February 2011
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1
NC7SZ34 — TinyLogic
®
UHS Buffer
NC7SZ34
TinyLogic® UHS Buffer
Features
Ultra-High Speed: tPD 2.4ns (Typical) into 50pF
at 5V VCC
High Output Drive: ±24mA at 3V VCC
Broad VCC Operating Range: 1.65V to 5.5V
Matches Performance of LCX Operated at 3.3V VCC
Power-Down High-Impedance Inputs / Outputs
Proprietary Noise / EMI Reduction Circuitry
WLCSP Package
Description
The NC7SZ34 is a single buffer from Fairchild’s Ultra-
High Speed (UHS) series of TinyLogic®. The device is
fabricated with advanced CMOS technology to achieve
ultra-high speed with high output drive, while
maintaining low static power dissipation over a broad
VCC operating range of 1.65V to 5.5V VCC. The inputs
and output are high-impedance when VCC is 0V. Inputs
tolerate voltages up to 7V, independent of VCC operating
voltage.
Related Resources
AN-5055 — Portability and Ultra Low Power
TinyLogic®
MS-503 — Family Characteristics TinyLogic®
HS/HST and UHS Series
Ordering Information
Part Number Top Mark Package Packing Method
NC7SZ34UCX KJ
4-Lead, Wafer-Level Chip Scale 0.76x0.76x0.5mm
Wafer-Level Chip-Scale Package (WLCSP) 3000 Units on
Tape & Reel
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 2
NC7SZ34 — TinyLogic
®
UHS Buffer
Pin Configurations
A1 A2
B2B1
Figure 1. WLCSP (Top View)
Pin Definitions
WLCSP Name Description
A1 A Input
A2 VCC Power Supply
B1 GND Ground
B2 Y Output
Function Table
Y= A
Inputs Output
A Y
LOW Logic Level LOW Logic Level
HIGH Logic Level HIGH Logic Level
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 3
NC7SZ34 — TinyLogic
®
UHS Buffer
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VCC Supply Voltage -0.5 7.0 V
VIN DC Input Voltage -0.5 7.0 V
VOUT DC Output Voltage -0.5 7.0 V
IIK DC Input Diode Current VIN < -0.5V -50 mA
IOK DC Output Diode Current VOUT < -0.5V -50 mA
IOUT DC Output Current ±50 mA
ICC or IGND DC VCC or Ground Current ±50 mA
TSTG Storage Temperature Range -65 +150 °C
TJ Junction Temperature Under Bias +150 °C
TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C
PD Power Dissipation at +85°C 200 mW
ESD Human Body Model, JEDEC:JESD22-A114 4000 V
Charge Device Model, JEDEC:JESD22-C101 2000
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Conditions Min. Max. Unit
VCC Supply Voltage Operating 1.65 5.50
V
Supply Voltage Data Retention 1.5 5.5
VIN Input Voltage 0 5.5 V
VOUT Output Voltage 0 VCC V
TA Operating Temperature -40 +85 °C
tr, tf Input Rise and Fall Times VCC at 1.8V, 2.5V ±0.2V 0 20 ns/V
VCC at 3.3V ±0.3V 0 10
VCC at 5.0V ±0.5V 0 5
JA Thermal Resistance 80 °C/W
Note:
1. Unused inputs must be held HIGH or LOW. They may not float.
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 4
NC7SZ34 — TinyLogic
®
UHS Buffer
DC Electrical Characteristics
Symbol Parameter VCC Conditions TA=25°C TA=-40 to 85°C Unit
Min. Typ. Max. Min. Max.
VIH HIGH Level
Input Voltage 1.65 to 1.95 0.65VCC 0.65VCC V
2.30 to 5.50 0.70VCC 0.70VCC
VIL LOW Level
Input Voltage 1.65 to 1.95 0.35VCC 0.35VCC V
2.30 to 5.50 0.30VCC 0.30VCC
VOH HIGH Level
Output Voltage
1.65
VIN=VIH, IOH=
-100µA
1.55 1.65
V
1.80 1.70 1.80 1.70
2.30 2.20 2.30 2.20
3.00 2.90 3.00 2.90
4.50 4.40 4.50 4.40
1.65 IOH=-4mA 1.29 1.52 1.29
2.30 IOH=-8mA 1.90 2.15 1.90
3.00 IOH=-16mA 2.40 2.80 2.40
3.00 IOH=-24mA 2.30 2.68 2.30
4.50 IOH=-32mA 3.80 4.20 3.80
VOL LOW Level
Output Voltage
1.65
VIN=VIL,
IOL=100µA
0.00 0.10 0.10
V
1.80 0.00 0.10 0.10
2.30 0.00 0.10 0.10
3.00 0.00 0.10 0.10
4.50 0.00 0.10 0.10
1.65 IOL=4mA 0.08 0.24 0.24
2.30 IOL=8mA 0.10 0.30 0.30
3.00 IOL=16mA 0.15 0.40 0.40
3.00 IOL=24mA 0.22 0.55 0.55
4.50 IOL=32mA 0.22 0.55 0.55
IIN Input Leakage
Current 0 to 5.5 0 VIN 5.5V ±1 ±10 µA
IOFF Power Off
Leakage
Current 0 VIN or VOUT=5.5V 1 10 µA
ICC Quiescent
Supply Current 1.65 to 5.50 VIN=5.5V, GND 1.0 10 µA
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 5
NC7SZ34 — TinyLogic
®
UHS Buffer
AC Electrical Characteristics
Symbol Parameter VCC Conditions TA=25°C TA=-40 to
85°C Unit
s Figure
Min. Typ. Max. Min. Max.
tPLH, tPHL Propagation Delay
1.65
CL=15pF,
RL=1M
2.0 5.3 11.4 2.0 12.0
ns Figure 2
Figure 3
1.80 2.0 4.4 9.5 2.0 10.0
2.5 ±0.2 0.8 2.9 6.5 0.8 7.0
3.3 ±0.3 0.5 2.1 4.5 0.5 4.7
5.0 ±0.5 0.5 1.8 3.9 0.5 4.1
3.3 ±0.3 CL=50pF,
RL=500 1.5 2.9 5.0 1.5 5.2
5.0 ±0.5 0.8 2.4 4.3 0.8 4.5
CIN Input Capacitance 0.00 2.0 pF
CPD Power Dissipation
Capacitance(2) 3.30 12.9 pF Figure 4
5.00 15.6
Note:
2. CPD is defined as the value of the internal equivalent capacitance derived from dynamic operating current
consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating
current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic).
Figure 2. AC Test Circuit Figure 3. AC Waveforms
Figure 4. ICCD Test Circuit
Note:
3. Input=AC Waveform; tr=tf=1.8ns; Frequency =10MHz; Duty Cycle =50%.
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 6
NC7SZ34 — TinyLogic
®
UHS Buffer
Physical Dimensions
BOTTOM VIEW
SIDE VIEWS
TOP VIEW RECOMMENDED LAND PATTERN
BALL A1
INDEX AREA
A1
0.005 CAB
F
(NSMD PAD TYPE)
B
A
0.292±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
0.03 C
2X
0.03 C
2X
12
A
B
0.40
0.40
(X)±0.018
SEATING PLANE
C
0.06 C
0.05 CE
D
D
E
0.40
0.40 Ø0.20
Cu Pad
Ø0.30
Solder Mask
(Y)±0.018
Ø0.260±0.020
4X
0.539
0.461
F
Figure 5. 4-Lead, W afer-L evel Chip Scale 0.76x0.76x0.5mm Wafer-Level Chip-Scale Package (WLCSP)
Product D E X Y
NC7SZ34UCX 0.76 +/-0.030 0.76 +/-0.030 0.18 0.18
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’ s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf.
Package Designator Tape Section Cavity Number Cavity Status Cover Type Status
UCX Leader (Start End) 125 (Typical) Empty Sealed
Carrier 3000 Filled Sealed
Trailer (Hub End) 75 (Typical) Empty Sealed
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 7
NC7SZ34 — TinyLogic
®
UHS Buffer
© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
NC7SZ34 • Rev. 1.0.1 8
NC7SZ34 — TinyLogic
®
UHS Buffer
