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DS-IXD_604SI_SIA-R01 www.ixysic.com 1
e3
Pb
Features
•AEC Q100 Qualified
•4A Peak Source/Sink Drive Current
•Wide Operating Voltage Range: 4.5V to 35V
•AEC Q100 Grade 1 -40°C to +125°C Operating
Temperature Range
•Logic Input Withstands Negative Swing of up to 5V
•Outputs May be Connected in Parallel for Higher
Drive Current
•Matched Rise and Fall Times
•Low Propagation Delay Time
•Low, 10A Supply Current
•Low Output Impedance
Features
•Automotive DC/DC regulators
•Electronic Power Steering
•Electric Vehicle Power Train Drives
•Brushless DC motors
Description
The IXD_604SI and IXD_604SIA are automotive
grade, dual high-speed gate drivers that are qualified
according to AEC Q100 standards. Each of the two
outputs can source and sink 4A of peak current, while
producing rise and fall times of less than 10ns. The
outputs and inputs are rated to 35V. The input of each
driver is virtually immune to latch-up, and proprietary
circuitry eliminates cross-conduction and
"shoot-through." The IXD_604 has a Grade 1, -40°C
to +125°C ambient operating temperature range.
The IXDD604 is a dual non-inverting driver with an
enable. The IXDN604 is a dual non-inverting driver,
the IXDI604 is a dual inverting driver, and the IXDF604
has one inverting driver and one non-inverting driver.
The AEC Q100 qualified IXD_604SIA is available in a
standard 8-pin SOIC package, and the IXD_604SI is
available in an 8-pin Power SOIC package with an
exposed metal back.
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD604SIA 8-Pin SOIC Tube 100
IXDD604SIATR 8-Pin SOIC Tape & Reel 2000
IXDF604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDF604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDF604SIA 8-Pin SOIC Tube 100
IXDF604SIATR 8-Pin SOIC Tape & Reel 2000
IXDI604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI604SIA 8-Pin SOIC Tube 100
IXDI604SIATR 8-Pin SOIC Tape & Reel 2000
IXDN604SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN604SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN604SIA 8-Pin SOIC Tube 100
IXDN604SIATR 8-Pin SOIC Tape & Reel 2000
ENA
INA
ENB
INB
OUTA
OUTB
A
B
INA
INB
A
B
OUTA
OUTB
INA
INB
A
B
OUTA
OUTB
INA
INB
OUTA
OUTB
A
B
IXD_604SI & SIA
Automotive Grade
4-Ampere, Dual Low-Side, Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
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1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: -40°C < TA < +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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IXD_604SI & SIA
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1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
1.3 Absolute Maximum Ratings
Absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
IXDD604SI/SIA
ENA
INA
GND
INB
ENB
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDF604SI/SIA
NC
INA
GND
INB
NC
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDI604SI/SIA
NC
INA
GND
INB
NC
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
IXDN604SI/SIA
NC
INA
GND
INB
NC
OUTA
V
CC
OUTB
1
4
3
2
8
5
6
7
A
B
Pin Name Description
INA Channel A Logic Input
INB Channel B Logic Input
ENA
Channel A Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
ENB
Channel B Enable Input -
Drive pin low to disable Channel A and force
Channel A Output to a high impedance state
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage VINx , VENx -5 VCC+0.3 V
Output Current IOUT -±4A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Range Units
Supply Voltage VCC 4.5 to 35 V
Operating Temperature Range T
A-40 to +125 °C
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IXD_604SI & SIA
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
1.6 Electrical Characteristics: -40°C < TA < +125°C
Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V
Input Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
High EN Input Voltage IXDD604 only VENH 2/3VCC --
V
Low EN Input Voltage IXDD604 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -1.32.5
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -1.12
Output Current, Continuous Limited by package power
dissipation IDC --±1A
Rise Time VCC=18V, CLOAD=1000pF tr-916
ns
Fall Time VCC=18V, CLOAD=1000pF tf-814
On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly -2950
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly -3550
Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH -3555
Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD -4055
Enable Pull-Up Resistor - REN -200-k
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-13mA
VCC=18V, VIN=0V -<110
A
VCC=18V, VIN=VCC -<110
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.1 - V
Input Voltage, Low 4.5V < VCC < 18V VIL -0.65
Input Current 0V < VIN < VCC IIN -10 10 A
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL -0.025
Output Resistance, High State VCC=18V, IOUT=-10mA ROH -3
Output Resistance, Low State VCC=18V, IOUT=10mA ROL -2.5
Output Current, Continuous Limited by package power
dissipation IDC -±1A
Rise Time VCC=18V, CLOAD=1000pF tr-16
ns
Fall Time VCC=18V, CLOAD=1000pF tf-14
On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly -65
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly -65
Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH -65
Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD -65
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-3.5mA
VCC=18V, VIN=0V -150
A
VCC=18V, VIN=VCC -150
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1.7 Thermal Characteristics
2 IXD_604 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Ambient JA
85
°C/W
SIA (8-Pin SOIC) 120
SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Case JC 10
10%
90%
t
ondly
t
offdly
t
f
t
r
V
IH
V
IL
INx
OUTx
ENA
ENB
INAOUTA
GND
VCC
INB
VCC
+
-
VIN
0.1μF10μF
OUTB
CLOAD
Tektronix
Current Probe
6302
Tektronix
Current Probe
6302
CLOAD
VCC
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3 Block Diagrams & Truth Tables
3.1 IXDD604
3.2 IXDI604
3.3 IXDF604
3.4 IXDN604
INXENXOUTX
0 1 or open 0
1 1 or open 1
00
Z
10
Z
INXOUTX
01
10
200kΩ
ENA
INA
GND
INB
ENB
OUTA
V
CC
OUTB
V
CC
V
CC
IXDD604
200kΩ
V
CC
INA
GND
INB
OUTA
VCC
OUTB
VCC
IXDI604
INA OUTA
01
10
INB OUTB
00
11
INXOUTX
00
11
INA
GND
INB
OUTA
V
CC
OUTB
V
CC
IXDF604
INA
GND
INB
OUTA
VCC
OUTB
VCC
IXDN604
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4 Typical Performance Characteristics
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Rise Time (ns)
0
20
40
60
80
100
120
A&B Rise Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Fall Time (ns)
0
20
40
60
80
100
120
A&B Fall Times vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Rise & Fall Times (ns)
4
5
6
7
8
9
10
A&B Rise and Fall Times
vs. Temperature
(Input=0-5V, VCC=18V, CL=1nF)
t
r
t
f
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Rise Time (ns)
0
20
40
60
80
100
120
A&B Rise Time vs. Load Capacitance
at Various VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Fall Time (ns)
0
20
40
60
80
100
120
A&B Fall Time vs. Load Capacitance
at Various VCC Levels
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=24V
VCC=35V
Supply Voltage (V)
0 5 10 15 20 25 30 35
Propagation Delay (ns)
20
40
60
80
100
120
140
160
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
toffdly
tondly
Input Voltage (V)
246810 12
Propagation Delay (ns)
20
30
40
50
60
70
Propagation Delay vs. Input Voltage
(VCC=15V, CL=1nF)
tondly
toffdly
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Propagation Delay (ns)
20
25
30
35
40
45
50
Propagation Delay vs. Temperature
t
offdly
t
ondly
Temperature (ºC)
-40 -20 0 20 40 60 80100120140
Input Threshold Voltage (V)
1.7
1.9
2.1
2.3
2.5
2.7
2.9
Input Threshold Voltage
vs. Temperature
(V
CC
=18V, C
L
=1nF)
Min VIH
Max VIL
Supply Voltage (V)
0 5 10 15 20 25 30 35
Input Threshold (V)
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
Input Threshold vs. Supply Voltage
V
IH
V
IL
Supply Voltage (V)
0 5 10 15 20 25 30 35
Enable Threshold (V)
0
2
4
6
8
10
12
14
16
18
20
22
Enable Threshold vs. Supply Voltage
V
ENH
V
ENL
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IXD_604SI & SIA
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(V
CC
=18V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=2MHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(V
CC
=35V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
CL=10nF
CL=1nF
CL=470pF
Frequency (kHz)
1 10 100 1000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(V
CC=12V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(V
CC
=8V)
C
L
=10nF
C
L
=1nF
C
L
=470pF
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Quiesent Supply Current
vs. Temperature
(V
CC
=18V)
V
IN
=3.5V
V
IN
=5V
V
IN
=10V
V
IN
=0V & 18V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Dynamic Supply Current
vs. Temperature
(VCC=18V, VIN=5V, f=1khz, CL=1nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Source Current (A)
0
-2
-4
-6
-8
-10
Output Source Current
vs. Supply Voltage
(CL=10nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Sink Current (A)
0
2
4
6
8
10
Output Sink Current
vs. Supply Voltage
(CL=10nF)
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Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Source Current (A)
2
3
4
5
6
Output Source Current
vs. Temperature
(VCC=18V, CL=10nF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Sink Current (A)
2.0
3.0
4.0
5.0
6.0
Output Sink Current
vs. Temperature
(VCC=18V, CL=10nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Resistance (Ω)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
High State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Resistance (Ω)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Low State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
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IXD_604SI & SIA
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating of 1, and should be handled according to the
requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating of 260°C for 30 seconds. All other guidelines of
J-STD-020 must be observed.
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INTEGRATED CIRCUITS DIVISION
IXD_604SI & SIA
R01 www.ixysic.com 11
5.4 Mechanical Dimensions
5.4.1 SIA Package (8-Pin SOIC)
5.4.2 SI Package (8-Pin Power SOIC with Exposed Metal Back)
Note: The exposed metal pad on the back of the SI package should be connected to GND. It is not suitable for
carrying current.
Dimensions
mm
(inches)
PCB Land Pattern
Pin 1
Pin 8
3.937 ± 0.254
(0.155 ± 0.010)
5.994 ± 0.254
(0.236 ± 0.010)
0.406 ± 0.076
(0.016 ± 0.003)
4.928 ± 0.254
(0.194 ± 0.010)
1.270 REF
(0.050)
1.346 ± 0.076
(0.053 ± 0.003)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
0.559 ± 0.254
(0.022 ± 0.010)
0.762 ± 0.254
(0.030 ± 0.010)
1.27
(0.050)
5.40
(0.213)
1.55
(0.061)
0.60
(0.024)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
1.346 ± 0.076
(0.053 ± 0.003)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
4.928 ± 0.254
(0.194 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
1.270 REF
(0.050)
0.762 ± 0.254
(0.030 ± 0.010)
7º
2.540 ± 0.254
(0.100 ± 0.010)
3.556 ± 0.254
(0.140 ±0.010)
1.27
(0.050)
5.40
(0.209)
1.55
(0.061)
0.60
(0.024)
2.75
(0.108)
3.80
(0.150)
INTEGRATED CIRCUITS DIVISION
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IXD_604SI & SIA
5.4.3 Tape & Reel Information for SI and SIA Packages
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256)
P=8.00
(0.315)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_604SI_SIA-R01
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/5/2013