www.ti.com
FEATURES
3
2
4
61
1A 1Y
2Y
GND
2A
DBV PACKAGE
(TOP VIEW) YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
61
1A 1Y
2Y
GND
2A
1A
2A
1Y
2Y
GND
See mechanical drawings for dimensions.
1
4
2
3
6
VCC
VCC
5VCC
5
5
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G14DUAL SCHMITT-TRIGGER INVERTER
SCES200L APRIL 1999 REVISED JANUARY 2007
Available in the Texas Instruments Typical V
OHV
(Output V
OH
Undershoot)NanoFree™ Package >2 V at V
CC
= 3.3 V, T
A
= 25 °CSupports 5-V V
CC
Operation I
off
Feature Supports Partial-Power-DownMode OperationInputs Accept Voltages to 5.5 V
Latch-Up Performance Exceeds 100 mA PerMax t
pd
of 5.4 ns at 3.3 V
JESD 78, Class IILow Power Consumption, 10- µA Max I
CC
ESD Protection Exceeds JESD 22 ± 24-mA Output Drive at 3.3 V
2000-V Human-Body Model (A114-A)Typical V
OLP
(Output Ground Bounce)
1000-V Charged-Device Model (C101)<0.8 V at V
CC
= 3.3 V, T
A
= 25 °C
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V V
CC
operation.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
The SN74LVC2G14 contains two inverters and performs the Boolean function Y = A. The device functions astwo independent inverters, but because of Schmitt action, it may have different input threshold levels forpositive-going (V
T+
) and negative-going (V
T–
) signals.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74LVC2G14YZPR _ _ _CF_0.23-mm Large Bump YZP (Pb-free)
Reel of 3000 SN74LVC2G14DBVRSOT (SOT-23) DBV C14_–40°C to 85°C
Reel of 250 SN74LVC2G14DBVT
Reel of 3000 SN74LVC2G14DCKRSOT (SC-70) DCK CF_Reel of 250 SN74LVC2G14DCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
1A 1Y
1 6
2A 2Y
3 4
Absolute Maximum Ratings
(1)
SN74LVC2G14
DUAL SCHMITT-TRIGGER INVERTER
SCES200L APRIL 1999 REVISED JANUARY 2007
FUNCTION TABLE(EACH INVERTER)
INPUT OUTPUTA Y
H LL H
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high or low state
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mADBV package 165θ
JA
Package thermal impedance
(4)
DCK package 259 °C/WYZP package 123T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
www.ti.com
Recommended Operating Conditions
(1)
SN74LVC2G14DUAL SCHMITT-TRIGGER INVERTER
SCES200L APRIL 1999 REVISED JANUARY 2007
MIN MAX UNIT
Operating 1.65 5.5V
CC
Supply voltage VData retention only 1.5V
I
Input voltage 0 5.5 VV
O
Output voltage 0 V
CC
VV
CC
= 1.65 V –4V
CC
= 2.3 V –8I
OH
High-level output current –16 mAV
CC
= 3 V
–24V
CC
= 4.5 V –32V
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current 16 mAV
CC
= 3 V
24V
CC
= 4.5 V 32T
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3Submit Documentation Feedback
www.ti.com
Electrical Characteristics
Switching Characteristics
SN74LVC2G14
DUAL SCHMITT-TRIGGER INVERTER
SCES200L APRIL 1999 REVISED JANUARY 2007
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
1.65 V 0.7 1.42.3 V 1 1.7V
T+
Positive-going input 3 V 1.3 2.2 Vthreshold voltage
4.5 V 1.9 3.15.5 V 2.2 3.71.65 V 0.3 0.72.3 V 0.4 1V
T–
Negative-going input 3 V 0.6 1.3 Vthreshold voltage
4.5 V 1.1 25.5 V 1.4 2.51.65 V 0.3 0.82.3 V 0.4 0.9V
THysteresis 3 V 0.4 1.1 V(V
T+
V
T–
)
4.5 V 0.6 1.35.5 V 0.7 1.4I
OH
= –100 µA 1.65 V to 4.5 V V
CC
0.1I
OH
= –4 mA 1.65 V 1.2I
OH
= –8 mA 2.3 V 1.9V
OH
VI
OH
= –16 mA 3 V 2.4I
OH
= –24 mA 3 V 2.3I
OH
= –32 mA 4.5 V 3.8I
OL
= 100 µA 1.65 V to 4.5 V 0.1I
OL
= 4 mA 1.65 V 0.45I
OL
= 8 mA 2.3 V 0.3V
OL
VI
OL
= 16 mA 3 V 0.4I
OL
= 24 mA 3 V 0.55I
OL
= 32 mA 4.5 V 0.55I
I
A input V
I
= 5.5 V or GND 0 to 5.5 V ±5 µAI
off
V
I
or V
O
= 5.5 V 0 ±10 µAI
CC
V
I
= 5.5 V or GND, I
O
= 0 1.65 V to 5.5 V 10 µAI
CC
One input at V
CC
0.6 V, Other inputs at V
CC
or GND 3 V to 5.5 V 500 µAC
I
V
I
= V
CC
or GND 3.3 V 4 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25°C.
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VFROM TO
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
A Y 3.9 9.5 1.9 5.7 2 5.4 1.5 4.3 ns
4
Submit Documentation Feedback
www.ti.com
Operating Characteristics
SN74LVC2G14DUAL SCHMITT-TRIGGER INVERTER
SCES200L APRIL 1999 REVISED JANUARY 2007
T
A
= 25°C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VPARAMETER TEST CONDITIONS UNITTYP TYP TYP TYP
C
pd
Power dissipation capacitance f = 10 MHz 16 17 18 21 pF
5Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
th
tsu
FromOutput
UnderTest
C
(seeNote A)
L
LOADCIRCUIT
S1
VLOAD
Open
GND
RL
DataInput
TimingInput
0V
0V
0V
tW
Input
0V
Input
Output
Waveform1
S1atV
(seeNoteB)
LOAD
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
0V
»0V
Output
Output
TEST S1
t /t
PLH PHL Open
Output
Control
VM
VMVM
VM
VM
1.8V 0.15V±
2.5V 0.2V±
3.3V 0.3V±
5V 0.5V±
1kW
500 W
500 W
500 W
VCC RL
2× VCC
2× VCC
6V
2× VCC
VLOAD CL
30pF
30pF
50pF
50pF
0.15V
0.15V
0.3V
0.3V
VD
3V
VI
VCC/2
VCC/2
1.5V
VCC/2
VM
£2ns
£2ns
£2.5ns
£2.5ns
INPUTS
RL
t /t
r f
VCC
VCC
VCC
VLOAD
t /t
PLZ PZL
GND
t /t
PHZ PZH
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 .
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andt arethesameast .
F. t andt arethesameast .
G. t andt arethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
VOLTAGEWAVEFORMS
PULSEDURATION
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V V
OH D
V +V
OL D
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
SN74LVC2G14
DUAL SCHMITT-TRIGGER INVERTER
SCES200L APRIL 1999 REVISED JANUARY 2007
Figure 1. Load Circuit and Voltage Waveforms
6
Submit Documentation Feedback
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LVC2G14DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DBVTE4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G14YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2008
Addendum-Page 1
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G14 :
Automotive: SN74LVC2G14-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC2G14DBVR SOT-23 DBV 6 3000 178.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3
SN74LVC2G14DBVR SOT-23 DBV 6 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
SN74LVC2G14DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC2G14DBVT SOT-23 DBV 6 250 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
SN74LVC2G14DBVT SOT-23 DBV 6 250 178.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3
SN74LVC2G14DCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC2G14DCKR SC70 DCK 6 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC2G14DCKR SC70 DCK 6 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC2G14DCKT SC70 DCK 6 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC2G14DCKT SC70 DCK 6 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC2G14YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Jun-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC2G14DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74LVC2G14DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0
SN74LVC2G14DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74LVC2G14DBVT SOT-23 DBV 6 250 205.0 200.0 33.0
SN74LVC2G14DBVT SOT-23 DBV 6 250 180.0 180.0 18.0
SN74LVC2G14DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G14DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G14DCKR SC70 DCK 6 3000 205.0 200.0 33.0
SN74LVC2G14DCKT SC70 DCK 6 250 180.0 180.0 18.0
SN74LVC2G14DCKT SC70 DCK 6 250 205.0 200.0 33.0
SN74LVC2G14YZPR DSBGA YZP 6 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Jun-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP®Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2012, Texas Instruments Incorporated