UC1706L883B - Texas Instruments High-Performance Analog

UC1706

UC2706

UC3706

Dual Output Driver

FEATURES

•Dual, 1.5A Totem Pole Outputs

•40nsec Rise and Fall into 1000pF

•Parallel or Push-Pull Operation

•Single-Ended to Push-Pull Conversion

•High-Speed, Power MOSFET

Compatible

•Low Cross-Conduction Current Spike

•Analog, Latched Shutdown

•Internal Deadband Inhibit Circuit

•Low Quiescent Current

•5 to 40V Operation

•Thermal Shutdown Protection

•16-Pin Dual-In-Line Package

•20-Pin Surface Mount Package

DESCRIPTION

The UC1706 family of output drivers are made with a high-speed

Schottky process to interface between low-level control functions and

high-power switching devices - particularly power MOSFET's. These de-

vices implement three generalized functions as outlined below.

First: They accept a single-ended, low-current digital input of either polar-

ity and process it to activate a pair of high-current, totem pole outputs

which can source or sink up to 1.5A each.

Second: They provide an optional single-ended to push-pull conversion

through the use of an internal flip-flop driven by double-pulse-

suppression logic. With the flip-flop disabled, the outputs work in parallel

for 3.0A capability.

Third: Protection functions are also included for pulse-by-pulse current

limiting, automatic deadband control, and thermal shutdown.

These devices are available in a two-watt plastic “bat-wing” DIP for op-

eration over a 0°C to 70°C temperature range and, with reduced power,

in a hermetically sealed cerdip for -55°C to +125°C operation. Also avail-

able in surface mount Q and L packages.

BLOCK DIAGRAM

INV N.I OUT

OUT = INV and N.I.

OUT = INV or N.I.

TRUTH TABLE

application

INFO

available

SLUS200A - OCTOBER 1998 - REVISED APRIL 2001

UC1706

UC2706

UC3706

DIL-16, SOIC-16 (TOP VIEW)

J or N Package, DW Package PLCC-20, LCC-20 (TOP VIEW)

Q, L Packages

ABSOLUTE MAXIMUM RATINGS

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N--Pkg . . . . . . . . . . . . . . . J--Pkg

Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V

Collector Supply Voltage, VC. . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . 40V

Output Current (Each Output, Source or Sink)

Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . ±500mA

Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.5A. . . . . . . . . . . . . . . . . ±1.0A

Capacitive Discharge Energy . . . . . . . . . . . . . . . 20µJ. . . . . . . . . . . . . . . . . . . 15µJ

Digital Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V . . . . . . . . . . . . . . . . . 5.5V

Analog Stop Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . VIN. . . . . . . . . . . . . . . . . . . . VIN

Power Dissipation at TA= 25°C (See Note) . . . . . . . 2W . . . . . . . . . . . . . . . . . . 1W

Power Dissipation at T (Leads/Case) = 25°C. . . . . . 5W . . . . . . . . . . . . . . . . . . . 2

(See Note)

Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . --55°C to +125°C

Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . --65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . 300°C

Note: All voltages are with respect to the four ground pins which must be connected

together.All currents are positive into, negative out of the specified trerminal.Consult

Packaging sections of the Databook for thermal limitations and considerations of package.

VIN

INHIBIT REF

A INHIBIT

GROUND

STOP NON-INV.

BOUTPUT

STOP INV.

INV. INPUT

B INHIBIT

AOUTPUT

FLIP/FLOP

N.I. INPUT

GROUND

CONNECTION DIAGRAMS

Note: All four ground pins must be connected to a common

ground.

N/C

122019

891110 12 13

B INHIBIT

INV INPUT A INHIBIT

INHIBIT REF

VIN

GROUND

N/C

GROUND

BOUTPUT

N.I.INPUT

GROUND

N/C

GROUND

AOUTPUT

STOP INV.

STOP NON-INV.

N/C

FLIP/FLOP

ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for

the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC= 20V. TA=TJ.

PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS

VIN Supply Current VIN = 40V 8 10 mA

VCSupply Current VC= 40V, Outputs Low 4 5 mA

VCLeakage Current VIN = 0, VC= 30V, No Load .05 0.1 mA

Digital Input Low Level 0.8 V

Digital Input High Level 2.2 V

Input Current VI= 0 –0.6 –1.0 mA

Input Leakage VI= 5V .05 0.1 mA

UC1706

UC2706

UC3706

ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for

the UC1706, –25°C to +85°C for the UC2706 and 0°C to +70°C for the UC3706; VIN = VC= 20V. TA=TJ.

PARAMETERS TEST CONDITIONS MIN TYP MAX UNITS

Output High Sat., VC-VOIO= -50mA 2.0 V

Output Low Sat., VOIO= 50mA 0.4 V

IO= 500mA 2.5 V

Inhibit Threshold VREF = 0.5V 0.4 0.6 V

VREF = 3.5V 3.3 3.7 V

Inhibit Input Current VREF = 0 –10 –20 µA

Analog Threshold VCM = 0 to 15V, for the UC2706 and UC3706 100 130 160 mV

VCM = 0 to 15V, for the UC1706 80 130 160 mV

Input Bias Current VCM = 0 –10 –20 µA

Thermal Shutdown 155 °C

TYPICAL SWITCHING CHARACTERISTICS: VIN = VC= 20V, TA= 25°C. Delays measured to 10% output change.

PARAMETERS TEST CONDITIONS OUTPUT CL= UNITS

From Inv. Input to Output: open 1.0 2.2 nF

Rise Time Delay 110 130 140 ns

10% to 90% Rise 20 40 60 ns

Fall Time Delay 80 90 110 ns

90% to 10% Fall 25 30 50 ns

From N. I. Input to Output:

Rise Time Delay 120 130 140 ns

10% to 90% Rise 20 40 60 ns

Fall Time Delay 100 120 130 ns

90% to 10% Fall 25 30 50 ns

VCCross-Conduction Current Spike Duration Output Rise 25 ns

Output Fall 0 ns

Inhibit Delay Inhibit Ref. = 1V, Inhibit Inv. = 0.5 to 1.5V 250 ns

Analog Shutdown Delay Stop Non-Inv. = 0V, Stop Inv. = 0 to 0.5V 180 ns

CIRCUIT DESCRIPTION

Outputs

The totem-pole outputs have been designed to minimize

cross-conduction current spikes while maximizing fast,

high-current rise and fall times. Current limiting can be

done externally either at the outputs or at the common

VCpin. The output diodes included have slow recovery

and should be shunted with high-speed external diodes

when driving high-frequency inductive loads.

Flip/Flop

Grounding pin 7 activates the internal flip-flop to alter-

nate the two outputs. With pin 7 open, the two outputs

operate simultaneously and can be paralleled for higher

current operation. Since the flip-flop is triggered by the

digital input, an off-time of at last 200nsec must be pro-

vided to allow the flip/flop to change states. Note that the

circuit logic is configured such that the “OFF”state is de-

fined as the outputs low.

Digital Inputs

With both an inverting and non-inverting input available,

either active-high or active-low signals may be accepted.

These are true TTL compatible inputs—the threshold is

approximately 1.2V with no hysteresis; and external pull-

up resistors are not required.

Inhibit Circuit

Although it may have other uses, this circuit is included to

eliminate the need for deadband control when driving

relatively slow bipolar power transistors. A diode from

each inhibit input to the opposite power switch collector

will keep one output from turning-on until the other has

turned-off. The threshold is determined by the voltage on

pin 15 which can be set from 0.5 to 3.5V. When this cir-

cuit is not used, ground pin 15 and leave 1 and 16 open.

UC1706

UC2706

UC3706

D1, D2: UC3611 Schottky Diodes

Transformer Coupled MOSFET Drive Circuit

CIRCUIT DESCRIPTION (cont.)

Charge Pump Circuits

D1, D2; UC3611 Schottky Diodes

APPLICATIONS

Power MOSFET Drive Circuit

D1, D2; UC3611 Schottky Diodes

Power MOSFET Drive Circuit Using Negative Bias Voltage and

Level Shifting to Ground Referenced PWMs

Analog Shutdown

This circuit is included to get a latched shutdown as close

to the outputs as possible, from a time standpoint. With

an internal 130mV threshold, this comparator has a

common-mode range from ground to (VIN –3V). When

not used, both inputs should be grounded. The time re-

quired for this circuit to latch is inversely proportional to

the amount of overdrive but reaches a minimum of

180nsec. As with the flip-flop, an input off-time of at least

200nsec is required to reset the latch between pulses.

Supply Voltage

With an internal 5V regulator, this circuit is optimized for

use with a 7 to 40V supply; however, with some slight re-

sponse time degradation, it can also be driven from 5V.

When VIN is low, the entire circuit is disabled and no cur-

rent is drawn from VC. When combined with a UC1840

PWM, the Driver Bias switch can be used to supply VIN to

the UC1706. VIN switching should be fast as if VCis

high, undefined operation of the outputs may occur with

VINless than 5V.

Thermal Considerations

Should the chip temperature reach approximately 155°C,

a parallel, non--inverting input is activated driving both

outputs to the low state.

UC1706

UC2706

UC3706

APPLICATIONS (cont'd)

D1, D2: UC3611 Schottky Diodes

Transformer Coupled Push-Pull MOSFET Drive Circuit

D1, D2: UC3611 Schottky Diodes

Power Bipolar Drive Circuit

UC3706 Converts Single Output PWMs to High Current Push-Pull Configuration

UNITRODE CORPORATION

7 CONTINENTAL BLVD.•MERRIMACK, NH 03054

TEL. (603) 424-2410 • FAX (603) 424-3460

PACKAGE OPTION ADDENDUM

www.ti.com 30-May-2011

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

5962-89611012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Add to cart

5962-8961101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart

UC1706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart

UC1706J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart

UC1706L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type Add to cart

UC2706DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart

UC2706DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart

UC2706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart

UC2706N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart

UC2706NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart

UC3706DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart

UC3706DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart

UC3706DWTR ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart

UC3706DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Add to cart

UC3706J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type Add to cart

UC3706N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart

UC3706NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type Add to cart

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 30-May-2011

Addendum-Page 2

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1706, UC2706, UC2706M, UC3706, UC3706M :

•Catalog: UC3706, UC2706, UC3706M, UC3706

•Military: UC2706M, UC1706, UC1706

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

A0 (mm) B0 (mm) K0 (mm) P1

(mm) W

(mm) Pin1

Quadrant

UC3706DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Jul-2008

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

UC3706DWTR SOIC DW 16 2000 346.0 346.0 33.0

PACKAGE MATERIALS INFORMATION

www.ti.com 29-Jul-2008

Pack Materials-Page 2

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