1#
Product Family Data Sheet Rev. 3.5 2018. 09. 21
High Power LED Series
Chip Scale Package
LH181B
Use of Samsung’s Chip Scale Package technology
provide high performance and energy conserving
Featur
es & Benefits
Utilizes Samsung TF chip technology
Suitable for use in indoor and outdoor lighting
Operates at a maximum current of up to 1.4 A
Compact footprint (2.36 x 2.36 mm)
Applications
Indoor Lighting: Spotlight, Downlight, MR, PAR
Outdoor Lighting: Street Light, Tunnel Light, Security Light, Parking Lot Light
Industrial Lighting: High Bay Light, Low Bay Light
Consumer Lighting: Torch Light
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
6
3.
Typical Characteristics Graphs
-----------------------
11
4.
Outline Drawing & Dimension
-----------------------
13
5.
Reliability Test Items & Conditions
-----------------------
14
6.
Soldering Conditions
-----------------------
15
7.
Tape & Reel
-----------------------
16
8.
Label Structure
-----------------------
18
9.
Packing Structure
-----------------------
19
10.
Precautions in Handling & Use
-----------------------
21
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Condition
Ambient / Operating Temperature
Ta
-40 ~ +100
ºC
Note 1)
Storage Temperature
Tstg
-40 ~ +125
ºC
-
LED Junction Temperature
Tj
135
ºC
-
Forward Current
IF
1400
mA
Note 1)
Peak Pulse Forward Current
IFP
2000
mA
Duty 1/10 pulse width 10ms
Assembly Process Temperature
-
260
<10
ºC
s
-
ESD (HBM)
-
±2
kV
-
Note:
1) Refer to the derating curve, ‘3. Typical Characteristics Graph’, for proper driving current that maintained below maximum
junction temperature.
4
b) Electro-optical Characteristics
Item
Unit
Nominal CCT
(K)
Condition
Value
Typ.
IF (mA)
Tj (°C)
Luminous Flux (Φv)
lm
3500
(80 CRI)
350
25
168
350
85
152
700
85
283
1000
85
381
1400
85
492
Forward Voltage (VF)
V
350
25
2.92
350
85
2.82
700
85
2.97
1000
85
3.08
1400
85
3.20
Thermal Resistance
(junction to solder point)
K/W
2
Beam Angle
º
120
Note:
Samsung maintains measurement tolerance of: luminous flux = ±7%, forward voltage = ±0.1 V
5
c) Luminous Flux Characteristics (Ts = 85 ºC)
Sorting @ 350 mA (lm)
Calculated Minimum Flux2) (lm)
Flux Rank
Flux Range1)
Sub Rank
@ 350 mA
@ 700 mA
@ 1050 mA
@ 1500 mA
E3
80 ~ 110
E1, F1, G1
80
149
200
259
F3
90 ~ 120
F1, G1, H1
90
167
226
291
G3
100 ~ 130
G1, H1, J1
100
186
251
324
H3
110 ~ 140
H1, J1, K1
110
205
276
356
J3
120 ~ 150
J1, K1, M1
120
223
301
388
K3
130 ~ 160
K1, M1, N1
130
242
326
421
M3
140 ~ 170
M1, N1, P1
140
260
351
453
N3
150 ~ 180
N1, P1, Q1
150
279
376
485
P3
160 ~ 190
P1, Q1, R1
160
298
401
518
Q3
170 ~ 200
Q1, R1, S1
170
316
426
550
R3
180 ~ 210
R1, S1, T1
180
335
451
582
S3
190 ~ 220
S1, T1, U1
190
353
476
615
T3
200 ~ 230
T1, U1, V1
200
372
501
647
U3
210 ~ 240
U1, V1, W1
210
391
526
679
V3
220 ~ 250
V1, W1, X1
220
409
551
712
W3
230 ~ 260
W1, X1, Y1
230
428
576
744
X3
240 ~ 270
X1, Y1, Z1
240
446
601
776
Y3
250 ~ 280
Y1, Z1, 11
250
465
627
809
Z3
260 ~ 290
Z1, 11, 21
260
484
652
841
Notes:
1) Samsung maintains measurement tolerance of: luminous flux = ±7 %, CRI = ±3
2) Calculated minimum flux values are for reference only
6
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
C
P
8
U
T
F
1
H
E
L
1
U
K
M
3
4
E
Digit
PKG Information
Code
Specification
1 2 3
Samsung Chip Scale Package
SCP
4
CRI
7
CRI 70
8
CRI 80
9
CRI 90
5
CCT(K)
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
6
Chip Shape
T
Square type
7 8 9
Product
F1H
Chip version
10 11 12
Product Purpose
EL1
FEC for lighting
13
CCT (K)
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
14
MacAdam Step
K
Full Bin for MacAdam 5-Step
U
Full Bin for MacAdam 3-Step
15 16
Luminous Flux
F 3
90- 120
F1
90-100
G 3
100- 130
G1
100-110
F3
H 3
110- 140
H1
110- 120
G3
J 3
120- 150
J1
120- 130
H3
K 3
130~160
K1
130~140
J 3
M 3
140~170
M1
140~150
K 3
N 3
150~180
N1
150~160
M 3
P 3
160~190
P1
160~170
N 3
Q 3
170~200
Q1
170~180
P 3
Q 3
Digit 15: Min. spec
Digit 16: The number of higher bin(s) from min. spec.
e.g.: K1 = 130~140 lm, K3 = 130~160 lm
17 18
Forward Voltage (Vf)
4 E
2.7 ~ 3.1 V
7
a) Luminous Flux Bins (IF = 350 mA, Ts = 85 ºC)
CRI/
Nominal CCT (K)
Flux rank
E1
F1
G1
H1
J1
K1
M1
N1
P1
Q1
R1
S1
(min. flux)
80
90
100
110
120
130
140
150
160
170
180
190
70
2700
SCP7WTF1HEL1W
◇
M34E
3000
SCP7VTF1HEL1V
◇
N34E
3500
SCP7UTF1HEL1U
◇
N34E
4000
SCP7TTF1HEL1T
◇
P34E
5000
SCP7RTF1HEL1R
◇
P34E
5700
SCP7QTF1HEL1Q
◇
P34E
6500
SCP7PTF1HEL1P
◇
N34E
80
2700
SCP8WTF1HEL1W
◇
K34E
3000
SCP8VTF1HEL1V
◇
K34E
3500
SCP8UTF1HEL1U
◇
M34E
4000
SCP8TTF1HEL1T
◇
M34E
5000
SCP8RTF1HEL1R
◇
N34E
5700
SCP8QTF1HEL1Q
◇
N34E
6500
SCP8PTF1HEL1P
◇
M34E
90
2700
SCP9WTF1HEL1W
◇
G34E
3000
SCP9VTF1HEL1V
◇
G34E
3500
SCP9UTF1HEL1U
◇
H34E
4000
SCP9TTF1HEL1T
◇
H34E
5000
SCP9RTF1HEL1R
◇
H34E
Notes:
1) ◇ : MacAdam step code, K(MacAdam 5-step) / U(MacAdam 3-step)
8
b) Color Bins (IF = 350 mA, Ts= 85 ºC)
Nominal CCT (K)
CRI (Ra)
Color Rank
Chromaticity Bins
2700, 3000, 3500, 4000,
5000, 5700, 6500
70
K
(Full Bin for MacAdam 5-step)
U
(Full Bin for MacAdam 3-step)
☆K
☆U
2700, 3000, 3500, 4000,
5000, 5700, 6500
80
2700, 3000, 3500,4000,5000
90
Notes:
1) ☆ : Nominal CCT code, W(2700K)/V(3000K)/U(3500K)/T(4000K)/R(5000K)/Q(5700K)/P(6500K)
c) Voltage Bins (IF = 350 mA, Ts = 85 ºC)
CRI (Ra)
Nominal CCT
(K)
Product Code
Voltage Rank
Voltage Bin
Voltage Range
(V)
4E
4E
2.7 ~ 3.1
9
d) Chromaticity Region & Coordinates (IF = 350 mA, Ts = 85 ºC)
10
e) Chromaticity Region & Coordinates (IF = 350 mA, Ts = 85 ºC)
MacAdam
CCT
(K)
Center point
Major-axis
Minor-axis
Rotation
CIE x
CIE y
a
b
Φ
3 step
2700
0.4578
0.4101
0.0081
0.0042
53.70
3000
0.4338
0.4030
0.0083
0.0041
53.22
3500
0.4073
0.3917
0.0093
0.0041
54.00
4000
0.3818
0.3797
0.0094
0.0040
53.72
5000
0.3447
0.3553
0.0082
0.0035
59.62
5700
0.3287
0.3417
0.0075
0.0032
59.10
6500
0.3123
0.3282
0.0067
0.0029
58.57
5 step
2700
0.4578
0.4101
0.0135
0.0070
53.70
3000
0.4338
0.4030
0.0138
0.0068
53.22
3500
0.4073
0.3917
0.0155
0.0068
54.00
4000
0.3818
0.3797
0.0157
0.0067
53.72
5000
0.3447
0.3553
0.0137
0.0058
59.62
5700
0.3287
0.3417
0.0125
0.0053
59.10
6500
0.3123
0.3282
0.0112
0.0048
58.57
Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
11
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 350 mA, Ts = 85 ºC)
3000K/CRI70 5000K/CRI70
b) Forward Current Characteristics (Ts = 85 ºC)
c) Temperature Characteristics (IF = 350 mA)
12
d) Color Shift Characteristics (IF = 350 mA, Ts = 85 ºC)
e) Derating Curve and Beam Angle Characteristics (IF = 350 mA, Ts = 25 ºC)
13
4. Outline Drawing & Dimension
Precautions:
1) Pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid strong pressure on
the LEDs. Do not put stress on the LEDs during heating.
2) Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics
should be carefully checked before and after such repair.
3) Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED
might cause catastrophic failure of the LEDs.
Measurement unit: mm
Tolerance: ±0.13 mm
14
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test
Hour / Cycle
Room Temperature
Life Test
25 ºC, Derated maximum current
1000 h
High Temperature
Life Test
85 ºC, Derating maximum current
1000 h
High Temperature
Humidity Life Test
60 ºC, 90% RH, Derating maximum current
1000 h
Low Temperature
Life Test
-40 ºC, Derating maximum current
1000 h
Temperature
Humidity Cycle Test
-10℃↔25℃/Dry, 25℃ ↔ 65℃ 95% R.H.
Derating maximum current
10 cycles
Powered Temperature
Cycle Test
-40 ºC / 85 ºC each 20 min, 100 min transfer
power on/off each 5 min, Derating maximum current
100 cycles
Thermal Shock
-45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change within 5 min
500 cycles
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
ESD (HBM)
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R1: 10 MΩ
R2: 0
C: 200 pF
V: ±0.2 kV
5 times
Vibration Test
20~2000~20 Hz, 200 m/s2, sweep 4 min
X, Y, Z 3 direction, each 1 cycle
4 cycles
Mechanical Shock Test
1500 g, 0.5 ms
3 shocks each X-Y-Z axis
5 cycles
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Ts = 25 ºC)
Limit
Min.
Max.
Forward Voltage
VF
IF = 350 mA
Init. Value * 0.9
Init. Value * 1.1
Luminous Flux
Φv
IF = 350 mA
Init. Value * 0.7
Init. Value * 1.1
15
6. Soldering Conditions
a) Reflow Conditions (Pb free)
Reflow frequency: 2 times max.
b) Manual Soldering Conditions
No more than 5 seconds @ max. 300 ºC, under soldering iron.
16
7. Tape & Reel
a) Taping Dimension
- +
17
b) Reel Dimension
(unit: mm)
Notes:
1) Quantity: 2,000 Qty/reel
2) Cumulative tolerance: Cumulative tolerance / 10 pitches is ±0.2 mm
3) Adhesion strength of cover tape: Adhesion strength is 0.1-0.7 N when the cover tape is turned off from the carrier tape at
10° angle to the carrier tape
4) Packaging: P/N, Manufacturing data code no. and quantity are indicated on the aluminum packing bag
18
Rank Code
Lot Number
Product Code
ⓐⓑⓒⓓⓔⓕ
SCP8UTF1HEL1UUM34E ⓐⓑⓒⓓⓔⓕ
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
T1H2C00NB / 1001 / X,XXX pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
LED Qty
Model
8. Label Structure
a) Label Structure
Note: Denoted Bin ID and product code above is only an example
Rank Code:
ⓐⓑ: Chromaticity bin (refer to page 6)
ⓒⓓ: Luminous Flux bin (refer to page 6,7)
ⓔⓕ: Voltage bin (refer to page 6,9)
b) Lot Number
The lot number is composed of the following characters:
①
: T (T: Taping ID)
②
: 1 (1: LED Manufacture Line)
③
: Year (G:2016, H: 2017, …)
④
: Month (1, 2, … , 7: July, … , A: Oct., B: Nov., C: Dec.)
⑤
: Day (1~9, A: 10, … , K: 20, … , U: 30, V:31)
⑥⑦⑧⑨
: Product serial number (0001 ~ 9999)
UUN14E
SCP8UTF1HEL1UUM34E UUN14E
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨ / 1001 / X,XXX pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
LH181B [CRI] [CCT]
LH181B [CRI] [CCT]
19
UUN14E
SCP8UTF1HEL1UUM34E UUN14E
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
T1H2C00NB / 1001 / X,XXX pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
UUN14E
SCP8UTF1HEL1UUM34E UUN14E
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
T1H2C00NB / 1001 / X,XXX pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
UUN14E
SCP8UTF1HEL1UUM34E UUN14E
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
T1H2C00NB / 1001 / X,XXX pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
9. Packing Structure
a) Packing Process
Material: Paper SW(B)
Type
Size (mm)
Note
(a)
(b)
(c)
7 inch
245 ± 5
220 ± 5
182 ± 5
Up to 7 reels
Reel
Outer Box
Aluminum Vinyl Packing Bag
LH181B [CRI] [CCT]
LH181B [CRI] [CCT]
LH181B [CRI] [CCT]
20
b) Aluminum Vinyl Packing Bag
c) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Bag
UUN14E
SCP8UTF1HEL1UKM34E UUN14E
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
T1H2C00NB / 1001 / X,XXX pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
LH181B [CRI] [CCT]
21
10. Precautions in Handling & Use
1) For over-current protection, users are recommended to apply resistors connected in series with the LEDs to mitigate
sudden change of the forward current caused by shift of forward voltage.
2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient
temperature and corresponding junction temperature.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
5) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
6) Repack unused devices with anti-moisture packing, fold to close any opening and then store in a dry place.
7) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
8) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
Legal and additional information.
About Samsung Electronics Co., Ltd.
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ideas and technologies. The company is redefining the worlds of TVs, smartphones,
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http://news.samsung.com.
Copyright © 2018 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand, product,
service names and logos are trademarks and/or registered trademarks of their
respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
1, Samsung-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 17113
KOREA
www.samsungled.com
