New High Density SMT B2B TM Board to Board Connectors Superior Features Designed-In For Long Term Reliability and Robust Handling Shrouded Design - protects exposed male pins during handling and provides positive polarization to aid in blind mating applications Low Inductance - unique terminal design allows short signal path Maximizes PCB Real Estate - low stack height, high I/O density and compact insulator design conserve valuable PCB space SMT Process Compatible - high temperature insulator material (PPS) and eutectic solder balls conform to existing SMT processes. Solder balls compensate for board coplanarity and solder paste deposition variances. 5 Energy Way West Warwick, RI 02893 USA Tel: 800-424-9850 or 401-823-5200 Fax: 401-823-8723 Web site: www.advintcorp.com E-mail: info@advintcorp.com B2B High Density SMT TM Features * High density - over 400 contacts per square inch Industry's Most Durable, High Density SMT Connectors for Board to Board Applications Time Proven Interconnect Technology * Five standard mated heights: .197/(5mm) .236/(6mm) .315/(8mm) .500/(12.70mm) .750/(19.05mm)* * Field proven pin-in-contact design, featuring Advanced(R) exclusive eutectic solder ball terminals - preferred by leading OEMs for high process yields * Gold plated, multi-fingered, high reliability Beryllium Copper contacts provide gold/gold interconnect * Screw-machined terminals for long-term, durable performance * Three standard footprints: 240, 300 and 400 positions * .050/(1.27mm) pitch * Industry standard .030 diameter solder balls conform to industry standard BGA pad-to-ball ratios Standard Footprints * Thru-hole models available Material Specifications Insulator: Molded PPS (High Temp. Glass Filled Thermoplastic), U.L. Rated 94V-0, -60C to 260C (-76F to 500F) Terminals: Brass; Copper Alloy (C36000), ASTM-B-16 Contacts: Beryllium Copper Alloy (C17200), ASTM-B-194 Plating: Gold over Nickel Standard 240 position (30 X 8 rows) .050/(1.27) Typ. Standard 300 position (30 X 10 rows) .050/(1.27) Typ. .050/(1.27) Typ. Standard 400 position (40 X 10 rows) Solder Ball: 63Sn/37Pb, Eutectic, 183C (361.4F) Dielectric Constant (78F): 4.0 at 1kHz; 3.9 at 1MHz .050/(1.27) Typ. Consult factory for custom sizes available up to 42 by 12 rows (504 positions, full grid), including 140, 160, 180 and other common PCB I/Os. .050/(1.27) Typ. .050/(1.27) Typ. How To Order (Order Male and Female Connectors separately) BA XXX - XXX G G -TR Custom Capabilities Integral Hold-Down Design* Packaging Options** TR - Tape and reel (includes tape or cap as applicable) 3M - Kapton tape, no reel (order with BB only) VC - Vacuum pick-up cap, no reel (order with BA or BT only) B2BTM Connector BA = Male (standard terminal) BT = Male (Pop-Top(R) terminal) BB = Female Connector Number of Positions 240, 300, 400 standard (Consult factory for custom) PCB SMT Terminal Type (see below) Male - Standard (BA) Male - Pop-Top(R) (BT) - 740 for B2B mated ht. of .197/(5.00) - 744 for B2B mated ht. of .197/(5.00) - 741 for B2B mated ht. of .236/(6.00) - 745 for B2B mated ht. of .236/(6.00) - 742 for B2B mated ht. of .315/(8.00) - 746 for B2B mated ht. of .315/(8.00) - 743 for B2B mated ht. of .500/(12.70) - 747 for B2B mated ht. of .500/(12.70) - 748 for B2B mated ht. of .750/(19.05)* - 749 for B2B mated ht. of .750/(19.05)* Female (BB) [mates with standard or Pop-Top terminal] - 738 for B2B mated height of .197/(5.00) - 636 for B2B mated height of .236/(6.00) - 739 for B2B mated height of .315/(8.00), .500/(12.70), or .750/(19.05)* PCB Extraction tools available if needed. *Consult Factory. 2 Contact Plating (BB only) G - Gold Terminal Plating G - Gold (c)2001, Advanced Interconnections Corp. , West Warwick, RI USA, Tel: 401-823-5200 REV. 1/01 **If no packaging code is indicated, parts are supplied in standard trays without kapton tape. Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm). Board To Board Connectors Standard B2BTM Models Terminal Options Pop-Top(R) Terminal Style Male Connector Patented limited insertion depth terminal for ultra-low insertion and extraction force (see fig. below) A Travel B A B Optional Pick-up Cap Shown (2.0mm larger than A and B dimensions) Eutectic Solder Ball C 1. "Zero" Insertion to point A 2. After travel & lock down to point B * Requires external hold-down fastener (see example below) PCB Female Connector A PCB PCB B Board To Board Mated Height PCB D Consult Factory for additional mated heights not listed. Eutectic Solder Ball A in./(mm) B in./(mm) C in./(mm) D in./(mm) 240 Position .197/(5.00) .236/(6.00) .315/(8.00) .500/(12.70) .750/(19.05)* 1.665/(42.29) 1.665/(42.29) 1.665/(42.29) 1.665/(42.29) 1.665/(42.29) .583(14.81) .583(14.81) .583(14.81) .583(14.81) .583(14.81) .157/(3.99) .196/(4.98) .273/(6.93) .460/(11.68) .710/(18.03)* .095/(2.41) .117/(2.97) .211/(5.36) .211/(5.36) .211/(5.36) 300 Position .197/(5.00) .236/(6.00) .315/(8.00) .500/(12.70) .750/(19.05)* 1.665/(42.29) 1.665/(42.29) 1.665/(42.29) 1.665/(42.29) 1.665/(42.29) .683/(17.35) .683/(17.35) .683/(17.35) .683/(17.35) .683/(17.35) .157/(3.99) .196/(4.98) .273/(6.93) .460/(11.68) .710/(18.03)* .095/(2.41) .117/(2.97) .211/(5.36) .211/(5.36) .211/(5.36) 400 Position Mated Board to Board Height .197/(5.00) .236/(6.00) .315/(8.00) .500/(12.70) .750/(19.05)* 2.165/(55.00) 2.165/(55.00) 2.165/(55.00) 2.165/(55.00) 2.165/(55.00) .683/(17.35) .683/(17.35) .683/(17.35) .683/(17.35) .683/(17.35) .157/(3.99) .196/(4.98) .273/(6.93) .460/(11.68) .710/(18.03)* .095/(2.41) .117/(2.97) .211/(5.36) .211/(5.36) .211/(5.36) Approximate dimension after soldering. Self-retaining after assembly * No external hold-down fastener required * Thru-hole options available Packaging Options Standard Packaging Standard Model Dimensions Standard Terminal Style If no packaging code is indicated, parts are supplied in standard trays without kapton tape Tape and Reel Packaging * Add packaging code -TR to end of Part Number * Female connectors supplied with kapton pick-up tape * Male connectors supplied with vacuum pick-up cap * Consult factory for complete ordering details See How To Order section for additional packaging options. Dimensions do not include solder ball height. *Consult Factory. (c)2001, Advanced Interconnections Corp. , West Warwick, RI USA, Tel: 401-823-5200 REV. 1/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm). 3 Test Results for Low Force Contacts Test Results for RF Characterization (P/N 1427-1G) - Test Report No. 92351A Durability 50 cycles at rate: 1 inch per min., followed by Low Level Resistance Test. .75 inch Mated Height - Test Report No. 99620 (Results will vary for different mated heights) Impedance 3.1 m Ohm Average, +0.1 m Ohm average change Vibration MIL-STD 1344, Method 2005 Test, Condition III, 15 G's followed by Low Level Resistance Test. 2.8 m Ohm Average, -0.0 m Ohm average change Frequency (MHz) 100 250 500 1000 Results (Avg. ) 51.3 52.9 57.9 68.0 Frequency (MHz) 100 250 500 1000 Results (Avg. dB) 1.0 1.2 1.4 1.9 VSWR Gas Tight Exposed in a sealed container to concentrated Nitric Acid (NHO3) followed by Low Level Resistance Test. 3.4 m Ohm Average, +0.5 m Ohm average change Moisture Resistance Temperature cycling with humidity MIL-STD 1344, Method 1002, Type II, followed by Low Level Resistance Test. 3.4 m Ohm Average, +0.7 m Ohm average change Near End Crosstalk (NEXT) Frequency (MHz) -- 100 250 500 1000 Shock MIL-STD 1344, Method 2004, Test Condition A. No mechanical damage or loss of continuity Thermal Cycle MIL-STD 1344, Method 1003, Test Condition A. 3.4 m Ohm Average, +0.7 m Ohm average change Results (Avg. dB) G-S-S-G S-G-S 55.3 72.2 35.5 53.0 21.1 49.2 20.9 24.0 Attenuation Frequency (MHz) 100 250 500 1000 Temperature Life MIL-STD 1344, Method 1005, Test Condition 2. 3.8 m Ohm Average, +0.8 m Ohm average change Porosity MIL-STD 1344, Method 1017 No porosity Results (Avg. dB) 0.1 0.2 0.4 1.0 Propogation Delay Results (Avg. pS) 109 Contact Resistance MIL-STD 1344, Method 3002, measured using 100m amp test current. 3.0 m Ohm average Capacitance Frequency (MHz) 100 250 500 1000 Contact Force (Standard Terminal) Initial insertion force: 28.5g average (1.0 oz. average) Initial withdrawal force: 18.5g average (0.7 oz. average) Dielectric Withstanding Voltage 600 Volts Results (Avg. pF) 1.4 1.5 1.5 1.4 Loop Inductance Generic Reflow Profile Frequency (MHz) 100 250 500 1000 [63Sn/37Pb Solder Liquidus @ 183C (361F)] PEAK Normally the peak temperature is 20-30C above the alloy's liquidus, and the time at temperature ranged Temperature Rise (C above ambient) 210C Current Level 1.0 2.0 3.0 175C 145C Results (Avg. nH) 6.7 6.7 6.8 7.2 RAMP UP Rate depends on PCB and components 115C COOL DOWN Determine the fastest allowable cool down rate as determined by your PCB and components Rise 4.1 13.6 29.1 Low Level Circuit Resistance (Milliohms) Avg. 9.4 85C Max. 9.5 Min. 9.1 30C 0 TIME IN MINUTES 5 Energy Way West Warwick, RI 02893 USA Tel: 800-424-9850 or 401-823-5200 Fax: 401-823-8723 Web site: www.advintcorp.com E-mail: info@advintcorp.com (c)2001 Advanced Interconnections Corp. Printed in USA Item Number B2B-TECH01 Rev. 1/01 Covered by Patents issued and/or pending in the U.S. and Internationally. Dimensions and specifications are subject to change without notice - contact factory for current specifications and additional options prior to ordering.