Product Family Data Sheet Rev. 3.5 2018. 09. 21 High Power LED Series Chip Scale Package LH181B Use of Samsung's Chip Scale Package technology provide high performance and energy conserving Features & Benefits Utilizes Samsung TF chip technology Suitable for use in indoor and outdoor lighting Operates at a maximum current of up to 1.4 A Compact footprint (2.36 x 2.36 mm) Applications Indoor Lighting: Spotlight, Downlight, MR, PAR Outdoor Lighting: Street Light, Tunnel Light, Security Light, Parking Lot Light Industrial Lighting: High Bay Light, Low Bay Light Consumer Lighting: Torch Light 1# 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 6 3. Typical Characteristics Graphs ----------------------- 11 4. Outline Drawing & Dimension ----------------------- 13 5. Reliability Test Items & Conditions ----------------------- 14 6. Soldering Conditions ----------------------- 15 7. Tape & Reel ----------------------- 16 8. Label Structure ----------------------- 18 9. Packing Structure ----------------------- 19 Precautions in Handling & Use ----------------------- 21 10. 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +100 C Note 1) Storage Temperature Tstg -40 ~ +125 C - LED Junction Temperature Tj 135 C - Forward Current IF 1400 mA Note 1) Peak Pulse Forward Current IFP 2000 mA Duty 1/10 pulse width 10ms Assembly Process Temperature - 260 <10 C s - ESD (HBM) - 2 kV - Note: 1) Refer to the derating curve, `3. Typical Characteristics Graph', for proper driving current that maintained below maximum junction temperature. 4 b) Electro-optical Characteristics Item Unit Nominal CCT (K) Condition Value Typ. IF (mA) Tj (C) 350 25 168 350 85 152 700 85 283 1000 85 381 1400 85 492 350 25 2.92 350 85 2.82 700 85 2.97 1000 85 3.08 1400 85 3.20 3500 Luminous Flux (v) Forward Voltage (VF) lm V (80 CRI) Thermal Resistance (junction to solder point) K/W 2 Beam Angle 120 Note: Samsung maintains measurement tolerance of: luminous flux = 7%, forward voltage = 0.1 V 5 c) Luminous Flux Characteristics (Ts = 85 C) Calculated Minimum Flux2) (lm) Sorting @ 350 mA (lm) Flux Rank Flux Range1) Sub Rank @ 350 mA @ 700 mA @ 1050 mA @ 1500 mA E3 80 ~ 110 E1, F1, G1 80 149 200 259 F3 90 ~ 120 F1, G1, H1 90 167 226 291 G3 100 ~ 130 G1, H1, J1 100 186 251 324 H3 110 ~ 140 H1, J1, K1 110 205 276 356 J3 120 ~ 150 J1, K1, M1 120 223 301 388 K3 130 ~ 160 K1, M1, N1 130 242 326 421 M3 140 ~ 170 M1, N1, P1 140 260 351 453 N3 150 ~ 180 N1, P1, Q1 150 279 376 485 P3 160 ~ 190 P1, Q1, R1 160 298 401 518 Q3 170 ~ 200 Q1, R1, S1 170 316 426 550 R3 180 ~ 210 R1, S1, T1 180 335 451 582 S3 190 ~ 220 S1, T1, U1 190 353 476 615 T3 200 ~ 230 T1, U1, V1 200 372 501 647 U3 210 ~ 240 U1, V1, W1 210 391 526 679 V3 220 ~ 250 V1, W1, X1 220 409 551 712 W3 230 ~ 260 W1, X1, Y1 230 428 576 744 X3 240 ~ 270 X1, Y1, Z1 240 446 601 776 Y3 250 ~ 280 Y1, Z1, 11 250 465 627 809 Z3 260 ~ 290 Z1, 11, 21 260 484 652 841 Notes: 1) Samsung maintains measurement tolerance of: luminous flux = 7 %, CRI = 3 2) Calculated minimum flux values are for reference only 6 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S C P 8 U T F 1 H E L 1 U K M 3 4 E Digit 1 2 3 4 SCP CCT(K) 6 9 10 11 12 13 Specification 7 CRI 70 8 CRI 80 9 CRI 90 W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K Chip Shape T Square type Product F1H Chip version Product Purpose EL1 FEC for lighting CCT (K) 14 15 Code CRI 5 7 8 PKG Information Samsung Chip Scale Package W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K K Full Bin for MacAdam 5-Step U Full Bin for MacAdam 3-Step MacAdam Step 16 Luminous Flux F3 90- 120 F1 G3 100- 130 G1 100-110 H3 110- 140 H1 110- 120 90-100 J3 120- 150 J1 K3 130~160 K1 130~140 M3 140~170 M1 140~150 N3 150~180 N1 150~160 P3 160~190 P1 160~170 Q3 170~200 Q1 170~180 F3 G3 120- 130 H3 J3 K3 M3 N3 P3 Q3 Digit 15: Min. spec Digit 16: The number of higher bin(s) from min. spec. e.g.: K1 = 130~140 lm, 17 18 Forward Voltage (Vf) 4E 2.7 ~ 3.1 V K3 = 130~160 lm 7 a) Luminous Flux Bins CRI/ Nominal CCT (K) (min. flux) (IF = 350 mA, Ts = 85 C) Flux rank E1 F1 G1 H1 J1 K1 M1 N1 P1 Q1 R1 S1 80 90 100 110 120 130 140 150 160 170 180 190 SCP7WTF1HEL1WM34E 2700 70 3000 SCP7VTF1HEL1VN34E 3500 SCP7UTF1HEL1UN34E 4000 SCP7TTF1HEL1TP34E 5000 SCP7RTF1HEL1RP34E 5700 SCP7QTF1HEL1QP34E SCP7PTF1HEL1PN34E 6500 80 2700 SCP8WTF1HEL1WK34E 3000 SCP8VTF1HEL1VK34E 3500 SCP8UTF1HEL1UM34E 4000 SCP8TTF1HEL1TM34E 5000 SCP8RTF1HEL1RN34E 5700 SCP8QTF1HEL1QN34E SCP8PTF1HEL1PM34E 6500 90 2700 SCP9WTF1HEL1WG34E 3000 SCP9VTF1HEL1VG34E 3500 SCP9UTF1HEL1UH34E 4000 SCP9TTF1HEL1TH34E 5000 SCP9RTF1HEL1RH34E Notes: 1) : MacAdam step code, K(MacAdam 5-step) / U(MacAdam 3-step) 8 b) Color Bins (IF = 350 mA, Ts= 85 C) Nominal CCT (K) CRI (Ra) 2700, 3000, 3500, 4000, 5000, 5700, 6500 70 2700, 3000, 3500, 4000, 5000, 5700, 6500 80 2700, 3000, 3500,4000,5000 90 Color Rank Chromaticity Bins K (Full Bin for MacAdam 5-step) U (Full Bin for MacAdam 3-step) K U Notes: 1) : Nominal CCT code, W(2700K)/V(3000K)/U(3500K)/T(4000K)/R(5000K)/Q(5700K)/P(6500K) c) Voltage Bins (IF = 350 mA, Ts = 85 C) CRI (Ra) Nominal CCT (K) Product Code Voltage Rank Voltage Bin Voltage Range (V) 4E 4E 2.7 ~ 3.1 9 d) Chromaticity Region & Coordinates (IF = 350 mA, Ts = 85 C) 10 e) Chromaticity Region & Coordinates (IF = 350 mA, Ts = 85 C) CCT (K) MacAdam 3 step 5 step Center point CIE x CIE y Major-axis Minor-axis Rotation a b 2700 0.4578 0.4101 0.0081 0.0042 53.70 3000 0.4338 0.4030 0.0083 0.0041 53.22 3500 0.4073 0.3917 0.0093 0.0041 54.00 4000 0.3818 0.3797 0.0094 0.0040 53.72 5000 0.3447 0.3553 0.0082 0.0035 59.62 5700 0.3287 0.3417 0.0075 0.0032 59.10 6500 0.3123 0.3282 0.0067 0.0029 58.57 2700 0.4578 0.4101 0.0135 0.0070 53.70 3000 0.4338 0.4030 0.0138 0.0068 53.22 3500 0.4073 0.3917 0.0155 0.0068 54.00 4000 0.3818 0.3797 0.0157 0.0067 53.72 5000 0.3447 0.3553 0.0137 0.0058 59.62 5700 0.3287 0.3417 0.0125 0.0053 59.10 6500 0.3123 0.3282 0.0112 0.0048 58.57 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 11 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 350 mA, Ts = 85 C) 3000K/CRI70 5000K/CRI70 b) Forward Current Characteristics c) Temperature Characteristics (Ts = 85 C) (IF = 350 mA) 12 d) Color Shift Characteristics (IF = 350 mA, Ts = 85 C) e) Derating Curve and Beam Angle Characteristics (IF = 350 mA, Ts = 25 C) 13 4. Outline Drawing & Dimension Measurement unit: Tolerance: mm 0.13 mm Precautions: 1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LEDs characteristics should be carefully checked before and after such repair. 3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs. 14 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Room Temperature Life Test 25 C, Derated maximum current 1000 h High Temperature Life Test 85 C, Derating maximum current 1000 h High Temperature Humidity Life Test 60 C, 90% RH, Derating maximum current 1000 h Low Temperature Life Test -40 C, Derating maximum current 1000 h Temperature Humidity Cycle Test -1025/Dry, 25 65 95% R.H. Derating maximum current 10 cycles Powered Temperature Cycle Test -40 C / 85 C each 20 min, 100 min transfer power on/off each 5 min, Derating maximum current 100 cycles Thermal Shock -45 C / 15 min 125 C / 15 min temperature change within 5 min 500 cycles High Temperature Storage 120 C 1000 h Low Temperature Storage -40 C 1000 h R1: 10 M R2: 1.5 k C: 100 pF V: 2 kV ESD (HBM) 5 times R1: 10 M R2: 0 ESD (MM) 5 times C: 200 pF V: 0.2 kV Vibration Test 20~2000~20 Hz, 200 m/s2, sweep 4 min X, Y, Z 3 direction, each 1 cycle 4 cycles Mechanical Shock Test 1500 g, 0.5 ms 3 shocks each X-Y-Z axis 5 cycles b) Criteria for Judging the Damage Item Symbol Test Condition (Ts = 25 C) Limit Min. Max. Forward Voltage VF IF = 350 mA Init. Value * 0.9 Init. Value * 1.1 Luminous Flux v IF = 350 mA Init. Value * 0.7 Init. Value * 1.1 15 6. Soldering Conditions a) Reflow Conditions (Pb free) Reflow frequency: 2 times max. b) Manual Soldering Conditions No more than 5 seconds @ max. 300 C, under soldering iron. 16 7. Tape & Reel a) Taping Dimension - + 17 b) Reel Dimension (unit: mm) Notes: 1) Quantity: 2,000 Qty/reel 2) Cumulative tolerance: Cumulative tolerance / 10 pitches is 0.2 mm 3) Adhesion strength of cover tape: Adhesion strength is 0.1-0.7 N when the cover tape is turned off from the carrier tape at 10 angle to the carrier tape 4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag 18 8. Label Structure a) Label Structure LH181B [CRI] [CCT] SCP8UTF1HEL1UUM34E Model Rank Code IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code T1H2C00NB / 1001 / X,XXX pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LED Qty Lot Number Note: Denoted Bin ID and product code above is only an example Rank Code: b) : Chromaticity bin (refer to page 6) : Luminous Flux bin (refer to page 6,7) : Voltage bin (refer to page 6,9) Lot Number The lot number is composed of the following characters: LH181B [CRI] [CCT] UUN14E SCP8UTF1HEL1UUM34E UUN14E IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1001 / X,XXX pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII : T (T: Taping ID) : 1 : Year : Month : Day (1~9, A: 10, ... , K: 20, ... , U: 30, V:31) : Product serial number (1: LED Manufacture Line) (G:2016, H: 2017, ...) (1, 2, ... , 7: July, ... , A: Oct., B: Nov., C: Dec.) (0001 ~ 9999) 19 9. Packing Structure a) Packing Process Reel LH181B [CRI] [CCT] UUN14E SCP8UTF1HEL1UUM34E UUN14E IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII T1H2C00NB / 1001 / X,XXX pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Aluminum Vinyl Packing Bag LH181B [CRI] [CCT] UUN14E SCP8UTF1HEL1UUM34E UUN14E IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII T1H2C00NB / 1001 / X,XXX pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Outer Box Material: Paper SW(B) Size (mm) Type 7 inch Note (a) (b) (c) 245 5 220 5 182 5 LH181B [CRI] [CCT] UUN14E SCP8UTF1HEL1UUM34E UUN14E IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII T1H2C00NB / 1001 / X,XXX pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Up to 7 reels 20 b) Aluminum Vinyl Packing Bag LH181B [CRI] [CCT] UUN14E SCP8UTF1HEL1UKM34E UUN14E IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII T1H2C00NB / 1001 / X,XXX pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag 21 10. Precautions in Handling & Use 1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate sudden change of the forward current caused by shift of forward voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient temperature and corresponding junction temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 C, 0~90 % RH). 5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH, or b. Stored at <10 % RH 6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 8) Devices must be baked for 1 hour at 60 5 C, if baking is required. 9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co. Ltd inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and semiconductor and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com. Copyright (c) 2018 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 1, Samsung-ro Giheung-gu Yongin-si, Gyeonggi-do, 17113 KOREA www.samsungled.com