New High Density SMT
B2B™
Board to Board
Connectors
Superior Features Designed-In
For Long Term Reliability and
Robust Handling
Shrouded Design – protects exposed male pins
during handling and provides positive polariza-
tion to aid in blind mating applications
Low Inductance – unique terminal design allows
short signal path
Maximizes PCB Real Estate – low stack height,
high I/O density and compact insulator design
conserve valuable PCB space
SMT Process Compatible – high temperature
insulator material (PPS) and eutectic solder
balls conform to existing SMT processes.
Solder balls compensate for board coplanarity
and solder paste deposition variances.
5 Energy Way ■ West Warwick, RI 02893 USA
Tel: 800-424-9850 or 401-823-5200 ■ Fax: 401-823-8723
Web site: www.advintcorp.com ■ E-mail: info@advintcorp.com
B2B™ High Density SMT
Features
• High density – over 400 contacts
per square inch
• Five standard mated heights:
.197/(5mm) .236/(6mm)
.315/(8mm) .500/(12.70mm)
.750/(19.05mm)*
• Three standard footprints:
240, 300 and 400 positions
• .050/(1.27mm) pitch
• Industry standard .030 diameter
solder balls conform to industry
standard BGA pad-to-ball ratios
• Thru-hole models available
Material Specifications
Insulator: Molded PPS (High Temp.
Glass Filled Thermoplastic),
U.L. Rated 94V-0, -60°C to
260°C (-76°F to 500°F)
Terminals: Brass; Copper Alloy
(C36000), ASTM-B-16
Contacts: Beryllium Copper Alloy
(C17200), ASTM-B-194
Plating: Gold over Nickel
Solder Ball: 63Sn/37Pb, Eutectic,
183°C (361.4°F)
Dielectric Constant (78°F):
4.0 at 1kHz; 3.9 at 1MHz
Custom Capabilities
Integral Hold-Down Design*
Standard Footprints
How To Order (Order Male and Female Connectors separately)
Industry’s Most Durable, High Density
SMT Connectors for Board to Board Applications
Time Proven Interconnect Technology
• Field proven pin-in-contact design, featuring
Advanced® exclusive eutectic solder ball terminals –
preferred by leading OEMs for high process yields
• Gold plated, multi-fingered, high reliability Beryllium
Copper contacts provide gold/gold interconnect
• Screw-machined terminals for long-term, durable
performance
.050/(1.27) Typ.
.050/(1.27)
Typ.
.050/(1.27) Typ.
.050/(1.27)
Typ.
.050/(1.27) Typ.
.050/(1.27)
Typ.
Standard
240 position
(30 X 8 rows)
Standard
300 position
(30 X 10 rows)
Standard
400 position
(40 X 10 rows)
2 ©2001, Advanced Interconnections Corp. , West Warwick, RI USA, Tel: 401-823-5200 REV. 1/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).
Number of Positions
240, 300, 400 standard
(Consult factory for custom)
BA XXX - XXX G G -TR
B2B™ Connector
BA = Male (standard terminal)
BT = Male (Pop-Top® terminal)
BB = Female Connector
Terminal Plating
G - Gold
Contact Plating (BB only)
G - Gold
Packaging Options**
TR - Tape and reel (includes tape or cap as applicable)
3M - Kapton tape, no reel (order with BB only)
VC - Vacuum pick-up cap, no reel (order with BA or BT only)
Male – Standard (BA)
– 740 for B2B mated ht. of .197/(5.00)
– 741 for B2B mated ht. of .236/(6.00)
– 742 for B2B mated ht. of .315/(8.00)
– 743 for B2B mated ht. of .500/(12.70)
– 748 for B2B mated ht. of .750/(19.05)*
Male – Pop-Top® (BT)
– 744 for B2B mated ht. of .197/(5.00)
– 745 for B2B mated ht. of .236/(6.00)
– 746 for B2B mated ht. of .315/(8.00)
– 747 for B2B mated ht. of .500/(12.70)
– 749 for B2B mated ht. of .750/(19.05)*
Female (BB) [mates with standard or Pop-Top terminal]
– 738 for B2B mated height of .197/(5.00)
– 636 for B2B mated height of .236/(6.00)
– 739 for B2B mated height of .315/(8.00), .500/(12.70), or .750/(19.05)*
SMT Terminal Type (see below)
Extraction tools available if needed. *Consult Factory. **If no packaging code is indicated, parts are supplied in standard trays without kapton tape.
Consult factory for
custom sizes available
up to 42 by 12 rows
(504 positions, full
grid), including 140,
160, 180 and other
common PCB I/Os.
PCB
PCB
Board To Board Connectors
Standard B2B™ Models
Male Connector
Female Connector
Standard Model Dimensions
Terminal Options
Pop-Top® Terminal Style
Patented limited insertion depth
terminal for ultra-low insertion and
extraction force (see fig. below)
• Requires external hold-down
fastener (see example below)
Standard Terminal Style
Self-retaining after assembly
• No external hold-down fastener
required
• Thru-hole options available
Packaging Options
Standard Packaging
If no packaging code is indicated,
parts are supplied in standard trays
without kapton tape
Tape and Reel Packaging
• Add packaging code -TR to end
of Part Number
• Female
connectors
supplied with
kapton
pick-up tape
• Male connectors supplied
with vacuum pick-up cap
• Consult factory for complete
ordering details
See How To Order section for
additional packaging options.
A
B
D
Eutectic Solder Ball
A
B
C
Optional Pick-up
Cap Shown
(2.0mm larger
than A and B
dimensions)
Eutectic Solder Ball
©2001, Advanced Interconnections Corp. , West Warwick, RI USA, Tel: 401-823-5200 REV. 1/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm). 3
2. After travel & lock down
to point B
B
1. "Zero" Insertion
to point A
A
Travel
✝ Approximate dimension after soldering. ▲Dimensions do not include solder ball height. *Consult Factory.
400 Position 300 Position 240 Position
Mated Board to A B C▲D▲
Board Height✝in./(mm) in./(mm) in./(mm) in./(mm)
.197/(5.00) 1.665/(42.29) .583(14.81) .157/(3.99) .095/(2.41)
.236/(6.00) 1.665/(42.29) .583(14.81) .196/(4.98) .117/(2.97)
.315/(8.00) 1.665/(42.29) .583(14.81) .273/(6.93) .211/(5.36)
.500/(12.70) 1.665/(42.29) .583(14.81) .460/(11.68) .211/(5.36)
.750/(19.05)* 1.665/(42.29) .583(14.81) .710/(18.03)* .211/(5.36)
.197/(5.00) 1.665/(42.29) .683/(17.35) .157/(3.99) .095/(2.41)
.236/(6.00) 1.665/(42.29) .683/(17.35) .196/(4.98) .117/(2.97)
.315/(8.00) 1.665/(42.29) .683/(17.35) .273/(6.93) .211/(5.36)
.500/(12.70) 1.665/(42.29) .683/(17.35) .460/(11.68) .211/(5.36)
.750/(19.05)* 1.665/(42.29) .683/(17.35) .710/(18.03)* .211/(5.36)
.197/(5.00) 2.165/(55.00) .683/(17.35) .157/(3.99) .095/(2.41)
.236/(6.00) 2.165/(55.00) .683/(17.35) .196/(4.98) .117/(2.97)
.315/(8.00) 2.165/(55.00) .683/(17.35) .273/(6.93) .211/(5.36)
.500/(12.70) 2.165/(55.00) .683/(17.35) .460/(11.68) .211/(5.36)
.750/(19.05)* 2.165/(55.00) .683/(17.35) .710/(18.03)* .211/(5.36)
Board To
Board
Mated
Height
PCB
PCB
Consult Factory for additional
mated heights not listed.
PCB
PCB
TIME IN MINUTES
210˚C
175˚C
145˚C
115˚C
85˚C
30˚C
0
RAMP UP
Rate depends on
PCB and
components
PEAK
Normally the peak temperature is
20˚-30˚C above the alloy's liquidus,
and the time at temperature ranged
COOL DOWN
Determine the fastest
allowable cool down
rate as determined
by your PCB and
components
©2001 Advanced Interconnections Corp. Printed in USA Item Number B2B-TECH01 Rev. 1/01 Covered by Patents issued and/or pending in the U.S. and Internationally.
Dimensions and specifications are subject to change without notice – contact factory for current specifications and additional options prior to ordering.
5 Energy Way ■ West Warwick, RI 02893 USA ■ Tel: 800-424-9850 or 401-823-5200 ■ Fax: 401-823-8723
Web site: www.advintcorp.com ■ E-mail: info@advintcorp.com
Test Results for Low Force Contacts
(P/N 1427-1G) – Test Report No. 92351A
Durability
50 cycles at rate: 1 inch per min., followed by Low Level Resistance Test.
3.1 m Ohm Average, +0.1 m Ohm average change
Vibration
MIL-STD 1344, Method 2005 Test, Condition III, 15 G’s followed by Low Level
Resistance Test.
2.8 m Ohm Average, -0.0 m Ohm average change
Gas Tight
Exposed in a sealed container to concentrated Nitric Acid (NHO3) followed by
Low Level Resistance Test.
3.4 m Ohm Average, +0.5 m Ohm average change
Moisture Resistance
Temperature cycling with humidity MIL-STD 1344, Method 1002, Type II,
followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.7 m Ohm average change
Shock
MIL-STD 1344, Method 2004, Test Condition A.
No mechanical damage or loss of continuity
Thermal Cycle
MIL-STD 1344, Method 1003, Test Condition A.
3.4 m Ohm Average, +0.7 m Ohm average change
Temperature Life
MIL-STD 1344, Method 1005, Test Condition 2.
3.8 m Ohm Average, +0.8 m Ohm average change
Porosity
MIL-STD 1344, Method 1017
No porosity
Contact Resistance
MIL-STD 1344, Method 3002, measured using 100m amp test current.
3.0 m Ohm average
Contact Force (Standard Terminal)
Initial insertion force: Initial withdrawal force:
28.5g average (1.0 oz. average) 18.5g average (0.7 oz. average)
Dielectric Withstanding Voltage
600 V olts
Generic Reflow Profile
[63Sn/37Pb Solder Liquidus @ 183°C (361°F)]
Test Results for RF Characterization
.75 inch Mated Height – Test Report No. 99620
(Results will vary for different mated heights)
Impedance
Frequency (MHz) Results (Avg. Ω)
100 51.3
250 52.9
500 57.9
1000 68.0
VSWR Frequency (MHz) Results (Avg. dB)
100 1.0
250 1.2
500 1.4
1000 1.9
Near End Crosstalk (NEXT)
Frequency (MHz) Results (Avg. dB)
— G-S-S-G S-G-S
100 55.3 72.2
250 35.5 53.0
500 21.1 49.2
1000 20.9 24.0
Attenuation
Frequency (MHz) Results (Avg. dB)
100 0.1
250 0.2
500 0.4
1000 1.0
Propogation Delay Results (Avg. pS)
109
Capacitance
Frequency (MHz) Results (Avg. pF)
100 1.4
250 1.5
500 1.5
1000 1.4
Loop Inductance
Frequency (MHz) Results (Avg. nH)
100 6.7
250 6.7
500 6.8
1000 7.2
Temperature Rise (°C above ambient)
Current Level Rise
1.0 4.1
2.0 13.6
3.0 29.1
Low Level Circuit Resistance (Milliohms)
Avg. Max. Min.
9.4 9.5 9.1
