMATION
(1)
V
IO
(max)T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)AT 25 ° C
Reel of 3000 TL331IDBVR– 40 ° C to 85 ° C 5 mV SOT-23 – DBV T1I_Reel of 250 TL331IDBVTReel of 3000 TL331KDBVR– 40 ° C to 105 ° C 5 mV SOT-23 – DBV T1K_Reel of 250 TL331KDBVT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(3) The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
IN+
IN− OUT
80-µA
Current Regulator
80 µA
60 µA10 µA
VCC
10 µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
COMPONENT COUNT
1
2
1
20
ABSOLUTE MAXIMUM RATINGS
(1)
TL331
SLVS238F – AUGUST 1999 – REVISED JULY 2008 .........................................................................................................................................................
www.ti.com
LOGIC DIAGRAM
SCHEMATIC
Note: Current values shown are nominal.
over operating free-air temperature range (unless otherwise noted)
V
CC
Supply voltage
(2)
36 VV
ID
Differential input voltage
(3)
± 36 VV
I
Input voltage range (either input) – 0.3 V to 36 VV
O
Output voltage 36 VI
O
Output current 20 mADuration of output short-circuit to ground
(4)
Unlimitedθ
JA
Package thermal impedance
(5) (6)
206 ° C/WT
J
Operating virtual junction temperature 150 ° CT
stg
Storage temperature range – 65 ° C to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential voltages, are with respect to the network ground.(3) Differential voltages are at IN+ with respect to IN – .(4) Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.(5) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can impact reliability.(6) The package thermal impedance is calculated in accordance with JESD 51-7.
2Submit Documentation Feedback Copyright © 1999 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TL331
ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
TL331
www.ti.com
......................................................................................................................................................... SLVS238F – AUGUST 1999 – REVISED JULY 2008
at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS
(1)
T
A
(2)
MIN TYP MAX UNIT
25 ° C 2 5V
CC
= 5 V to 30 V, V
O
= 1.4 V,V
IO
Input offset voltage mVV
IC
= V
IC(min)
Full range 925 ° C 5 50I
IO
Input offset current V
O
= 1.4 V nAFull range 25025 ° C – 25 – 250I
IB
Input bias current V
O
= 1.4 V nAFull range – 4000 to25 ° C
V
CC
– 1.5Common-mode input voltageV
ICR
Vrange
(3)
0 toFull range
V
CC
– 1.5Large-signal differential voltage V
CC
= 15 V, V
O
= 1.4 V to 11.4 V,A
VD
25 ° C 50 200 V/mVamplification R
L
≥15 k Ωto V
CC
V
OH
= 5 V, V
ID
= 1 V 25 ° C 0.1 50 nAI
OH
High-level output current
V
OH
= 30 V, V
ID
= 1 V Full range 1 µA25 ° C 150 400V
OL
Low-level output voltage I
OL
= 4 mA, V
ID
= – 1 V mVFull range 700I
OL
Low-level output current V
OL
= 1.5 V, V
ID
= 1 V 25 ° C 6 mAI
CC
Supply current R
L
=∞, V
CC
= 5 V 25 ° C 0.4 0.7 mA
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.(2) Full range T
A
is – 40 ° C to 85 ° C for I-suffix devices and – 40 ° C to 105 ° C for K-suffix devices.(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of thecommon-mode voltage range is V
CC+
– 1.5 V, but either or both inputs can go to 30 V without damage.
V
CC
= 5 V, T
A
= 25 ° C
PARAMETER TEST CONDITIONS TYP UNIT
100-mV input step with 5-mV overdrive 1.3Response time R
L
connected to 5 V through 5.1 k Ω, C
L
= 15 pF
(1) (2)
µsTTL-level input step 0.3
(1) C
L
includes probe and jig capacitance.(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
Copyright © 1999 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TL331
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331KDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TL331KDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL331IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331IDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TL331IDBVT SOT-23 DBV 5 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TL331KDBVR SOT-23 DBV 5 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
TL331KDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Dec-2011
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
TL331IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
TL331KDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Dec-2011
Pack Materials-Page 2
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